Shyh-Ming Chang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Contact structure and forming method thereof and connecting structu...
- Patent number 8,215,969
- Issue date Jul 10, 2012
- Taiwan TFT LCD Association
- Sheng-Shu Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating bonding structure
- Patent number 8,211,788
- Issue date Jul 3, 2012
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,988,808
- Issue date Aug 2, 2011
- Industrial Technology Research Institute
- Su-Tsai Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Contact structure having a compliant bump and a testing area
- Patent number 7,977,788
- Issue date Jul 12, 2011
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of contact structure
- Patent number 7,871,918
- Issue date Jan 18, 2011
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact structure having a compliant bump and a test pad
- Patent number 7,834,453
- Issue date Nov 16, 2010
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for protecting electronic packaging contacts from stress
- Patent number 7,732,928
- Issue date Jun 8, 2010
- Instrument Technology Research Center
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure
- Patent number 7,576,430
- Issue date Aug 18, 2009
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure for electronic device
- Patent number 7,531,900
- Issue date May 12, 2009
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,459,055
- Issue date Dec 2, 2008
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond quality indication by bump structure on substrate
- Patent number 7,449,716
- Issue date Nov 11, 2008
- Taiwan TFT LCD Association
- Ming-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,446,421
- Issue date Nov 4, 2008
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump
- Patent number 7,378,746
- Issue date May 27, 2008
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive bumps with non-conductive juxtapo...
- Patent number 7,348,271
- Issue date Mar 25, 2008
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding IC chips to substrates incorporating dummy bumps...
- Patent number 7,300,865
- Issue date Nov 27, 2007
- Industrial Technology Research Institute
- Yu-Te Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,183,494
- Issue date Feb 27, 2007
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bumps with non-conductive juxtaposed sidewalls
- Patent number 7,154,176
- Issue date Dec 26, 2006
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure with compliant bumps
- Patent number 6,972,490
- Issue date Dec 6, 2005
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding IC chips to substrates incorporating dummy bumps...
- Patent number 6,919,642
- Issue date Jul 19, 2005
- Industrial Technology Research Institute
- Yu-Te Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming electrically conductive bumps and devices formed
- Patent number 6,767,818
- Issue date Jul 27, 2004
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding IC chips to substrates with non-conductive adhesive
- Patent number 6,605,491
- Issue date Aug 12, 2003
- Industrial Technology Research Institute
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding IC chips having multi-layered bumps with corruga...
- Patent number 6,537,854
- Issue date Mar 25, 2003
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump bonding
- Patent number 6,365,500
- Issue date Apr 2, 2002
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump flip chip bonding
- Patent number 6,249,051
- Issue date Jun 19, 2001
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump structures
- Patent number 6,084,301
- Issue date Jul 4, 2000
- Industrial Technology Industrial Research
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for tape automated bonding to composite bumps
- Patent number 6,024,274
- Issue date Feb 15, 2000
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump tape automated bonded structure
- Patent number 5,861,661
- Issue date Jan 19, 1999
- Industrial Technology Research Institute
- Pao-Yun Tang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite bump tape automated bonding method and bonded structure
- Patent number 5,749,997
- Issue date May 12, 1998
- Industrial Technology Research Institute
- Pao-Yun Tang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite bump structure and methods of fabrication
- Patent number 5,707,902
- Issue date Jan 13, 1998
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection construction and method of manufacturing the same
- Patent number 5,578,527
- Issue date Nov 26, 1996
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MA...
- Publication number 20110230044
- Publication date Sep 22, 2011
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING BONDING STRUCTURE
- Publication number 20090253233
- Publication date Oct 8, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONTACT STRUCTURE AND FORMING METHOD THEREOF AND CONNECTING STRUCTU...
- Publication number 20090246988
- Publication date Oct 1, 2009
- TAIWAN TFT LCD ASSOCIATION
- Sheng-Shu Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT STRUCTURE AND CONNECTING STRUCTURE
- Publication number 20090243093
- Publication date Oct 1, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MANUFACTURING METHOD OF CONTACT STRUCTURE
- Publication number 20090149015
- Publication date Jun 11, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure With Buffer Layer And Method Of Forming The Same
- Publication number 20080305624
- Publication date Dec 11, 2008
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE
- Publication number 20080284011
- Publication date Nov 20, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE
- Publication number 20080237850
- Publication date Oct 2, 2008
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE ON SUBSTRATE
- Publication number 20080197352
- Publication date Aug 21, 2008
- TAIWAN TFT LCD ASSOCIATION
- Ming-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20080099916
- Publication date May 1, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Contact structure having a compliant bump and a testing area and ma...
- Publication number 20080023830
- Publication date Jan 31, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20080023832
- Publication date Jan 31, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE FOR ELECTRONIC DEVICE
- Publication number 20070210429
- Publication date Sep 13, 2007
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE BUMP
- Publication number 20070210457
- Publication date Sep 13, 2007
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure With Buffer Layer And Method Of Forming The Same
- Publication number 20070122635
- Publication date May 31, 2007
- Su-Tsai Lu
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for fabricating conductive bumps with non-conductive juxtapo...
- Publication number 20070111382
- Publication date May 17, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protecting structure and manufacturing method for electronic packag...
- Publication number 20070096279
- Publication date May 3, 2007
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure With Buffer Layer And Method Of Forming The Same
- Publication number 20070056163
- Publication date Mar 15, 2007
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding IC chips to substrates incorporating dummy bumps...
- Publication number 20050250303
- Publication date Nov 10, 2005
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yu-Te Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding structure with buffer layer and method of forming the same
- Publication number 20050112340
- Publication date May 26, 2005
- Su-Tsai Lu
- B32 - LAYERED PRODUCTS
Information Patent Application
Conductive bumps with non-conductive juxtaposed sidewalls and metho...
- Publication number 20050104223
- Publication date May 19, 2005
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure with compliant bumps
- Publication number 20050098901
- Publication date May 12, 2005
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for bonding IC chips to substrates incorporating dummy bumps...
- Publication number 20040004292
- Publication date Jan 8, 2004
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yu-Te Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite bump bonding
- Publication number 20020070463
- Publication date Jun 13, 2002
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Shyh-Ming Chang
- F41 - WEAPONS

Shyh-Ming Chang

Person

Patents Grantslast 30 patents

Contact structure and forming method thereof and connecting structu...

Method of fabricating bonding structure

Bonding structure with buffer layer and method of forming the same

Contact structure having a compliant bump and a testing area

Manufacturing method of contact structure

Contact structure having a compliant bump and a test pad

Structure for protecting electronic packaging contacts from stress

Bonding structure

Package structure for electronic device

Bonding structure with buffer layer and method of forming the same

Bond quality indication by bump structure on substrate

Bonding structure with buffer layer and method of forming the same

Composite bump

Method for fabricating conductive bumps with non-conductive juxtapo...

Method for bonding IC chips to substrates incorporating dummy bumps...

Bonding structure with buffer layer and method of forming the same

Conductive bumps with non-conductive juxtaposed sidewalls

Bonding structure with compliant bumps

Method for bonding IC chips to substrates incorporating dummy bumps...

Method for forming electrically conductive bumps and devices formed

Method for bonding IC chips to substrates with non-conductive adhesive

Method for bonding IC chips having multi-layered bumps with corruga...

Composite bump bonding

Composite bump flip chip bonding

Composite bump structures

Method for tape automated bonding to composite bumps

Composite bump tape automated bonded structure

Composite bump tape automated bonding method and bonded structure

Composite bump structure and methods of fabrication

Connection construction and method of manufacturing the same

Patents Applicationslast 30 patents

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MA...

METHOD OF FABRICATING BONDING STRUCTURE

CONTACT STRUCTURE AND FORMING METHOD THEREOF AND CONNECTING STRUCTU...

CONTACT STRUCTURE AND CONNECTING STRUCTURE

MANUFACTURING METHOD OF CONTACT STRUCTURE

Bonding Structure With Buffer Layer And Method Of Forming The Same

BUMP STRUCTURE

COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE

BUMP STRUCTURE ON SUBSTRATE

BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME

Contact structure having a compliant bump and a testing area and ma...

CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE FOR ELECTRONIC DEVICE

COMPOSITE BUMP

Bonding Structure With Buffer Layer And Method Of Forming The Same

Method for fabricating conductive bumps with non-conductive juxtapo...

Protecting structure and manufacturing method for electronic packag...

Bonding Structure With Buffer Layer And Method Of Forming The Same

Method for bonding IC chips to substrates incorporating dummy bumps...

Bonding structure with buffer layer and method of forming the same

Conductive bumps with non-conductive juxtaposed sidewalls and metho...

Bonding structure with compliant bumps

Method for bonding IC chips to substrates incorporating dummy bumps...

Composite bump bonding