Claims
- 1. A composite bump structure, comprising:
- an integrated circuit element;
- input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer perimeter;
- base metal pads formed on said input/output pads; and
- composite bumps formed on said base metal pads, wherein said composite bumps comprise a polymer body covered by a conductive metal coating, wherein said polymer body has a Young's Modulus between about 0.4.times.10.sup.-6 and 0.5.times.10.sup.-6 psi.
- 2. The composite bump structure of claim 1 wherein said polymer body is polyamic acid polyimide.
- 3. The composite bump structure of claim 1 wherein a base metal is formed under said composite bumps and on top of said input/output pads.
- 4. The composite bump structure of claim 1 wherein said base metal pads are aluminum.
- 5. The composite bump structure of claim 1 wherein said conductive metal coating is coated with solder.
- 6. The composite bump structure of claim 5 wherein said solder is 95% lead and 5% tin.
- 7. The composite bump structure of claim 1 wherein said composite bumps extend beyond said outer perimeter of each of said input/output pads.
- 8. The composite bump structure of claim 1 wherein said composite bumps are in a ring around said input/output pads.
- 9. A composite bump structure, comprising:
- an integrated circuit element with input/output pads;
- a passivation layer covering said integrated circuit element having contact holes over said input/output pads;
- base metal pads formed on said passivation layer covering said contact holes and making electrical contact with said input/output pads; and
- composite bumps formed on said base metal pads, wherein said composite bumps comprise a polymer body covered by a conductive metal coating, wherein said polymer body has a Young's Modulus between about 0.4.times.10.sup.-6 and 0.5.times.10.sup.-6 psi.
- 10. The composite bump structure of claim 9 wherein said composite bumps have a rounded shape.
- 11. The composite bump structure of claim 9 wherein that part of the surface of said composite bumps opposite said base metal pads is flat.
- 12. The composite bump structure of claim 9 wherein that part of the surface of said composite bumps opposite said base metal pads has a rough, irregular exterior.
- 13. The composite bump structure of claim 9 wherein said base metal is aluminum.
- 14. The composite bump structure of claim 9 wherein said polymer body, is polyamic acid polyimide.
- 15. The composite bump structure of claim 9 wherein said polymer body, is photosensitive polymer.
- 16. The composite bump structure of claim 15 wherein said photosensitive polymer is photosensitive polyamic acid polyimide.
- 17. The composite bump structure of claim 9 wherein said conductive metal coating is covered by a layer of soldering metal.
- 18. The composite bump structure of claim 17 wherein said layer of soldering metal is 95% lead and 5% tin.
- 19. A composite bump structure, comprising:
- an integrated circuit element;
- input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer periphery; and
- multiple composite bumps formed wherein each said composite bump is formed from a polymer body having a Young's Modulus between about 0.4.times.10.sup.-6 and 0.5.times.10.sup.-6 psi covered by a conductive metal coating and said multiple composite bumps are located inside said outer periphery of each said input/output pad.
- 20. A composite bump structure, comprising:
- an integrated circuit element;
- input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer periphery; and
- multiple composite bumps formed wherein each said composite bump is formed from a polymer body having a Young's Modulus between about 0.4.times.10.sup.-6 and 0.5.times.10.sup.-6 psi covered by a conductive metal coating and said multiple composite bumps are located in a ring surrounding said outer periphery of each said input/output pad.
- 21. A composite bump structure, comprising:
- an integrated circuit element;
- input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer periphery; and
- multiple composite bumps formed wherein each said composite bump is formed from a polymer body having a Young's Modulus between about 0.4.times.10.sup.-6 and 0.5.times.10.sup.-6 psi covered by a conductive metal coating and said multiple composite bumps are located inside said outer periphery of each said input/output pad and in a ring surrounding said outer periphery of each said input/output pad.
Parent Case Info
This is a division of patent application Ser. No. 08/507,533, filing date Jul. 26, 1995 now U.S. Pat. No. 5,707,902, Composite Bump Structure And Methods Of Fabrication, assigned to the same assignee as the present invention which is a Continuation-in-Part Application of Ser. No. 08/387,095, filed Feb. 13, 1995 also entitled "Composite Bump Structure and Methods of Fabrication," now abandoned.
US Referenced Citations (25)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1-283843 |
Nov 1989 |
JPX |
2-180036 |
Jul 1990 |
JPX |
Divisions (1)
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Number |
Date |
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Parent |
507533 |
Jul 1995 |
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Continuation in Parts (1)
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Number |
Date |
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Parent |
387095 |
Feb 1995 |
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