Claims
- 1. A bonded structure, comprising:an integrated circuit element having input/output pads; a substrate having input/output pads; and a plurality of physical and electrical connections between said integrated circuit element input/output pads and said substrate input/output pads wherein each said connection includes a soldering metal and a composite bump comprised of a single polymer body with a conductive metal coating covering said polymer body wherein said physical and electrical connections are formed by said soldering metal.
- 2. The bonded structure of claim 1 wherein said polymer is polyamic acid polyimide.
- 3. The bonded structure of claim 1 wherein said conductive metal coating is a composite of chrome/copper/gold having thicknesses of about 500 Angstroms chrome/500 Angstroms copper/2000 Angstroms gold.
- 4. The bonded structure of claim 1 wherein said soldering metal is 95% lead-5% tin.
RELATED PATENT APPLICATIONS
This is a divisional application of Ser. No. 08/239,380, filed May 6, 1994, now U.S. Pat. No. 5,431,328.
Ser. No. 08/239,375, filed May 6, 1994 entitled Composite Bump Bonding; now abandoned and replaced by File Wrapper Continuing Application Ser. No. 08/518,182, filed Aug. 23, 1995 entitled Composite Bump Bonding and assigned to the same assignee.
Ser. No. 08/239,424, filed May 6, 1994 entitled Composite Bump Structure and Methods of Fabrication assigned to the same assignee; now U.S. Pat. No. 5,393,697 issued Feb. 28, 1995.
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