Siu Waf Low

Person

Lengkok Angsa, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,698,295
- Issue date Apr 15, 2014
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,304,894
- Issue date Nov 6, 2012
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages
- Patent number 8,063,493
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,884,007
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages with edge contacts and...
- Patent number 7,633,159
- Issue date Dec 15, 2009
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,579,681
- Issue date Aug 25, 2009
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,553,697
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multichip wafer level packages and computing syste...
- Patent number 7,485,562
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,368,374
- Issue date May 6, 2008
- Micron Technology Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,304,375
- Issue date Dec 4, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaging for image sensor devices
- Patent number 7,274,094
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,271,027
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellated chip-scale packages and methods for fabricating the same
- Patent number 7,208,335
- Issue date Apr 24, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,193,312
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,173,330
- Issue date Feb 6, 2007
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaging for image sensor devices and methods of assembly
- Patent number 7,112,471
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 7,087,992
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package and method of fabricating same
- Patent number 6,987,031
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level system packages and methods of forming same
- Patent number 6,964,881
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 6,958,537
- Issue date Oct 25, 2005
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensing microelectronic devices including a lead and...
- Patent number 6,882,021
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for testing and burn-in of semiconductor devices
- Patent number 6,856,155
- Issue date Feb 15, 2005
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 6,825,553
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
- Patent number 6,387,729
- Issue date May 14, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,365,833
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulate resin LOC package and method of fabrication
- Patent number 6,236,107
- Issue date May 22, 2001
- Texas Instruments Incorporated
- Min Yu Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin stacked integrated circuit device
- Patent number 6,137,164
- Issue date Oct 24, 2000
- Texas Instruments Incorporated
- Chee Klang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
- Patent number 6,087,203
- Issue date Jul 11, 2000
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible pin location integrated circuit package
- Patent number 5,952,611
- Issue date Sep 14, 1999
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered lead frame assembly for integrated circuits
- Patent number 5,461,255
- Issue date Oct 24, 1995
- Texas Instruments Incorporated
- Min Y Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...
- Publication number 20100072603
- Publication date Mar 25, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super High Density Module with Integrated Wafer Level Packages
- Publication number 20070264751
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070152327
- Publication date Jul 5, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070145558
- Publication date Jun 28, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20070059862
- Publication date Mar 15, 2007
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages with edge contacts and...
- Publication number 20060006521
- Publication date Jan 12, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20050236709
- Publication date Oct 27, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making multichip wafer level packages and computing syste...
- Publication number 20050116337
- Publication date Jun 2, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20050073029
- Publication date Apr 7, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellated chip-scale packages and methods for fabricating the same
- Publication number 20050067680
- Publication date Mar 31, 2005
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20050048695
- Publication date Mar 3, 2005
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20050006748
- Publication date Jan 13, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of packaging microelec...
- Publication number 20040238909
- Publication date Dec 2, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level system packages and methods of forming same
- Publication number 20040229400
- Publication date Nov 18, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless packaging for image sensor devices and methods of assembly
- Publication number 20040084741
- Publication date May 6, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20040046250
- Publication date Mar 11, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20040042190
- Publication date Mar 4, 2004
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless packaging for image sensor devices and methods of assembly
- Publication number 20040041221
- Publication date Mar 4, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip wafer level system packages and methods of forming same
- Publication number 20040043533
- Publication date Mar 4, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for testing and burn-in of semiconductor devices
- Publication number 20040032273
- Publication date Feb 19, 2004
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20030227079
- Publication date Dec 11, 2003
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adhering and sealing a silicon chip in an integrated cir...
- Publication number 20020001882
- Publication date Jan 3, 2002
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS

Siu Waf Low

Person

Patents Grantslast 30 patents

Super high-density module with integrated wafer level packages

Super high-density module with integrated wafer level packages

Semiconductor device assemblies and packages

Super high density module with integrated wafer level packages

Semiconductor device assemblies and packages with edge contacts and...

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Method of making multichip wafer level packages and computing syste...

Super high density module with integrated wafer level packages

Castellation wafer level packaging of integrated circuit chips

Leadless packaging for image sensor devices

Castellation wafer level packaging of integrated circuit chips

Castellated chip-scale packages and methods for fabricating the same

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Multi-chip wafer level system packages and methods of forming same

Multiple chip semiconductor package

Packaged image sensing microelectronic devices including a lead and...

Methods and apparatus for testing and burn-in of semiconductor devices

Multichip wafer level packages and computing systems incorporating...

Method for adhering and sealing a silicon chip in an integrated cir...

Integrated circuit package

Encapsulate resin LOC package and method of fabrication

Thin stacked integrated circuit device

Method for adhering and sealing a silicon chip in an integrated cir...

Flexible pin location integrated circuit package

Multi-layered lead frame assembly for integrated circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...

Super High Density Module with Integrated Wafer Level Packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Semiconductor device assemblies and packages with edge contacts and...

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package and method of fabricating same

Method of making multichip wafer level packages and computing syste...

Multichip wafer level packages and computing systems incorporating...

Castellated chip-scale packages and methods for fabricating the same

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Packaged microelectronic devices and methods of packaging microelec...

Multichip wafer level system packages and methods of forming same

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Leadless packaging for image sensor devices and methods of assembly

Multi-chip wafer level system packages and methods of forming same

Methods and apparatus for testing and burn-in of semiconductor devices

Super high density module with integrated wafer level packages

Method for adhering and sealing a silicon chip in an integrated cir...