Steve W. Heppler

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic devices
- Patent number 8,508,034
- Issue date Aug 13, 2013
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 8,115,296
- Issue date Feb 14, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 7,998,305
- Issue date Aug 16, 2011
- Micron Technology, Inc.
- Chad A. Cobbley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 7,829,190
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Chad A. Cobbley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods for assembling semiconductor devices and interposers
- Patent number 7,528,007
- Issue date May 5, 2009
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 7,326,316
- Issue date Feb 5, 2008
- Micron Technology, Inc.
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Interposers with receptacles for receiving semiconductor devices an...
- Patent number 7,274,095
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture-resistant electronic device package and methods of assembly
- Patent number 7,026,548
- Issue date Apr 11, 2006
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture-resistant electronic device package and methods of assembly
- Patent number 6,953,891
- Issue date Oct 11, 2005
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 6,951,684
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 6,777,071
- Issue date Aug 17, 2004
- Micron Technology, Inc.
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Ball grid array interposer, packages and methods
- Patent number 6,746,894
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging die preparation
- Patent number 6,399,464
- Issue date Jun 4, 2002
- Micron Technology, Inc.
- Tom A. Muntifering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing a planar structure
- Patent number 6,371,840
- Issue date Apr 16, 2002
- Micron Technology, Inc.
- Michael B. Ball
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for processing a planar structure
- Patent number 6,351,022
- Issue date Feb 26, 2002
- Micron Technology, Inc.
- Michael B. Ball
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Packaging die preparation
- Patent number 6,162,703
- Issue date Dec 19, 2000
- Micron Technology, Inc.
- Tom A. Muntifering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing a planar structure
- Patent number 6,120,360
- Issue date Sep 19, 2000
- Micron Technology, Inc.
- Michael B. Ball
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
System for fabricating and testing assemblies containing wire bonde...
- Patent number 6,117,693
- Issue date Sep 12, 2000
- Micron Technology, Inc.
- Rich Fogal
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for processing a planar structure
- Patent number 5,920,769
- Issue date Jul 6, 1999
- Micron Technology, Inc.
- Michael B. Ball
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and system for fabricating and testing assemblies containing...
- Patent number 5,918,107
- Issue date Jun 29, 1999
- Micron Technology, Inc.
- Rich Fogal
- G01 - MEASURING TESTING
Information Patent Grant
IC pin forming machine with integrated IC testing capability
- Patent number 5,248,075
- Issue date Sep 28, 1993
- Micron Technology, Inc.
- Jerry A. Young
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES
- Publication number 20120126386
- Publication date May 24, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20100264532
- Publication date Oct 21, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Using Locally Conductive Adhesive
- Publication number 20080093019
- Publication date Apr 24, 2008
- Micron Technology, Inc.
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods for assembling semiconductor devices and interposers
- Publication number 20060194373
- Publication date Aug 31, 2006
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding tool and a method of forming an electronic device package
- Publication number 20060169490
- Publication date Aug 3, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Blades, saws, and methods for cutting microfeature workpieces
- Publication number 20060005672
- Publication date Jan 12, 2006
- Gregory M. Chapman
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Electrical interconnect using locally conductive adhesive
- Publication number 20060003157
- Publication date Jan 5, 2006
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MOISTURE-RESISTANT ELECTRONIC DEVICE PACKAGE AND METHODS OF ASSEMBLY
- Publication number 20050263312
- Publication date Dec 1, 2005
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Moisture-resistant electronic device package and methods of assembly
- Publication number 20050057883
- Publication date Mar 17, 2005
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical interconnect using locally conductive adhesive
- Publication number 20040232391
- Publication date Nov 25, 2004
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electrical interconnect using locally conductive adhesive
- Publication number 20040229032
- Publication date Nov 18, 2004
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20040217459
- Publication date Nov 4, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical interconnect using locally conductive adhesive
- Publication number 20040209497
- Publication date Oct 21, 2004
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electrical interconnect using locally conductive adhesive
- Publication number 20030203668
- Publication date Oct 30, 2003
- Micron Technology, Inc.
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20020142513
- Publication date Oct 3, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS

Steve W. Heppler

Person

Patents Grantslast 30 patents

Electronic devices

Electronic device package

Electrical interconnect using locally conductive adhesive

Electrical interconnect using locally conductive adhesive

Methods for assembling semiconductor devices and interposers

Electrical interconnect using locally conductive adhesive

Interposers with receptacles for receiving semiconductor devices an...

Moisture-resistant electronic device package and methods of assembly

Moisture-resistant electronic device package and methods of assembly

Electrical interconnect using locally conductive adhesive

Electrical interconnect using locally conductive adhesive

Ball grid array interposer, packages and methods

Packaging die preparation

Method and apparatus for processing a planar structure

Method and apparatus for processing a planar structure

Packaging die preparation

Apparatus for processing a planar structure

System for fabricating and testing assemblies containing wire bonde...

Method and apparatus for processing a planar structure

Method and system for fabricating and testing assemblies containing...

IC pin forming machine with integrated IC testing capability

Patents Applicationslast 30 patents

ELECTRONIC DEVICES

ELECTRONIC DEVICE PACKAGE

Electrical Interconnect Using Locally Conductive Adhesive

Methods for assembling semiconductor devices and interposers

Molding tool and a method of forming an electronic device package

Blades, saws, and methods for cutting microfeature workpieces

Electrical interconnect using locally conductive adhesive

MOISTURE-RESISTANT ELECTRONIC DEVICE PACKAGE AND METHODS OF ASSEMBLY

Moisture-resistant electronic device package and methods of assembly

Electrical interconnect using locally conductive adhesive

Electrical interconnect using locally conductive adhesive

Ball grid array interposer, packages and methods

Electrical interconnect using locally conductive adhesive

Electrical interconnect using locally conductive adhesive

Ball grid array interposer, packages and methods