Claims
- 1. An apparatus for reducing the thickness of segmented wafer portions, said apparatus comprising:
- a source of vacuum;
- a table upon which the segmented wafer portions are directly supported, said table including:
- porous regions for supplying the vacuum to support the segmented wafer portions, said porous regions each corresponding to the contours of a respective one of said segmented wafer portions; and
- non-porous regions located between said porous regions, said non-porous regions providing no support to said segmented wafer portions.
- 2. The apparatus of claim 1, wherein said table is formed of ceramic material.
- 3. The apparatus of claim 2, further comprising a grinding mechanism for grinding back surfaces of said segmented wafer portions to a desired thickness.
- 4. The apparatus of claim 1, wherein said table includes at least four said porous regions.
- 5. The apparatus of claim 1, wherein each of the segmented wafer portions is a die, said table being adapted to support a plurality of said dies.
Parent Case Info
This application is a divisional application of U.S. application Ser. No. 08/990,072 filed Dec. 12, 1997 (now Pat. No. 5,920,769), the disclosure of which is incorporated herein by reference.
US Referenced Citations (12)
Divisions (1)
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Number |
Date |
Country |
Parent |
990072 |
Dec 1997 |
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