Claims
- 1. A segmented semiconductor wafer, comprising:wafer portions each containing at least one integrated circuit, said wafer portions defining generally planar front and back surfaces; each of said wafer portions including a generally circular peripheral portion; and a protective material on said front and back surfaces.
- 2. The segmented wafer of claim 1, wherein said wafer portions include silicon.
- 3. The segmented wafer of claim 1, wherein said wafer portions include a group III-V compound semiconductor material.
- 4. The segmented wafer of claim 1, wherein each of said wafer portions contains a plurality of said integrated circuits.
- 5. The segmented semiconductor wafer of claim 1, comprising four said wafer portions, each said wafer portion approximating one-fourth of the semiconductor wafer.
- 6. A segmented semiconductor wafer, comprising:wafer portions each containing at least one integrated circuit, said wafer portions defining generally planar front and back surfaces and each being at least 18.5 mils thick; each of said wafer portions including a generally circular peripheral portion.
- 7. The segmented semiconductor wafer of claim 6, wherein said wafer portions include silicon.
- 8. The segmented semiconductor wafer of claim 6, wherein said wafer portions include a group III-V compound semiconductor material.
- 9. The segmented semiconductor wafer of claim 6, wherein each of said wafer portions contains a plurality of said integrated circuits.
- 10. The segmented semiconductor wafer of claim 6, comprising four said wafer portions, each said wafer portion approximating one-fourth of the semiconductor wafer.
- 11. The segmented semiconductor wafer of claim 6, wherein said back surfaces have been ground.
- 12. A segmented semiconductor wafer, comprising:wafer portions each containing at least one integrated circuit, said wafer portions defining generally planar front and back surfaces; and a protective material on said front and back surfaces.
- 13. The segmented semiconductor wafer of claim 12, comprising four said wafer portions, each said wafer portion approximating one-fourth of the semiconductor wafer.
- 14. The segmented semiconductor wafer of claim 12, wherein said back surfaces have been ground.
Parent Case Info
This application is a divisional application of U.S. application Ser. No. 09/304,848 filed May 5, 1999, the disclosure of which is incorporated herein by reference now U.S. Pat. No. 6,120,360, which is a divisional application of U.S. application Ser. No. 08/990,072, filed Dec. 12, 1997, now U.S. Pat. No. 5,920,769.
US Referenced Citations (16)
Foreign Referenced Citations (1)
Number |
Date |
Country |
9-225820 |
Sep 1997 |
JP |