Sudhanshu Misra

Person

Camas, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical planarization
- Patent number 11,545,365
- Issue date Jan 3, 2023
- CHEMPOWER CORPORATION
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polishing pads for CMP and methods of fabrication and us...
- Patent number 10,220,487
- Issue date Mar 5, 2019
- Cabot Microelectronics Corporation
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Grooved CMP pads
- Patent number 9,375,823
- Issue date Jun 28, 2016
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polishing pads for CMP and methods of fabrication and us...
- Patent number 9,278,424
- Issue date Mar 8, 2016
- NexPlanar Corporation
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing systems
- Patent number 9,272,388
- Issue date Mar 1, 2016
- NexPlanar Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Grooved CMP pad
- Patent number 9,180,570
- Issue date Nov 10, 2015
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polishing pads for CMP and methods of fabrication and us...
- Patent number 8,864,859
- Issue date Oct 21, 2014
- NexPlanar Corporation
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polishing pads for CMP and methods of fabrication and us...
- Patent number 8,715,035
- Issue date May 6, 2014
- NexPlanar Corporation
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing systems
- Patent number 8,383,003
- Issue date Feb 26, 2013
- NexPlanar Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polish pads for chemical mechanical planarization
- Patent number 8,380,339
- Issue date Feb 19, 2013
- NexPlanar Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polishing pads for CMP and methods of fabrication and us...
- Patent number 7,704,125
- Issue date Apr 27, 2010
- NexPlanar Corporation
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polish pads for chemical mechanical planarization
- Patent number 7,704,122
- Issue date Apr 27, 2010
- NexPlanar Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Customized polish pads for chemical mechanical planarization
- Patent number 7,425,172
- Issue date Sep 16, 2008
- NexPlanar Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device having an interconnect layer with a plurality...
- Patent number 6,683,382
- Issue date Jan 27, 2004
- Agere Systems Inc.
- Donald Thomas Cwynar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad for chemical mechanical polishing
- Patent number 6,659,846
- Issue date Dec 9, 2003
- Agere Systems, INC
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Non-hydrolytic-sol-gel process for high K dielectric
- Patent number 6,616,965
- Issue date Sep 9, 2003
- Agere Systems Inc.
- Sudhanshu Misra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical polishing composition and method of polishing m...
- Patent number 6,599,837
- Issue date Jul 29, 2003
- Agere Systems Guardian Corp.
- Sailesh Mansinh Merchant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chemical/mechanical planarization of a semiconductor waf...
- Patent number 6,596,639
- Issue date Jul 22, 2003
- Agere Systems Inc.
- William G. Easter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite polishing pads for chemical-mechanical polishing
- Patent number 6,544,107
- Issue date Apr 8, 2003
- Agere Systems Inc.
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Process for making mixed metal oxides
- Patent number 6,540,974
- Issue date Apr 1, 2003
- Agere Systems Inc.
- Sudhanshu Misra
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of forming in-situ electroplated oxide passivating film for...
- Patent number 6,524,957
- Issue date Feb 25, 2003
- Agere Systems Inc.
- Sailesh Mansinh Merchant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating an effluent gas during semiconductor processing
- Patent number 6,471,925
- Issue date Oct 29, 2002
- Agere Systems Guardian Corp.
- Sailesh Mansinh Merchant
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Local area alloying for preventing dishing of copper during chemica...
- Patent number 6,461,225
- Issue date Oct 8, 2002
- Agere Systems Guardian Corp.
- Sudhanshu Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing fluid, polishing method, semiconductor device and semicon...
- Patent number 6,458,016
- Issue date Oct 1, 2002
- Agere System Guardian Corp.
- Sailesh Mansinh Merchant
- B24 - GRINDING POLISHING
Information Patent Grant
CMP slurry for polishing semiconductor wafers and related methods
- Patent number 6,458,289
- Issue date Oct 1, 2002
- Agere Systems Guardian Corp.
- Sailesh Mansinh Merchant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing fluid, polishing method, semiconductor device and semicon...
- Patent number 6,439,972
- Issue date Aug 27, 2002
- Agere Systems Guardian Corp.
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Grant
Method for making an interconnect layer and a semiconductor device...
- Patent number 6,436,807
- Issue date Aug 20, 2002
- Agere Systems Guardian Corp.
- Donald Thomas Cwynar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP system for polishing semiconductor wafers and related method
- Patent number 6,436,830
- Issue date Aug 20, 2002
- Agere Systems Guardian Corp.
- Sailesh Mansinh Merchant
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon carbide barrier layers for porous low dielectric constant m...
- Patent number 6,410,419
- Issue date Jun 25, 2002
- Agere Systems Guardian Corp.
- Sailesh Mansinh Merchant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing fluid polishing method semiconductor device and semicondu...
- Patent number 6,375,541
- Issue date Apr 23, 2002
- Lucent Technologies, Inc.
- Sailesh Mansinh Merchant
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL PLANARIZATION
- Publication number 20230143013
- Publication date May 11, 2023
- CHEMPOWER CORPORATION
- Sudhanshu Misra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TOOLS FOR CHEMICAL PLANARIZATION
- Publication number 20230077988
- Publication date Mar 16, 2023
- CHEMPOWER CORPORATION
- Sudhanshu Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD SURFACE REGENERATION AND METAL RECOVERY
- Publication number 20220355439
- Publication date Nov 10, 2022
- ChEmpower Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL PLANARIZATION
- Publication number 20200365412
- Publication date Nov 19, 2020
- Creative Insights, LLC
- Sudhanshu Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND US...
- Publication number 20160229025
- Publication date Aug 11, 2016
- NexPlanar Corporation
- Pradip K. ROY
- B24 - GRINDING POLISHING
Information Patent Application
GROOVED CMP PADS
- Publication number 20160023321
- Publication date Jan 28, 2016
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Application
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND US...
- Publication number 20150065020
- Publication date Mar 5, 2015
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEMS
- Publication number 20130149945
- Publication date Jun 13, 2013
- Sudhanshu Misra
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20100273398
- Publication date Oct 28, 2010
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
Polishing systems
- Publication number 20090318063
- Publication date Dec 24, 2009
- NexPlanar Corporation
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
Grooved CMP pad
- Publication number 20090311955
- Publication date Dec 17, 2009
- NexPlanar Corporation
- Robert Kerprich
- B24 - GRINDING POLISHING
Information Patent Application
Customized Polishing Pads for CMP and Methods of Fabrication and Us...
- Publication number 20090053976
- Publication date Feb 26, 2009
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Application
Customized polishing pads for CMP and methods of fabrication and us...
- Publication number 20080207100
- Publication date Aug 28, 2008
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Application
Customized polish pads for chemical mechanical planarization
- Publication number 20080090498
- Publication date Apr 17, 2008
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
Customized polishing pads for CMP and methods of fabrication and us...
- Publication number 20060276109
- Publication date Dec 7, 2006
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Application
Customized polishing pads for CMP and methods of fabrication and us...
- Publication number 20060189269
- Publication date Aug 24, 2006
- Pradip K. Roy
- B24 - GRINDING POLISHING
Information Patent Application
Customized polish pads for chemical mechanical planarization
- Publication number 20050009448
- Publication date Jan 13, 2005
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
Temprature compensated chemical mechanical polishing apparatus and...
- Publication number 20030119427
- Publication date Jun 26, 2003
- Sudhanshu Rid Misra
- B24 - GRINDING POLISHING
Information Patent Application
Pad for chemical mechanical polishing
- Publication number 20030054735
- Publication date Mar 20, 2003
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
Method for making an interconnect layer and a semiconductor device...
- Publication number 20020162082
- Publication date Oct 31, 2002
- Donald Thomas Cwynar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite polishing pads for chemical-mechanical polishing
- Publication number 20020115385
- Publication date Aug 22, 2002
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
In-situ electroplated oxide passivating film for corrosion inhibition
- Publication number 20020030282
- Publication date Mar 14, 2002
- Agere Systems, Inc.
- Sailesh Mansinh Merchant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film deposition of mixed metal oxides
- Publication number 20010040785
- Publication date Nov 15, 2001
- Sudhanshu Misra
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Polishing fluid, polishing method, semiconductor device and semicon...
- Publication number 20010036795
- Publication date Nov 1, 2001
- Lucent Technologies, Inc.
- Sailesh Mansinh Merchant
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing fluid, polishing method, semiconductor device and semicon...
- Publication number 20010036796
- Publication date Nov 1, 2001
- Lucent Technologies, Inc.
- Sudhanshu Misra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Sudhanshu Misra

Person

Patents Grantslast 30 patents

Chemical planarization

Customized polishing pads for CMP and methods of fabrication and us...

Grooved CMP pads

Customized polishing pads for CMP and methods of fabrication and us...

Polishing systems

Grooved CMP pad

Customized polishing pads for CMP and methods of fabrication and us...

Customized polishing pads for CMP and methods of fabrication and us...

Polishing systems

Customized polish pads for chemical mechanical planarization

Customized polishing pads for CMP and methods of fabrication and us...

Customized polish pads for chemical mechanical planarization

Customized polish pads for chemical mechanical planarization

Semiconductor device having an interconnect layer with a plurality...

Pad for chemical mechanical polishing

Non-hydrolytic-sol-gel process for high K dielectric

Chemical mechanical polishing composition and method of polishing m...

Method for chemical/mechanical planarization of a semiconductor waf...

Composite polishing pads for chemical-mechanical polishing

Process for making mixed metal oxides

Method of forming in-situ electroplated oxide passivating film for...

Method for treating an effluent gas during semiconductor processing

Local area alloying for preventing dishing of copper during chemica...

Polishing fluid, polishing method, semiconductor device and semicon...

CMP slurry for polishing semiconductor wafers and related methods

Polishing fluid, polishing method, semiconductor device and semicon...

Method for making an interconnect layer and a semiconductor device...

CMP system for polishing semiconductor wafers and related method

Silicon carbide barrier layers for porous low dielectric constant m...

Polishing fluid polishing method semiconductor device and semicondu...

Patents Applicationslast 30 patents

CHEMICAL PLANARIZATION

TOOLS FOR CHEMICAL PLANARIZATION

PAD SURFACE REGENERATION AND METAL RECOVERY

CHEMICAL PLANARIZATION

CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND US...

GROOVED CMP PADS

CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND US...

POLISHING SYSTEMS

CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION

Polishing systems

Grooved CMP pad

Customized Polishing Pads for CMP and Methods of Fabrication and Us...

Customized polishing pads for CMP and methods of fabrication and us...

Customized polish pads for chemical mechanical planarization

Customized polishing pads for CMP and methods of fabrication and us...

Customized polishing pads for CMP and methods of fabrication and us...

Customized polish pads for chemical mechanical planarization

Temprature compensated chemical mechanical polishing apparatus and...

Pad for chemical mechanical polishing

Method for making an interconnect layer and a semiconductor device...

Composite polishing pads for chemical-mechanical polishing

In-situ electroplated oxide passivating film for corrosion inhibition

Thin film deposition of mixed metal oxides

Polishing fluid, polishing method, semiconductor device and semicon...

Polishing fluid, polishing method, semiconductor device and semicon...