Ta-Ching Yu

Person

Zhubei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 11,894,238
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,854,784
- Issue date Dec 26, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,791,266
- Issue date Oct 17, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 11,469,201
- Issue date Oct 11, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,450,606
- Issue date Sep 20, 2022
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 11,387,113
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,916,449
- Issue date Feb 9, 2021
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 10,818,509
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with rigid under bump metallurgy (UBM) stack
- Patent number 10,756,040
- Issue date Aug 25, 2020
- Mediatek Inc.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,580,747
- Issue date Mar 3, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,615
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,616
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,536
- Issue date Feb 25, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 10,553,526
- Issue date Feb 4, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded supporter and method for fabric...
- Patent number 10,340,198
- Issue date Jul 2, 2019
- Mediatek Inc.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,312,210
- Issue date Jun 4, 2019
- Mediatek Inc.
- Ching-Liou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning interconnects
- Patent number 10,276,377
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,236,187
- Issue date Mar 19, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and package substrate
- Patent number 10,236,242
- Issue date Mar 19, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 10,217,716
- Issue date Feb 26, 2019
- Mediatek Inc.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with reduced trench dist...
- Patent number 10,163,654
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,115,604
- Issue date Oct 30, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package having a patterned conducting plate and a conducting p...
- Patent number 10,074,581
- Issue date Sep 11, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,972,593
- Issue date May 15, 2018
- Mediatek Inc.
- Ching-Liou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 9,922,844
- Issue date Mar 20, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and package substrate
- Patent number 9,852,973
- Issue date Dec 26, 2017
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structures by self-aligned approach
- Patent number 9,824,922
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structures by self-aligned approach
- Patent number 9,659,821
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,633,936
- Issue date Apr 25, 2017
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, package substrate and manufacturing method thereof
- Patent number 9,627,311
- Issue date Apr 18, 2017
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332266
- Publication date Oct 3, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEM...
- Publication number 20240274517
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Fa-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...
- Publication number 20240178002
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230422525
- Publication date Dec 28, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230307421
- Publication date Sep 28, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230282625
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230282604
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20230282626
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230073399
- Publication date Mar 9, 2023
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20230046413
- Publication date Feb 16, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220392839
- Publication date Dec 8, 2022
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Fabricating Semiconductor Device With Reduced Trench Dist...
- Publication number 20220344170
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...
- Publication number 20210057231
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200312732
- Publication date Oct 1, 2020
- MEDIATEK INC.
- Yen-Yao CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20200176408
- Publication date Jun 4, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20200152479
- Publication date May 14, 2020
- MEDIATEK INC.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200091070
- Publication date Mar 19, 2020
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20190164780
- Publication date May 30, 2019
- MEDIA TEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Semiconductor Device with Reduced Trench Dist...
- Publication number 20190122895
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180233476
- Publication date Aug 16, 2018
- MEDIATEK INC.
- Ching-Liou HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED SUPPORTER AND METHOD FOR FABRIC...
- Publication number 20180233425
- Publication date Aug 16, 2018
- MEDIATEK INC.
- Ta-Jen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK
- Publication number 20180233474
- Publication date Aug 16, 2018
- MEDIATEK INC.
- Ta-Jen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20180166297
- Publication date Jun 14, 2018
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND PACKAGE SUBSTRATE
- Publication number 20180076121
- Publication date Mar 15, 2018
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180076166
- Publication date Mar 15, 2018
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Patterning Interconnects
- Publication number 20170338146
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURES BY SELF-ALIGNED APPROACH
- Publication number 20170338151
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND PACKAGE SUBSTRATE
- Publication number 20170186709
- Publication date Jun 29, 2017
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170186676
- Publication date Jun 29, 2017
- MEDIATEK, Inc.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS

Ta-Ching Yu

Person

Patents Grantslast 30 patents

Method of fabricating semiconductor device with reduced trench dist...

Chip scale package structure and method of forming the same

Chip scale package structure and method of forming the same

Semiconductor package and method for fabricating base for semicondu...

Chip scale package structure and method of forming the same

Method of fabricating semiconductor device with reduced trench dist...

Semiconductor package and method for fabricating base for semicondu...

Method of fabricating semiconductor device with reduced trench dist...

Semiconductor package with rigid under bump metallurgy (UBM) stack

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package

Semiconductor package with embedded supporter and method for fabric...

Semiconductor package

Method for patterning interconnects

Semiconductor package and method for fabricating base for semicondu...

Chip package and package substrate

Semiconductor package and method for fabricating the same

Method of fabricating semiconductor device with reduced trench dist...

Semiconductor package and method for fabricating base for semicondu...

Chip package having a patterned conducting plate and a conducting p...

Semiconductor package

Semiconductor package and method for fabricating base for semicondu...

Manufacturing method of chip package and package substrate

Method of forming interconnect structures by self-aligned approach

Method of forming interconnect structures by self-aligned approach

Semiconductor package

Chip package, package substrate and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEM...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

PACKAGE-ON-PACKAGE HAVING A THICK LOGIC DIE

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE ASSEMBLY

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Method Of Fabricating Semiconductor Device With Reduced Trench Dist...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

Method of Fabricating Semiconductor Device with Reduced Trench Dist...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH EMBEDDED SUPPORTER AND METHOD FOR FABRIC...

SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

CHIP PACKAGE AND PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Method for Patterning Interconnects

METHOD OF FORMING INTERCONNECT STRUCTURES BY SELF-ALIGNED APPROACH

MANUFACTURING METHOD OF CHIP PACKAGE AND PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE