Taiji Sakai

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Waveguide member and waveguide layered product
- Patent number 11,852,866
- Issue date Dec 26, 2023
- FICT LIMITED
- Toshiki Iwai
- G02 - OPTICS
Information Patent Grant
Multilayer substrate
- Patent number 11,152,291
- Issue date Oct 19, 2021
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method of manufacturing electronic device, and e...
- Patent number 11,114,418
- Issue date Sep 7, 2021
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,057,996
- Issue date Jul 6, 2021
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus, fabrication method therefor and electronic part
- Patent number 10,383,229
- Issue date Aug 13, 2019
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method for manufacturing the electronic device,...
- Patent number 10,283,434
- Issue date May 7, 2019
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 9,402,313
- Issue date Jul 26, 2016
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps, semiconductor device and method for manuf...
- Patent number 8,962,470
- Issue date Feb 24, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,922,027
- Issue date Dec 30, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,860,232
- Issue date Oct 14, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,713,792
- Issue date May 6, 2014
- Fujitsu Limited
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 8,673,050
- Issue date Mar 18, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,479,386
- Issue date Jul 9, 2013
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,409,931
- Issue date Apr 2, 2013
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing the same
- Patent number 7,863,524
- Issue date Jan 4, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer display element and manufacturing method for the same
- Patent number 7,852,439
- Issue date Dec 14, 2010
- Fujitsu Limited
- Hisashi Yamaguchi
- G02 - OPTICS
Information Patent Grant
Method for fabricating an interposer
- Patent number 7,614,142
- Issue date Nov 10, 2009
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of connecting base materials
- Patent number 7,402,461
- Issue date Jul 22, 2008
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for fabricating the same
- Patent number 7,355,290
- Issue date Apr 8, 2008
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAVEGUIDE MEMBER AND WAVEGUIDE LAYERED PRODUCT
- Publication number 20220066098
- Publication date Mar 3, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- G02 - OPTICS
Information Patent Application
SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20200203266
- Publication date Jun 25, 2020
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20200152562
- Publication date May 14, 2020
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20200154566
- Publication date May 14, 2020
- Fujitsu Limited
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190289715
- Publication date Sep 19, 2019
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND E...
- Publication number 20190252357
- Publication date Aug 15, 2019
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190254164
- Publication date Aug 15, 2019
- Fujitsu Limited
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20190192036
- Publication date Jun 27, 2019
- Fujitsu Limited
- Taiji Sakai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC APPARATUS, FABRICATION METHOD THEREFOR AND ELECTRONIC PART
- Publication number 20180279476
- Publication date Sep 27, 2018
- Fujitsu Limited
- Taiki UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE,...
- Publication number 20170125359
- Publication date May 4, 2017
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20140202739
- Publication date Jul 24, 2014
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20140140030
- Publication date May 22, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120244665
- Publication date Sep 27, 2012
- FUJITSU LIMITED
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120217626
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Taiji SAKAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20110056068
- Publication date Mar 10, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20110031002
- Publication date Feb 10, 2011
- Fujitsu Limited
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20100315796
- Publication date Dec 16, 2010
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER DISPLAY ELEMENT AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20100097550
- Publication date Apr 22, 2010
- Fujitsu Limited
- Hisashi Yamaguchi
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for fabricating the same
- Publication number 20080134499
- Publication date Jun 12, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20080073110
- Publication date Mar 27, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and method for fabricating the same
- Publication number 20070090546
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of connecting base materials
- Publication number 20050227474
- Publication date Oct 13, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS

Taiji Sakai

Person

Patents Grantslast 30 patents

Waveguide member and waveguide layered product

Multilayer substrate

Electronic device, method of manufacturing electronic device, and e...

Circuit board, method of manufacturing circuit board, and electroni...

Electronic apparatus, fabrication method therefor and electronic part

Electronic device, method for manufacturing the electronic device,...

Method of manufacturing an electronic device, and electronic device...

Conductive material, conductive paste, circuit board, and semicondu...

Method for forming bumps, semiconductor device and method for manuf...

Electronic device having electrodes bonded with each other

Electronic device having electrodes bonded with each other

Method of manufacturing a printed wiring board

Conductive material, conductive paste, circuit board, and semicondu...

Method for manufacturing interposer

Method of manufacturing semiconductor device

Interposer and method for manufacturing the same

Multi-layer display element and manufacturing method for the same

Method for fabricating an interposer

Method of connecting base materials

Interposer and method for fabricating the same

Patents Applicationslast 30 patents

WAVEGUIDE MEMBER AND WAVEGUIDE LAYERED PRODUCT

SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE

MULTILAYER SUBSTRATE

WIRING SUBSTRATE AND ELECTRONIC DEVICE

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND E...

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC APPARATUS, FABRICATION METHOD THEREFOR AND ELECTRONIC PART

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE,...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Interposer and method for manufacturing the same

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...

MULTI-LAYER DISPLAY ELEMENT AND MANUFACTURING METHOD FOR THE SAME

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

Interposer and method for fabricating the same

Interposer and method for manufacturing the same

Interposer and method for fabricating the same

Method of connecting base materials

Method for forming bumps, semiconductor device and method for manuf...