Takashi Kanda

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Board and electronic device
- Patent number 10,264,673
- Issue date Apr 16, 2019
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic equipment and beacon
- Patent number 10,210,720
- Issue date Feb 19, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package, electronic device, and solder mounting method
- Patent number 10,137,518
- Issue date Nov 27, 2018
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 9,532,469
- Issue date Dec 27, 2016
- Fujitsu Limited
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package mounting structure
- Patent number 9,515,005
- Issue date Dec 6, 2016
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing layered circuit board, layered circuit boa...
- Patent number 9,445,511
- Issue date Sep 13, 2016
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked structure and manufacturing method of the same
- Patent number 9,265,159
- Issue date Feb 16, 2016
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device mounting structure
- Patent number 8,866,270
- Issue date Oct 21, 2014
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting structure, method of manufacturing th...
- Patent number 8,716,839
- Issue date May 6, 2014
- Fujitsu Limited
- Manabu Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless base station and control method thereof
- Patent number 8,224,385
- Issue date Jul 17, 2012
- Fujitsu Limited
- Takashi Kanda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 8,168,471
- Issue date May 1, 2012
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making printed wiring board and method of making printed...
- Patent number 8,152,953
- Issue date Apr 10, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio communication system, base transceiver station, and extension...
- Patent number 8,131,309
- Issue date Mar 6, 2012
- Fujitsu Limited
- Nao Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board
- Patent number 8,119,923
- Issue date Feb 21, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio communication apparatus, radio communication system and signa...
- Patent number 8,116,816
- Issue date Feb 14, 2012
- Fujitsu Limited
- Takashi Kanda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing hybrid printed circuit board
- Patent number 8,061,022
- Issue date Nov 22, 2011
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multilayer board
- Patent number 7,943,001
- Issue date May 17, 2011
- Fujitsu Limited
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended radio base station system having broadcast wave retransmit...
- Patent number 7,756,469
- Issue date Jul 13, 2010
- Fujitsu Limited
- Takashi Kanda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Layered board and electronic apparatus having the layered board
- Patent number 7,393,580
- Issue date Jul 1, 2008
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,291,901
- Issue date Nov 6, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,268,002
- Issue date Sep 11, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,102,228
- Issue date Sep 5, 2006
- Fujitsu Limited
- Takashi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stiffener
- Patent number 7,053,493
- Issue date May 30, 2006
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board unit for optical transmission and mounting method
- Patent number 6,959,125
- Issue date Oct 25, 2005
- Fujitsu Limited
- Takashi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink structure for cooling a substrate and an electronic appar...
- Patent number 5,894,882
- Issue date Apr 20, 1999
- Fujitsu Limited
- Shunichi Kikuchi
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LASER WAVELENGTH CONTROL DEVICE AND METHOD FOR CONTROLLING LASER WA...
- Publication number 20210218226
- Publication date Jul 15, 2021
- Fujitsu Limited
- Takashi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200245484
- Publication date Jul 30, 2020
- Fujitsu Limited
- TAKASHI KANDA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WIRING BOARD AND ELECTRONIC APPARATUS
- Publication number 20180035536
- Publication date Feb 1, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD AND ELECTRONIC DEVICE
- Publication number 20180027654
- Publication date Jan 25, 2018
- Fujitsu Limited
- TAKASHI KANDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC EQUIPMENT AND BEACON
- Publication number 20170345264
- Publication date Nov 30, 2017
- Fujitsu Limited
- Takayoshi Matsumura
- F21 - LIGHTING
Information Patent Application
METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOA...
- Publication number 20160360617
- Publication date Dec 8, 2016
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND SOLDER MOUNTING METHOD
- Publication number 20160255728
- Publication date Sep 1, 2016
- Fujitsu Limited
- Takashi KANDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED CHIP AND LAMINATED CHIP MANUFACTURING METHOD
- Publication number 20160211243
- Publication date Jul 21, 2016
- Fujitsu Limited
- MAKOTO SUWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE
- Publication number 20160118322
- Publication date Apr 28, 2016
- FUJITSU LIMITED
- TAKASHI KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20150008018
- Publication date Jan 8, 2015
- Fujitsu Limited
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE MOUNTING STRUCTURE
- Publication number 20140376187
- Publication date Dec 25, 2014
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140318840
- Publication date Oct 30, 2014
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
- Publication number 20140193953
- Publication date Jul 10, 2014
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING TH...
- Publication number 20130341767
- Publication date Dec 26, 2013
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE
- Publication number 20130340249
- Publication date Dec 26, 2013
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOA...
- Publication number 20130126221
- Publication date May 23, 2013
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF...
- Publication number 20110100690
- Publication date May 5, 2011
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wireless Base Station And Control Method Thereof
- Publication number 20100157949
- Publication date Jun 24, 2010
- Fujitsu Limited
- Takashi Kanda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20100151632
- Publication date Jun 17, 2010
- Fujitsu Limited
- Takashi KANDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO COMMUNICATION APPARATUS, RADIO COMMUNICATION SYSTEM AND SIGNA...
- Publication number 20100130147
- Publication date May 27, 2010
- Fujitsu Limited
- Takashi KANDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED...
- Publication number 20090294056
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE B...
- Publication number 20090294160
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20090084590
- Publication date Apr 2, 2009
- FUJITSU LIMITED
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING HYBRID PRINTED CIRCUIT BOARD
- Publication number 20080222885
- Publication date Sep 18, 2008
- FUJITSU LIMITED
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extended radio base station system having braodcast wave retransmit...
- Publication number 20080081553
- Publication date Apr 3, 2008
- FUJITSU LIMITED
- Takashi Kanda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Process for producing multilayer board
- Publication number 20070289706
- Publication date Dec 20, 2007
- FUJITSU LIMITED
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio communication system, base transceiver station, and extension...
- Publication number 20070232353
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Nao Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device and manufacturing method of a semiconductor de...
- Publication number 20070222039
- Publication date Sep 27, 2007
- FUJITSU LIMITED
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layered board and electronic apparatus having the layered board
- Publication number 20070009718
- Publication date Jan 11, 2007
- FUJITSU LIMITED
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layered board and manufacturing method of the same, electronic appa...
- Publication number 20060168803
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takashi Kanda

Person

Patents Grantslast 30 patents

Board and electronic device

Electronic equipment and beacon

Semiconductor package, electronic device, and solder mounting method

Multilayer substrate

Package mounting structure

Method for manufacturing layered circuit board, layered circuit boa...

Stacked structure and manufacturing method of the same

Method of manufacturing semiconductor device mounting structure

Semiconductor device mounting structure, method of manufacturing th...

Wireless base station and control method thereof

Semiconductor device and manufacturing method of a semiconductor de...

Method of making printed wiring board and method of making printed...

Radio communication system, base transceiver station, and extension...

Circuit board

Radio communication apparatus, radio communication system and signa...

Method for manufacturing hybrid printed circuit board

Process for producing multilayer board

Extended radio base station system having broadcast wave retransmit...

Layered board and electronic apparatus having the layered board

Packaging method, packaging structure and package substrate for ele...

Packaging method, packaging structure and package substrate for ele...

Semiconductor device

Semiconductor device having stiffener

Printed board unit for optical transmission and mounting method

Heat sink structure for cooling a substrate and an electronic appar...

Patents Applicationslast 30 patents

LASER WAVELENGTH CONTROL DEVICE AND METHOD FOR CONTROLLING LASER WA...

ELECTRONIC DEVICE

WIRING BOARD AND ELECTRONIC APPARATUS

BOARD AND ELECTRONIC DEVICE

ELECTRONIC EQUIPMENT AND BEACON

METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOA...

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND SOLDER MOUNTING METHOD

LAMINATED CHIP AND LAMINATED CHIP MANUFACTURING METHOD

LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE

MULTILAYER SUBSTRATE

PACKAGE MOUNTING STRUCTURE

STACKED STRUCTURE AND MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING TH...

METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE

METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOA...

ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF...

Wireless Base Station And Control Method Thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

RADIO COMMUNICATION APPARATUS, RADIO COMMUNICATION SYSTEM AND SIGNA...

METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED...

METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE B...

CIRCUIT BOARD

METHOD FOR MANUFACTURING HYBRID PRINTED CIRCUIT BOARD

Extended radio base station system having braodcast wave retransmit...

Process for producing multilayer board

Radio communication system, base transceiver station, and extension...

Semiconductor device and manufacturing method of a semiconductor de...

Layered board and electronic apparatus having the layered board

Layered board and manufacturing method of the same, electronic appa...