Takeshi Nakamura

Person

Isesaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging board, semiconductor module, and portable apparatus
- Patent number 8,115,316
- Issue date Feb 14, 2012
- Sanyo Electric Co., LTD
- Yasuhiro Kohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device mounting board and semiconductor apparatus using the same
- Patent number 8,039,948
- Issue date Oct 18, 2011
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device and manufacturing method therefor
- Patent number 8,007,285
- Issue date Aug 30, 2011
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor device containing stacked se...
- Patent number 7,939,373
- Issue date May 10, 2011
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit device
- Patent number 7,854,062
- Issue date Dec 21, 2010
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device and manufacturing method thereof
- Patent number 7,768,132
- Issue date Aug 3, 2010
- Sanyo Electric Co., LTD
- Yusuke Igarashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with high process accuracy, manufacturing meth...
- Patent number 7,683,268
- Issue date Mar 23, 2010
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate manufacturing method
- Patent number 7,661,191
- Issue date Feb 16, 2010
- Sanyo Electric Co., LTD
- Takeshi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus
- Patent number 7,495,344
- Issue date Feb 24, 2009
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of fabricating the same
- Patent number 7,491,895
- Issue date Feb 17, 2009
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device with dummy elements
- Patent number 7,439,614
- Issue date Oct 21, 2008
- Sanyo Electric Co., LTD
- Yasunori Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device containing stacked semiconductor chips and man...
- Patent number 7,405,484
- Issue date Jul 29, 2008
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device and manufacturing method thereof
- Patent number 7,339,281
- Issue date Mar 4, 2008
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device and manufacturing method thereof
- Patent number 7,315,083
- Issue date Jan 1, 2008
- Sanyo Electric Co., Ltd.
- Yusuke Igarashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a circuit device
- Patent number 7,141,509
- Issue date Nov 28, 2006
- Sanyo Electric Co., LTD
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device having a multi-layer conductive path
- Patent number 6,936,927
- Issue date Aug 30, 2005
- Sanyo Electric Co., LTD
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,909,178
- Issue date Jun 21, 2005
- Sanyo Electric Co., Ltd.
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing sheet material and method of manufacturing...
- Patent number 6,889,428
- Issue date May 10, 2005
- Sanyo Electric Co., LTD
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a circuit device
- Patent number 6,883,231
- Issue date Apr 26, 2005
- Sanyo Electric Co. Ltd.
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a circuit device
- Patent number 6,780,676
- Issue date Aug 24, 2004
- Sanyo Electric Co., Ltd.
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a circuit device
- Patent number 6,720,209
- Issue date Apr 13, 2004
- Sanyo Electric Co., LTD
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a circuit device
- Patent number 6,664,138
- Issue date Dec 16, 2003
- Sanyo Electric Co., LTD
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20130003314
- Publication date Jan 3, 2013
- SANYO ELECTRONIC CO., LTD.
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110277318
- Publication date Nov 17, 2011
- Sanyo Electric Co., Ltd.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SE...
- Publication number 20110263121
- Publication date Oct 27, 2011
- Sanyo Electric Co., Ltd.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Mounting Board
- Publication number 20110011829
- Publication date Jan 20, 2011
- Sanyo Electric Co., Ltd.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE MOUNTING BOARD AND MANUFACTURING METHOD THEREFOR, AND SEMICO...
- Publication number 20090194322
- Publication date Aug 6, 2009
- Ryosuke USUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090149034
- Publication date Jun 11, 2009
- Sanyo Electric Co., Ltd.
- Ryosuke USUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Circuit Device
- Publication number 20090119915
- Publication date May 14, 2009
- Sanyo Electric Co., Ltd.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for semiconductor device containing stacked se...
- Publication number 20080311737
- Publication date Dec 18, 2008
- Sanyo Electric Co., Ltd.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20080299789
- Publication date Dec 4, 2008
- Sanyo Electric Co., Ltd.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging board, semiconductor module, and portable apparatus
- Publication number 20080061437
- Publication date Mar 13, 2008
- Sanyo Electric Co., Ltd.
- Yasuhiro Kohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Substrate Manufacturing Method
- Publication number 20070281459
- Publication date Dec 6, 2007
- Takeshi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device mounting board
- Publication number 20060012028
- Publication date Jan 19, 2006
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device and manufacturing method thereof
- Publication number 20060001166
- Publication date Jan 5, 2006
- Yusuke Igarashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device mounting board and semiconductor apparatus using the same
- Publication number 20050280148
- Publication date Dec 22, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device
- Publication number 20050272252
- Publication date Dec 8, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module with high process accuracy, manufacturing meth...
- Publication number 20050269128
- Publication date Dec 8, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate and method of fabricating the same
- Publication number 20050266214
- Publication date Dec 1, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device and manufacturing method thereof
- Publication number 20050263911
- Publication date Dec 1, 2005
- Yusuke Igarashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device
- Publication number 20050263846
- Publication date Dec 1, 2005
- Yasunori Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing circuit device
- Publication number 20050263905
- Publication date Dec 1, 2005
- Ryosuke Usul
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device and manufacturing method thereof
- Publication number 20050263895
- Publication date Dec 1, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device mounting board
- Publication number 20050238878
- Publication date Oct 27, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device mounting board and semiconductor apparatus using device moun...
- Publication number 20050218480
- Publication date Oct 6, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050206014
- Publication date Sep 22, 2005
- Sanyo Electric Co., Ltd., a Osaka, Japan corporation
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus
- Publication number 20050205996
- Publication date Sep 22, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device containing stacked semiconductor chips and man...
- Publication number 20050067686
- Publication date Mar 31, 2005
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device containing stacked semiconductor chips and man...
- Publication number 20050067682
- Publication date Mar 31, 2005
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and method of manufacturing the same
- Publication number 20040256742
- Publication date Dec 23, 2004
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating a circuit device
- Publication number 20040198050
- Publication date Oct 7, 2004
- Sanyo Electric Co., Ltd., an Osaka Japan Corporation
- Yusuke Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit devices and method for manufacturing the same
- Publication number 20040136123
- Publication date Jul 15, 2004
- Takeshi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi Nakamura

Person

Patents Grantslast 30 patents

Packaging board, semiconductor module, and portable apparatus

Device mounting board and semiconductor apparatus using the same

Circuit device and manufacturing method therefor

Manufacturing method for semiconductor device containing stacked se...

Method for manufacturing circuit device

Circuit device and manufacturing method thereof

Semiconductor module with high process accuracy, manufacturing meth...

Multilayer substrate manufacturing method

Semiconductor apparatus

Wiring substrate and method of fabricating the same

Circuit device with dummy elements

Semiconductor device containing stacked semiconductor chips and man...

Circuit device and manufacturing method thereof

Circuit device and manufacturing method thereof

Method for fabricating a circuit device

Circuit device having a multi-layer conductive path

Semiconductor device and method of manufacturing the same

Method of manufacturing sheet material and method of manufacturing...

Method for fabricating a circuit device

Method for fabricating a circuit device

Method for fabricating a circuit device

Method for fabricating a circuit device

Patents Applicationslast 30 patents

MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SE...

Device Mounting Board

DEVICE MOUNTING BOARD AND MANUFACTURING METHOD THEREFOR, AND SEMICO...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Method for Manufacturing Circuit Device

Manufacturing method for semiconductor device containing stacked se...

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

Packaging board, semiconductor module, and portable apparatus

Multilayer Substrate Manufacturing Method

Device mounting board

Circuit device and manufacturing method thereof

Device mounting board and semiconductor apparatus using the same

Circuit device

Semiconductor module with high process accuracy, manufacturing meth...

Wiring substrate and method of fabricating the same

Circuit device and manufacturing method thereof

Circuit device

Method for manufacturing circuit device

Circuit device and manufacturing method thereof

Device mounting board

Device mounting board and semiconductor apparatus using device moun...

Semiconductor device and method of manufacturing the same

Semiconductor apparatus

Semiconductor device containing stacked semiconductor chips and man...

Semiconductor device containing stacked semiconductor chips and man...

Semiconductor module and method of manufacturing the same

Method for fabricating a circuit device

Circuit devices and method for manufacturing the same