Takuo Funaya

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for predicting reliability of semiconductor device
- Patent number 12,152,997
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with coils in different wiring layers
- Patent number 10,483,199
- Issue date Nov 19, 2019
- Renesas Electronics Corporation
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,157,974
- Issue date Dec 18, 2018
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,128,125
- Issue date Nov 13, 2018
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and manufacturing method therefor
- Patent number 10,085,425
- Issue date Oct 2, 2018
- Renesas Electronics Corporation
- Takuo Funaya
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device with inductively coupled coils
- Patent number 10,062,642
- Issue date Aug 28, 2018
- Renesas Electronics Corporation
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,818,815
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,805,950
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with coils in different wiring layers
- Patent number 9,711,451
- Issue date Jul 18, 2017
- Renesas Electronics Corporation
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,653,396
- Issue date May 16, 2017
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,536,828
- Issue date Jan 3, 2017
- Renesas Electronics Corporation
- Shinichi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,502,489
- Issue date Nov 22, 2016
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,219,108
- Issue date Dec 22, 2015
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,987,861
- Issue date Mar 24, 2015
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,975,150
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring board capable of containing functional element and method fo...
- Patent number 8,692,135
- Issue date Apr 8, 2014
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,536,691
- Issue date Sep 17, 2013
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for designing the same
- Patent number 8,450,843
- Issue date May 28, 2013
- NEC Corporation
- Hideki Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including an LSI chip and a method for manufac...
- Patent number 8,043,953
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,035,217
- Issue date Oct 11, 2011
- NEC Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring board, semiconductor device using wiring board and their man...
- Patent number 7,911,038
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, and mounted components using the same
- Patent number 7,829,199
- Issue date Nov 9, 2010
- NEC Corporation
- Takuo Funaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 7,816,782
- Issue date Oct 19, 2010
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor device module and method of man...
- Patent number 7,692,297
- Issue date Apr 6, 2010
- NEC Electronics Corporation
- Takashi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 7,674,989
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device assembly and a method of connecting electronic de...
- Patent number 6,798,070
- Issue date Sep 28, 2004
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREDICTING RELIABILITY OF SEMICONDUCTOR DEVICE
- Publication number 20220260504
- Publication date Aug 18, 2022
- RENESAS ELECTRONICS CORPORATION
- Takuo FUNAYA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180337124
- Publication date Nov 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREFOR
- Publication number 20180310529
- Publication date Nov 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180294239
- Publication date Oct 11, 2018
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180069073
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180061662
- Publication date Mar 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Takuo FUNAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170317024
- Publication date Nov 2, 2017
- RENESAS ELECTRONICS CORPORATION
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170194164
- Publication date Jul 6, 2017
- RENESAS ELECTRONICS CORPORATION
- Takuo FUNAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160087025
- Publication date Mar 24, 2016
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160035672
- Publication date Feb 4, 2016
- RENESAS ELECTRONICS CORPORATION
- Takuo FUNAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160027732
- Publication date Jan 28, 2016
- RENESAS ELECTRONICS CORPORATION
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREFOR
- Publication number 20160000045
- Publication date Jan 7, 2016
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150318245
- Publication date Nov 5, 2015
- Renesas Electronics Corporation
- Shinichi UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150206934
- Publication date Jul 23, 2015
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150162395
- Publication date Jun 11, 2015
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140175602
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
- Publication number 20130237055
- Publication date Sep 12, 2013
- IMEC
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE
- Publication number 20120156453
- Publication date Jun 21, 2012
- NEC Corporation
- Mario GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110281401
- Publication date Nov 17, 2011
- RENESAS ELECTRONICS CORPORATION
- Kentaro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FO...
- Publication number 20110155433
- Publication date Jun 30, 2011
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...
- Publication number 20110003472
- Publication date Jan 6, 2011
- NEC Corporation
- Hideya MURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR DESIGNING THE SAME
- Publication number 20100237492
- Publication date Sep 23, 2010
- Hideki Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...
- Publication number 20100232127
- Publication date Sep 16, 2010
- NEC ELECTRONICS CORPORATION
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20100103634
- Publication date Apr 29, 2010
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTU...
- Publication number 20100044845
- Publication date Feb 25, 2010
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...
- Publication number 20090315190
- Publication date Dec 24, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090294951
- Publication date Dec 3, 2009
- NEC CORPORATION
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090283895
- Publication date Nov 19, 2009
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHO...
- Publication number 20090046441
- Publication date Feb 19, 2009
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takuo Funaya

Person

Patents Grantslast 30 patents

Method for predicting reliability of semiconductor device

Semiconductor device

Semiconductor device with coils in different wiring layers

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Electronic apparatus and manufacturing method therefor

Semiconductor device with inductively coupled coils

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with coils in different wiring layers

Semiconductor device and method of manufacturing the same

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing method

Wiring board capable of containing functional element and method fo...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for designing the same

Method of manufacturing a wiring board

Wiring substrate for mounting semiconductors, method of manufacturi...

Semiconductor device including an LSI chip and a method for manufac...

Semiconductor device and method for manufacturing same

Wiring board, semiconductor device using wiring board and their man...

Wiring board, method for manufacturing same, and semiconductor package

Solder, and mounted components using the same

Wiring substrate for mounting semiconductors, method of manufacturi...

Semiconductor device, semiconductor device module and method of man...

Wiring board and method for manufacturing the same

Electronic device assembly and a method of connecting electronic de...

Patents Applicationslast 30 patents

METHOD FOR PREDICTING RELIABILITY OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT

CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FO...

METHOD OF MANUFACTURING A WIRING BOARD

WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE AND METHOD FOR DESIGNING THE SAME

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING...

CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTU...

WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHO...