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Tetsuya Nakatsuka

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Sealing Structure and Manufacturing Method Thereof
    • Publication number 20200303272
    • Publication date Sep 24, 2020
    • Hitachi, Ltd
    • Tetsuya NAKATSUKA
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Pb-FREE SOLDER-CONNECTED STRUCTURE
    • Publication number 20130286621
    • Publication date Oct 31, 2013
    • Hanae Shimokawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MAGNETIC DISK DEVICE
    • Publication number 20100328815
    • Publication date Dec 30, 2010
    • Hitachi, Ltd
    • Tetsuya Nakatsuka
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    Pb-free solder-connected structure and electronic device
    • Publication number 20100214753
    • Publication date Aug 26, 2010
    • Hanae Shimokawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDERING METHOD AND SOLDERING APPARATUS
    • Publication number 20100006624
    • Publication date Jan 14, 2010
    • Hitachi, Ltd.
    • Tetsuya Nakatsuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Mounting Substrate Suitable for Use to Install Surface Mount Compon...
    • Publication number 20080261001
    • Publication date Oct 23, 2008
    • Tetsuya Nakatsuka
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    MOUNTING STRUCTURE
    • Publication number 20080062665
    • Publication date Mar 13, 2008
    • Tetsuya NAKATSUKA
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRONIC COMPONENT WITH LEAD USING PB-FREE SOLDER
    • Publication number 20070210139
    • Publication date Sep 13, 2007
    • Tetsuya NAKATSUKA
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Solder composition for electronic devices
    • Publication number 20070031279
    • Publication date Feb 8, 2007
    • Renesas Technology Corporation
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Reflow soldering method using Pb-free solder alloy and hybrid packa...
    • Publication number 20060239855
    • Publication date Oct 26, 2006
    • Tetsuya Nakatsuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic device
    • Publication number 20060145352
    • Publication date Jul 6, 2006
    • Hitachi, Ltd
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Pb-free solder-connected structure and electronic device
    • Publication number 20060115994
    • Publication date Jun 1, 2006
    • Hanae Shimokawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder foil semiconductor device and electronic device
    • Publication number 20060061974
    • Publication date Mar 23, 2006
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic device
    • Publication number 20040007384
    • Publication date Jan 15, 2004
    • Hitachi, Ltd
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder
    • Publication number 20030224197
    • Publication date Dec 4, 2003
    • Hitachi, Ltd
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Packaging method using lead-free solder
    • Publication number 20030201310
    • Publication date Oct 30, 2003
    • Hitachi, Ltd
    • Tetsuya Nakatsuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electron device and semiconductor device
    • Publication number 20030186072
    • Publication date Oct 2, 2003
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wave soldering method using lead-free solder, apparatus therefor, a...
    • Publication number 20030116352
    • Publication date Jun 26, 2003
    • Hitachi, Ltd
    • Tetsuya Nakatsuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Packaging method using lead-free solder
    • Publication number 20030034381
    • Publication date Feb 20, 2003
    • Tetsuya Nakatsuka
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor device having solder bumps reliably reflow solderable
    • Publication number 20030030149
    • Publication date Feb 13, 2003
    • Kazuma Miura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device
    • Publication number 20020171157
    • Publication date Nov 21, 2002
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Pb-free solder-connected structure and electronic device
    • Publication number 20020163085
    • Publication date Nov 7, 2002
    • Hanae Shimokawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Product using Zn-Al alloy solder
    • Publication number 20020149114
    • Publication date Oct 17, 2002
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electronic device
    • Publication number 20020114726
    • Publication date Aug 22, 2002
    • Hitachi, Ltd
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electronic device
    • Publication number 20020100986
    • Publication date Aug 1, 2002
    • Hitachi, Ltd
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electron device and semiconductor device
    • Publication number 20020066583
    • Publication date Jun 6, 2002
    • Tasao Soga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pb-free solder-connected structure and electronic device
    • Publication number 20020019077
    • Publication date Feb 14, 2002
    • Hanae Shimokawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Technical field
    • Publication number 20020009610
    • Publication date Jan 24, 2002
    • Hanae Shimokawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor module and circuit substrate
    • Publication number 20010050181
    • Publication date Dec 13, 2001
    • Kazuma Miura
    • H01 - BASIC ELECTRIC ELEMENTS