Thomas Heaton

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,009,271
- Issue date Jun 11, 2024
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,854,541
- Issue date Dec 1, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,431,537
- Issue date Oct 1, 2019
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20240258183
- Publication date Aug 1, 2024
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
- Publication number 20240217216
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...
- Publication number 20240186136
- Publication date Jun 6, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE
- Publication number 20240173953
- Publication date May 30, 2024
- Intel Corporation
- Joshua STACEY
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM FOR COATING METHOD
- Publication number 20240105476
- Publication date Mar 28, 2024
- Intel Corporation
- Whitney BRYKS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20230343723
- Publication date Oct 26, 2023
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20230015619
- Publication date Jan 19, 2023
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20220199515
- Publication date Jun 23, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20210082852
- Publication date Mar 18, 2021
- Intel Corporation
- Bradon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
- Publication number 20210066162
- Publication date Mar 4, 2021
- Intel Corporation
- Sergio A. CHAN ARGUEDAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20210035921
- Publication date Feb 4, 2021
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20210035901
- Publication date Feb 4, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20210020531
- Publication date Jan 21, 2021
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20200135679
- Publication date Apr 30, 2020
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POCKET STRUCTURES, MATERIALS, AND METHODS FOR INTEGRATED CIRCUIT PA...
- Publication number 20200066626
- Publication date Feb 27, 2020
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
- Publication number 20200006273
- Publication date Jan 2, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20190393145
- Publication date Dec 26, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Heaton

Person

Patents Grantslast 30 patents

Protruding SN substrate features for epoxy flow control

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Corner guard for improved electroplated first level interconnect bu...

Electromigration resistant and profile consistent contact arrays

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Patents Applicationslast 30 patents

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...

METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE

SYSTEM FOR COATING METHOD

THIN FILM CAPACITORS

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

POCKET STRUCTURES, MATERIALS, AND METHODS FOR INTEGRATED CIRCUIT PA...

MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS