Thomas Workman

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct gang bonding methods including directly bonding first elemen...
- Patent number 12,080,672
- Issue date Sep 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,296,053
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly comprising solderable thermal interface and met...
- Patent number 7,091,063
- Issue date Aug 15, 2006
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly comprising solderable thermal interface
- Patent number 6,724,078
- Issue date Apr 20, 2004
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20250054837
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Thomas WORKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
- Publication number 20250006689
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20240387439
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANDEM OLED DEVICES WITH STABLE INORGANIC CHARGE GENERATION LAYERS
- Publication number 20240334733
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Oliver Zhao
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20240266255
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20240203948
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID THERMAL PROCESSING FOR DIRECT BONDING
- Publication number 20240079376
- Publication date Mar 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Dominik Suwito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR D...
- Publication number 20240055407
- Publication date Feb 15, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Thomas Workman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROL FOR BONDING
- Publication number 20230299029
- Publication date Sep 21, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230268300
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
- Publication number 20230207474
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DIE BOND CONTROL
- Publication number 20230207514
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC DEVICES
- Publication number 20230142680
- Publication date May 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gabriel Z. Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING THIN SUBSTRATES
- Publication number 20230115122
- Publication date Apr 13, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20220293567
- Publication date Sep 15, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20210098412
- Publication date Apr 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20200411483
- Publication date Dec 31, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly comprising solderable thermal interface and met...
- Publication number 20040155329
- Publication date Aug 12, 2004
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Workman

Person

Patents Grantslast 30 patents

Direct gang bonding methods including directly bonding first elemen...

Direct bonded stack structures for increased reliability and improv...

Direct bonded stack structures for increased reliability and improv...

Electronic assembly comprising solderable thermal interface and met...

Electronic assembly comprising solderable thermal interface

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COOLING STRUCTURES

STRUCTURES AND METHODS FOR BONDING DIES

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

DIRECT GANG BONDING METHODS AND STRUCTURES

TANDEM OLED DEVICES WITH STABLE INORGANIC CHARGE GENERATION LAYERS

ELECTRONIC DEVICE COOLING STRUCTURES

DEBONDING REPAIR DEVICES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

BONDED STRUCTURE AND METHOD OF FORMING SAME

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

RAPID THERMAL PROCESSING FOR DIRECT BONDING

BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR D...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

LOW TEMPERATURE DIRECT BONDING

EXPANSION CONTROL FOR BONDING

BONDED STRUCTURES

BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES

APPARATUSES AND METHODS FOR DIE BOND CONTROL

STACKED ELECTRONIC DEVICES

METHOD OF BONDING THIN SUBSTRATES

DIRECT BONDING METHODS AND STRUCTURES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

DIRECT GANG BONDING METHODS AND STRUCTURES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

Electronic assembly comprising solderable thermal interface and met...