Thorsten MEYER

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation source device
- Patent number 12,158,448
- Issue date Dec 3, 2024
- Infineon Technologies AG
- Derek Debie
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packages including electrical redistribution layers o...
- Patent number 12,154,886
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact trenches extending from opposit...
- Patent number 12,136,670
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with elevated lead and structure extending vertically from...
- Patent number 11,862,582
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with separate substrate sections
- Patent number 11,710,684
- Issue date Jul 25, 2023
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an electrical contact with a metal l...
- Patent number 11,552,048
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Predictive chip-maintenance
- Patent number 11,531,056
- Issue date Dec 20, 2022
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of one or more carrier bodies and electronic components...
- Patent number 11,502,042
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor flip-chip package
- Patent number 11,393,742
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plastic waveguide
- Patent number 11,387,533
- Issue date Jul 12, 2022
- Infineon Technologies AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
- Patent number 11,264,356
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,250,981
- Issue date Feb 15, 2022
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor panels, semiconductor packages, and methods for manuf...
- Patent number 11,171,066
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad extensions formed on molded appe...
- Patent number 11,081,455
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 10,964,628
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 10,903,166
- Issue date Jan 26, 2021
- Intel IP Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 10,784,033
- Issue date Sep 22, 2020
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising carrier with chip and component mounted via opening
- Patent number 10,777,491
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...
- Publication number 20240266237
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGE...
- Publication number 20240162129
- Publication date May 16, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- B82 - NANO-TECHNOLOGY
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
- Publication number 20240105678
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE POWER CONVERTER
- Publication number 20240039421
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Thorsten MEYER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240030200
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Christian Irrgang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION SOURCE DEVICE
- Publication number 20230194478
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Derek Debie
- G01 - MEASURING TESTING
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20230117806
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Semiconductor Die and a Carrier b...
- Publication number 20220301959
- Publication date Sep 22, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Contact Trenches Extending from Opposit...
- Publication number 20220285550
- Publication date Sep 8, 2022
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...
- Publication number 20220165687
- Publication date May 26, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS O...
- Publication number 20220157774
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20220122756
- Publication date Apr 21, 2022
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Pin in the Form of a Dril...
- Publication number 20220005755
- Publication date Jan 6, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREDICTIVE CHIP-MAINTENANCE
- Publication number 20210325445
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20210166998
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL L...
- Publication number 20210167036
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Oliver HELLMUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SEPARATE SUBSTRATE SECTIONS
- Publication number 20210111108
- Publication date Apr 15, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Lead Package Formation Method
- Publication number 20210043603
- Publication date Feb 11, 2021
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...
- Publication number 20210005557
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Flip-Chip Package
- Publication number 20200388561
- Publication date Dec 10, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20200381161
- Publication date Dec 3, 2020
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...
- Publication number 20200365553
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...
- Publication number 20200343205
- Publication date Oct 29, 2020
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273790
- Publication date Aug 27, 2020
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS

Thorsten MEYER

Person

Patents Grantslast 30 patents

Semiconductor package with metal posts from structured leadframe

Radiation source device

Semiconductor packages including electrical redistribution layers o...

Semiconductor device having contact trenches extending from opposit...

Semiconductor device having an antenna arranged over an active main...

Vertical inductor for WLCSP

Semiconductor device package comprising a pin in the form of a dril...

Package with elevated lead and structure extending vertically from...

Package with separate substrate sections

Flat lead package formation method

Semiconductor device including an electrical contact with a metal l...

Predictive chip-maintenance

Clip frame assembly, semiconductor package having a lead frame and...

Processing of one or more carrier bodies and electronic components...

Method for fabricating a semiconductor flip-chip package

Semiconductor package with plastic waveguide

Multi-purpose non-linear semiconductor package assembly line

Batch manufacture of packages by sheet separated into carriers afte...

Vertical inductor for WLCSP

Semiconductor panels, semiconductor packages, and methods for manuf...

Semiconductor device with bond pad extensions formed on molded appe...

Clip frame assembly, semiconductor package having a lead frame and...

Electronic device including redistribution layer pad having a void

Integrated circuit packages

Semiconductor package system

Vertical inductor for WLCSP

Package comprising carrier with chip and component mounted via opening

Metallic interconnect, a method of manufacturing a metallic interco...

Package with vertical interconnect between carrier and clip

Reinforcement for electrical connectors

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE SHIELDING STRUCTURE

A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGE...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

MULTI-PHASE POWER CONVERTER

SEMICONDUCTOR PACKAGE AND METHOD

RADIATION SOURCE DEVICE

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

Semiconductor Device Comprising a Semiconductor Die and a Carrier b...

Semiconductor Device Having Contact Trenches Extending from Opposit...

PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...

SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS O...

VERTICAL INDUCTOR FOR WLCSP

Semiconductor Device Package Comprising a Pin in the Form of a Dril...

PREDICTIVE CHIP-MAINTENANCE

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL L...

PACKAGE WITH SEPARATE SUBSTRATE SECTIONS

Flat Lead Package Formation Method

PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...

Method for Fabricating a Semiconductor Flip-Chip Package

VERTICAL INDUCTOR FOR WLCSP

BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...

Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...

Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...