Tomohiro Saito

Person

Tachikawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor
- Patent number 11,169,035
- Issue date Nov 9, 2021
- Kabushiki Kaisha Toshiba
- Kei Masunishi
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor
- Patent number 10,908,035
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Kei Masunishi
- G01 - MEASURING TESTING
Information Patent Grant
MEMS and method of manufacturing the same
- Patent number 9,287,050
- Issue date Mar 15, 2016
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing the same
- Patent number 9,230,744
- Issue date Jan 5, 2016
- Kabushiki Kaisha Toshiba
- Kei Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrical component and method of manufacturing the same
- Patent number 9,126,824
- Issue date Sep 8, 2015
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solid-state image sensing device
- Patent number 9,117,724
- Issue date Aug 25, 2015
- Hitachi, Ltd.
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS element and method of manufacturing the same
- Patent number 8,686,816
- Issue date Apr 1, 2014
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a movable structure
- Patent number 8,564,928
- Issue date Oct 22, 2013
- Kabushiki Kaisha Toshiba
- Tamio Ikehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor device
- Patent number 8,405,178
- Issue date Mar 26, 2013
- Hitachi, Ltd.
- Shinya Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,915,130
- Issue date Mar 29, 2011
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,754,593
- Issue date Jul 13, 2010
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 7,709,395
- Issue date May 4, 2010
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,579,231
- Issue date Aug 25, 2009
- Kabushiki Kaisha Toshiba
- Kouji Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,573,106
- Issue date Aug 11, 2009
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,521,309
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Akio Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 7,479,423
- Issue date Jan 20, 2009
- Kabushiki Kaisha Toshiba
- Atsushi Yagishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,422,947
- Issue date Sep 9, 2008
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,405,133
- Issue date Jul 29, 2008
- Kabushiki Kaisha Toshiba
- Katsuaki Natori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,242,064
- Issue date Jul 10, 2007
- Kabushiki Kaisha Toshiba
- Atsushi Yagishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 7,198,994
- Issue date Apr 3, 2007
- Kabushiki Kaisha Toshiba
- Atsushi Yagishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including insulating film having a convex portion
- Patent number 7,166,895
- Issue date Jan 23, 2007
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 7,098,120
- Issue date Aug 29, 2006
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including forming a...
- Patent number 7,084,022
- Issue date Aug 1, 2006
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,022,580
- Issue date Apr 4, 2006
- Kabushiki Kaisha Toshiba
- Katsuaki Natori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low resistivity source and drain electr...
- Patent number 6,958,500
- Issue date Oct 25, 2005
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 6,933,564
- Issue date Aug 23, 2005
- Renesas Technology Corp.
- Youhei Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,908,801
- Issue date Jun 21, 2005
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,881,631
- Issue date Apr 19, 2005
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 6,879,001
- Issue date Apr 12, 2005
- Kabushiki Kaisha Toshiba
- Atsushi Yagishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital demodulator
- Patent number 6,813,321
- Issue date Nov 2, 2004
- Kabushiki Kaisha Kenwood
- Hisakazu Katoh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321544
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED PARTICLE BEAM PATTERN FORMING DEVICE AND CHARGED PARTICLE B...
- Publication number 20230298848
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Hiroko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230238344
- Publication date Jul 27, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR
- Publication number 20210041311
- Publication date Feb 11, 2021
- Kabushiki Kaisha Toshiba
- Kei Masunishi
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR
- Publication number 20200300717
- Publication date Sep 24, 2020
- Kabushiki Kaisha Toshiba
- Kei Masunishi
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE
- Publication number 20200039813
- Publication date Feb 6, 2020
- KABUSHIKI KAISHA TOSHIBA
- Akira Fujimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SENSOR
- Publication number 20190084825
- Publication date Mar 21, 2019
- Kabushiki Kaisha Toshiba
- Hideyuki TOMIZAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR
- Publication number 20170108391
- Publication date Apr 20, 2017
- Kabushiki Kaisha Toshiba
- Tamio IKEHASHI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160272484
- Publication date Sep 22, 2016
- Kabushiki Kaisha Toshiba
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150284242
- Publication date Oct 8, 2015
- Kabushiki Kaisha Toshiba
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLID-STATE IMAGE SENSING DEVICE
- Publication number 20150194458
- Publication date Jul 9, 2015
- Hitachi, Ltd
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291780
- Publication date Oct 2, 2014
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140284730
- Publication date Sep 25, 2014
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140231934
- Publication date Aug 21, 2014
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130285164
- Publication date Oct 31, 2013
- Kabushiki Kaisha Toshiba
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLID-STATE IMAGE SENSING DEVICE
- Publication number 20130215308
- Publication date Aug 22, 2013
- Hitachi, Ltd
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130182366
- Publication date Jul 18, 2013
- Kei Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120228726
- Publication date Sep 13, 2012
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS APPARATUS
- Publication number 20120018818
- Publication date Jan 26, 2012
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE
- Publication number 20110063774
- Publication date Mar 17, 2011
- Kabushiki Kaisha Toshiba
- Tamio Ikehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-State Image Sensor Device
- Publication number 20110037134
- Publication date Feb 17, 2011
- Hitachi, Ltd
- Shinya SUGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100213039
- Publication date Aug 26, 2010
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100035396
- Publication date Feb 11, 2010
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20080293226
- Publication date Nov 27, 2008
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20080197429
- Publication date Aug 21, 2008
- Motoyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20080138969
- Publication date Jun 12, 2008
- Akio Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070284583
- Publication date Dec 13, 2007
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070278587
- Publication date Dec 6, 2007
- Tomonori Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20070148937
- Publication date Jun 28, 2007
- Kabushiki Kaisha Toshiba
- Atsushi Yagishita
- H01 - BASIC ELECTRIC ELEMENTS

Tomohiro Saito

Person

Patents Grantslast 30 patents

Pressure sensor

Pressure sensor

MEMS and method of manufacturing the same

MEMS device and method of manufacturing the same

Electrical component and method of manufacturing the same

Solid-state image sensing device

MEMS element and method of manufacturing the same

MEMS device having a movable structure

Solid-state image sensor device

Method of manufacturing a semiconductor device

Semiconductor device and manufacturing method therefor

Semiconductor device fabrication method

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device including insulating film having a convex portion

Method of manufacturing semiconductor devices

Method of manufacturing a semiconductor device including forming a...

Semiconductor device and method for manufacturing the same

Semiconductor device having low resistivity source and drain electr...

Semiconductor integrated circuit device and method of manufacturing...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Digital demodulator

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHARGED PARTICLE BEAM PATTERN FORMING DEVICE AND CHARGED PARTICLE B...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

PRESSURE SENSOR

PRESSURE SENSOR

MEMS DEVICE

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SENSOR

SENSOR

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME

SOLID-STATE IMAGE SENSING DEVICE

MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME

MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

SOLID-STATE IMAGE SENSING DEVICE

MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMS AND METHOD OF MANUFACTURING THE SAME

MEMS APPARATUS

MEMS DEVICE

Solid-State Image Sensor Device

MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Method of Manufacturing Semiconductor Device

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device