Toshihiro Miyake

Person

Inuyama-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,041,753
- Issue date Jul 16, 2024
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure, electronic device and method for manufacturing the...
- Patent number 11,849,566
- Issue date Dec 19, 2023
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,538,733
- Issue date Dec 27, 2022
- Denso Corporation
- Toshihiro Miyake
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite material, method for forming the composite material, elec...
- Patent number 9,970,121
- Issue date May 15, 2018
- Denso Corporation
- Kenji Ochi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic apparatus and manufacturing method of electronic apparatus
- Patent number 9,743,531
- Issue date Aug 22, 2017
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure
- Patent number 9,698,506
- Issue date Jul 4, 2017
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material, electric contact electrode, electric contact fi...
- Patent number 9,305,676
- Issue date Apr 5, 2016
- Denso Corporation
- Toshihiro Miyake
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Press-fit pin, connection structure including the press-fit pin, an...
- Patent number 9,093,780
- Issue date Jul 28, 2015
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card edge connector and method of manufacturing the same
- Patent number 8,187,038
- Issue date May 29, 2012
- Denso Corporation
- Takashi Kamiya
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Card edge connector and method for assembling the same
- Patent number 7,931,502
- Issue date Apr 26, 2011
- Denso Corporation
- Taku Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Card edge connector and method of manufacturing the same
- Patent number 7,748,988
- Issue date Jul 6, 2010
- Denso Corporation
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card edge connector and method of manufacturing the same
- Patent number 7,628,654
- Issue date Dec 8, 2009
- Nippon Soken, Inc.
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding method
- Patent number 7,481,353
- Issue date Jan 27, 2009
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and circuit board connection structure
- Patent number 7,417,195
- Issue date Aug 26, 2008
- Denso Corporation
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with a built-in passive device, manufacturing...
- Patent number 7,286,367
- Issue date Oct 23, 2007
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board with embedded electri...
- Patent number 7,165,321
- Issue date Jan 23, 2007
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting printed circuit boards and connected printed...
- Patent number 7,080,445
- Issue date Jul 25, 2006
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of printed circuit boards
- Patent number 6,966,482
- Issue date Nov 22, 2005
- Denso Corporation
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection structure for interconnecting printed circuit boards
- Patent number 6,784,375
- Issue date Aug 31, 2004
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of connecting circuit boards
- Patent number 6,769,598
- Issue date Aug 3, 2004
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of connecting circuit boards
- Patent number 6,719,187
- Issue date Apr 13, 2004
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with embedded electric device and method for m...
- Patent number 6,680,441
- Issue date Jan 20, 2004
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and connection method of for connecting two ci...
- Patent number 6,657,137
- Issue date Dec 2, 2003
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding structure of thermoplastic resin material
- Patent number 6,605,357
- Issue date Aug 12, 2003
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of connecting circuit boards
- Patent number 6,601,754
- Issue date Aug 5, 2003
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of connecting circuit boards
- Patent number 6,598,780
- Issue date Jul 29, 2003
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered product
- Patent number 6,562,147
- Issue date May 13, 2003
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting method and connecting structure of printed circuit boards
- Patent number 6,527,162
- Issue date Mar 4, 2003
- Denso Corporation
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing three-dimensional printed wiring board
- Patent number 6,499,217
- Issue date Dec 31, 2002
- Mitsubishi Plastics Inc.
- Shingetsu Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting printed circuit boards and interconnecti...
- Patent number 6,449,836
- Issue date Sep 17, 2002
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220210942
- Publication date Jun 30, 2022
- DENSO CORPORATION
- Toshihiro MIYAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20220142005
- Publication date May 5, 2022
- DENSO CORPORATION
- TOSHIHIRO MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210013121
- Publication date Jan 14, 2021
- DENSO CORPORATION
- Toshihiro Miyake
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS
- Publication number 20160380367
- Publication date Dec 29, 2016
- DENSO CORPORATION
- Toshihiro MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MATERIAL, METHOD FOR FORMING THE COMPOSITE MATERIAL, ELEC...
- Publication number 20160201211
- Publication date Jul 14, 2016
- DENSO CORPORATION
- Kenji OCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRIC CONNECTION STRUCTURE
- Publication number 20160141782
- Publication date May 19, 2016
- DENSO CORPORATION
- Toshihiro MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT PIN, CONNECTION STRUCTURE INCLUDING THE PRESS-FIT PIN, AN...
- Publication number 20140213080
- Publication date Jul 31, 2014
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MATERIAL, ELECTRIC CONTACT ELECTRODE, ELECTRIC CONTACT FI...
- Publication number 20130081855
- Publication date Apr 4, 2013
- DENSO CORPORATION
- Toshihiro Miyake
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY FOR CONNECTING PRINTED CIRCUIT BOARD...
- Publication number 20110059661
- Publication date Mar 10, 2011
- DENSO CORPORATION
- Noriyasu INOMATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Card edge connector and method for assembling the same
- Publication number 20110021078
- Publication date Jan 27, 2011
- DENSO CORPORATION
- Taku Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Card edge connector and method of manufacturing the same
- Publication number 20110021080
- Publication date Jan 27, 2011
- DENSO CORPORATION
- Takashi Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Card edge connector and method of manufacturing the same
- Publication number 20090191764
- Publication date Jul 30, 2009
- NIPPON SOKEN, INC.
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Card edge connector and method of manufacturing the same
- Publication number 20090191760
- Publication date Jul 30, 2009
- NIPPON SOKEN, INC.
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal bonding method
- Publication number 20060027633
- Publication date Feb 9, 2006
- DENSO CORPORATION
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and circuit board connection structure
- Publication number 20040156583
- Publication date Aug 12, 2004
- DENSO Corporation
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board with embedded electri...
- Publication number 20040091687
- Publication date May 13, 2004
- Koji Kondo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of connecting circuit boards
- Publication number 20030213831
- Publication date Nov 20, 2003
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of connecting circuit boards
- Publication number 20030205610
- Publication date Nov 6, 2003
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with a built-in passive device, manufacturing...
- Publication number 20030133275
- Publication date Jul 17, 2003
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting structure of printed circuit boards
- Publication number 20030098339
- Publication date May 29, 2003
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for connecting printed circuit boards and connected printed...
- Publication number 20030079341
- Publication date May 1, 2003
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board with embedded electric device and method for m...
- Publication number 20020192442
- Publication date Dec 19, 2002
- Koji Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for interconnecting printed circuit boards and interconnecti...
- Publication number 20020189862
- Publication date Dec 19, 2002
- Toshihiro Miyake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Connection structure and connection method of both circuit boards
- Publication number 20020022385
- Publication date Feb 21, 2002
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting method and connecting structure of printed circuit boards
- Publication number 20020014518
- Publication date Feb 7, 2002
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of connecting circuit boards
- Publication number 20010042780
- Publication date Nov 22, 2001
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldered product
- Publication number 20010023028
- Publication date Sep 20, 2001
- NIPPONDENSO CO., LTD.
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of connecting circuit boards
- Publication number 20010013535
- Publication date Aug 16, 2001
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS

Toshihiro Miyake

Person

Patents Grantslast 30 patents

Electronic device

Joint structure, electronic device and method for manufacturing the...

Electronic device

Composite material, method for forming the composite material, elec...

Electronic apparatus and manufacturing method of electronic apparatus

Electric connection structure

Composite material, electric contact electrode, electric contact fi...

Press-fit pin, connection structure including the press-fit pin, an...

Card edge connector and method of manufacturing the same

Card edge connector and method for assembling the same

Card edge connector and method of manufacturing the same

Card edge connector and method of manufacturing the same

Metal bonding method

Circuit board and circuit board connection structure

Printed circuit board with a built-in passive device, manufacturing...

Method for manufacturing printed wiring board with embedded electri...

Method for connecting printed circuit boards and connected printed...

Connecting structure of printed circuit boards

Interconnection structure for interconnecting printed circuit boards

Method of connecting circuit boards

Method of connecting circuit boards

Printed wiring board with embedded electric device and method for m...

Connection structure and connection method of for connecting two ci...

Bonding method and bonding structure of thermoplastic resin material

Method of connecting circuit boards

Method of connecting circuit boards

Soldered product

Connecting method and connecting structure of printed circuit boards

Method of manufacturing three-dimensional printed wiring board

Method for interconnecting printed circuit boards and interconnecti...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE...

ELECTRONIC DEVICE

ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS

COMPOSITE MATERIAL, METHOD FOR FORMING THE COMPOSITE MATERIAL, ELEC...

ELECTRIC CONNECTION STRUCTURE

PRESS-FIT PIN, CONNECTION STRUCTURE INCLUDING THE PRESS-FIT PIN, AN...

COMPOSITE MATERIAL, ELECTRIC CONTACT ELECTRODE, ELECTRIC CONTACT FI...

ELECTRICAL CONNECTOR ASSEMBLY FOR CONNECTING PRINTED CIRCUIT BOARD...

Card edge connector and method for assembling the same

Card edge connector and method of manufacturing the same

Card edge connector and method of manufacturing the same

Card edge connector and method of manufacturing the same

Metal bonding method

Circuit board and circuit board connection structure

Method for manufacturing printed wiring board with embedded electri...

Method of connecting circuit boards

Method of connecting circuit boards

Printed circuit board with a built-in passive device, manufacturing...

Connecting structure of printed circuit boards

Method for connecting printed circuit boards and connected printed...

Printed wiring board with embedded electric device and method for m...

Method for interconnecting printed circuit boards and interconnecti...

Connection structure and connection method of both circuit boards

Connecting method and connecting structure of printed circuit boards

Method of connecting circuit boards

Soldered product

Method of connecting circuit boards