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Toshinori Ogashiwa
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Solder material and electronic part using the same
Patent number
6,187,114
Issue date
Feb 13, 2001
Matsushita Electric Industrial Co. Ltd.
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder material and electronic part using the same
Patent number
6,160,224
Issue date
Dec 12, 2000
Tanaka Denki Kogyo Kabushiki Kaisha
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device having an aluminum alloy wiring line
Patent number
5,550,407
Issue date
Aug 27, 1996
Tanaka Denshi Kogyo Kabushiki Kaisha
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fine lead alloy wire for forming bump electrodes
Patent number
5,514,334
Issue date
May 7, 1996
Tanaka Denshi Kogyo Kabushiki Kaisha
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for connecting semiconductor material and semiconductor devi...
Patent number
5,514,912
Issue date
May 7, 1996
Tanaka Denshi Kogyo Kabushiki Kaisha
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fine wire for forming bump electrodes using a wire bonder
Patent number
5,384,090
Issue date
Jan 24, 1995
Tanaka Denshi Kogyo Kabushiki Kaisha
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Alloy connecting materials for semiconductors
Patent number
5,366,692
Issue date
Nov 22, 1994
Tanaka Denshi Kogyo Kabushiki Kaisha
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR