Claims
- 1. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Sn alloy including 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of Pb, In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Sn, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 2. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising an In alloy including 1 wt % to 2 wt % of at least one additional element selected from the group consisting of Pb, Sn, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of In, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 3. The fine alloy wire according to claim 1, comprising Sn-Sb-Su-Ag having 1 to 3 wt % of Sb, 1 wt % of Au, 3 wt % of Ag, and a balance of Sn.
- 4. The fine alloy wire according to claim 1, comprising Sn-Pb-Au-Ag having 1 to 3 wt % of Pb, 1 wt % of Au, 3 wt % of Ag, and a balance of Sn.
- 5. The fine alloy wire according to claim 1, comprising Sn-Sb-Pb having 1 to 8 wt % of Sb, 35 to 50 wt % of Pb, and a balance of Sn.
- 6. The fine alloy wire according to claim 1, comprising Sn-Sb-Pb-Ag having 1 to 8 wt % of Sb, 35 to 50 wt % of Pb, 2 to 10 wt % of Ag, and a balance of Sn.
- 7. The fine alloy wire according to claim 1, comprising Sn-Sb-Pb-Ag-Cu having 1to 8 of wt % Sb, 35 to 50 wt % of Pb, 2 to 10 wt % of Ag, 0.1 to 0.9 wt % of Cu, and a balance of Sn.
- 8. The fine alloy wire according to claim 1, comprising Sn-Pb-Ag-Cu having 35 to 50 wt % of Pb, 0.5 to 10 wt % of Ag, 0.1 to 0.9 wt % of Cu, and a balance of Sn.
- 9. The fine alloy wire according to claim 1, comprising Sn-Pb-Au-Sb-Cu having 40 to 50 wt % of Pb, 0.001 to 0.5 wt % of Au, 0.01 to 5 wt % of Sb, 0.01 to 1.5 wt % of Cu, and a balance of Sn.
- 10. The fine alloy wire according to claim 2, comprising In-Sn-Au-Ag having 1 to 2 wt % of Sn, 1 wt % of Au, 2 wt % of Ag, and a balance of In.
- 11. The fine alloy wire according to claim 2, comprising In-Pb-Au-Ag having 1 to 2 wt % of Pb, 1 wt % of Au, 2 wt % of Ag, and a balance of In.
- 12. The fine alloy wire according to claim 2, comprising In-Pb-Cu-Ag having 1 to 2 wt % of Pb, 1 wt % of Cu, 2 wt % of Ag, and a balance of In.
- 13. The find alloy wire according to claim 1, wherein said fine wire has a diameter of 60 .mu.m.
- 14. The fine alloy wire according to claim 2, wherein said fine wire has a diameter of 60 .mu.m.
- 15. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Cu including 10 wt % of Sn, 0.9 wt % of Cu, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 16. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Ag-Cu including 3 wt % of Ag, 0.9 wt % of Cu, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 17. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Ag-Cu including 0.3 to 50 wt % of Sn, 0.5 to 10 wt % of Ag, 0.1 to 0.9 wt % of Cu, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 18. The fine alloy wire according to claim 17, wherein said Pb-Sn-Ag-Cu comprises 0.3 to 5 wt % of Sn, 0.5 to 5 wt % of Ag, 0.1 to 0.9 wt % of Cu, and a balance of Pb.
- 19. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Cr-Cu including 0.5 to 2 wt % of Sn, 3 wt % of Cr, 0.9 wt % of Cu, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 20. A fine alloy wire for forming bump electrodes using a wire-bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Ag-Ni including 0.5 to 5 wt % of Sn, 2 to 5 wt % of Ag, 0.1 to 5 wt % of Ni, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 21. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Sb including 1 to 50 wt % of Sn, 1 to 8 wt % of Sb, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 22. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Sb-Ag including 1 to 50 wt % of Sn, 1 to 8 wt % of Sb, 2 to 10 wt % of Ag, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 23. The fine alloy wire according to claim 22, wherein said Pb-Sn-Sb-Ag comprises 1 to 5 wt % of Sn, 1 to 8 wt % of Sb, 2 to 5 wt % of Ag, and a balance of Pb.
- 24. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Ag-Cu-Sb including 1 to 50 wt % of Sn, 2 to 10 wt % of Ag, 0.1 to 0.9 wt % of Cu, 1 to 8 wt % of Sb, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 25. The fine alloy wire according to claim 24 wherein said Pb-Sn-Ag-Cu-Sb comprises 1 to 5 wt % Sn, 2 to 5 wt % Ag, 0.1 to 0.9 wt % Cu, 1 to 8 wt % Sb, and a balance of Pb.
- 26. A fine alloy Wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-In-Au including 5 to 50 wt % of In, 0.1 to 5 wt % of Au, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 27. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-In-Cu including 5 to 50 wt % of In, 0.1 to 5 wt % of Cu, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
- 28. A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Au-Sb-Cu including 2 to 50 wt % of Sn, 0.001 to 0.5 wt % of Au, 0.01 to 5 wt % of Sb, 0.01 to 1.5 wt % of Cu, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 to 10.sup.5 .degree. C./sec.
Priority Claims (3)
| Number |
Date |
Country |
Kind |
| 62-021202 |
Jan 1987 |
JPX |
|
| 62-130595 |
May 1987 |
JPX |
|
| 62-193340 |
Jul 1987 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 07/139,808, filed Dec. 30, 1987 now abandoned.
US Referenced Citations (10)
Foreign Referenced Citations (10)
| Number |
Date |
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| 2093 |
Jan 1970 |
JPX |
| 17643 |
Sep 1972 |
JPX |
| 1254 |
Jan 1979 |
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| 18505 |
Feb 1980 |
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| 161355 |
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| 59-208751 |
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| 222140 |
Jan 1986 |
JPX |
| 61-43438 |
Mar 1986 |
JPX |
| 61-219159 |
Sep 1986 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
| Parent |
139808 |
Dec 1987 |
|
Patent Grant
5384090
