Tsutomu Mitani

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Module and mounted structure using the same
- Patent number 7,859,855
- Issue date Dec 28, 2010
- Panasonic Corporation
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and mounted structure using the same
- Patent number 7,667,974
- Issue date Feb 23, 2010
- Panasonic Corporation
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part, and electronic part mounting element and an proces...
- Patent number 7,151,306
- Issue date Dec 19, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part, an electronic part mounting element and a process...
- Patent number 6,853,074
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent, packaging structure, and method for manu...
- Patent number 6,814,893
- Issue date Nov 9, 2004
- Matsushita Electric Industiral Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including wiring board with three dimensional...
- Patent number 6,756,663
- Issue date Jun 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and connection structure using the same
- Patent number 6,749,774
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing mounting structure for an electronic component
- Patent number 6,749,889
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted member and repair method thereof
- Patent number 6,675,474
- Issue date Jan 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and packaging structure using the same
- Patent number 6,666,994
- Issue date Dec 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent, packaging structure, and method for manu...
- Patent number 6,620,345
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure for an electronic component and method for produ...
- Patent number 6,569,512
- Issue date May 27, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and packaging structure using the same
- Patent number 6,524,721
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a wiring board and semiconductor ele...
- Patent number 6,525,414
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and connection structure using the same
- Patent number 6,521,144
- Issue date Feb 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted member and repair method thereof
- Patent number 6,512,183
- Issue date Jan 28, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin, electronic module using conductive resin, and met...
- Patent number 6,510,059
- Issue date Jan 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure for an electronic component and method for produ...
- Patent number 6,376,051
- Issue date Apr 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate on which bumps are formed and method of forming the same
- Patent number 6,042,953
- Issue date Mar 28, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kazufumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate on which bumps are formed and method of forming the same
- Patent number 5,914,274
- Issue date Jun 22, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kazufumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of synthesizing diamond-like carbon thin films
- Patent number 5,674,573
- Issue date Oct 7, 1997
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for forming a diamond-like thin film
- Patent number 5,378,285
- Issue date Jan 3, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetic tape driving mechanism having a capstan with a surface mad...
- Patent number 5,370,292
- Issue date Dec 6, 1994
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kurokawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Plasma CVD apparatus and method therefor
- Patent number 5,360,483
- Issue date Nov 1, 1994
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kurokawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of and apparatus for synthesizing diamondlike thin film
- Patent number 5,203,924
- Issue date Apr 20, 1993
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive element used in electrophotography
- Patent number 5,168,023
- Issue date Dec 1, 1992
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Magnetic recording medium and method of producing the same
- Patent number 4,835,070
- Issue date May 30, 1989
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kurokawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic recording medium
- Patent number 4,833,031
- Issue date May 23, 1989
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kurokawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic recording media
- Patent number 4,717,622
- Issue date Jan 5, 1988
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kurokawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Plasma CVD apparatus and method for forming a diamond like carbon film
- Patent number 4,645,977
- Issue date Feb 24, 1987
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kurokawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MODULE AND MOUNTED STRUCTURE USING THE SAME
- Publication number 20100133664
- Publication date Jun 3, 2010
- PANASONIC CORPORATION
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHOCK ELIMINATING SHEET AND ELECTRONIC APPLIANCE MAKING USE OF THE...
- Publication number 20090047470
- Publication date Feb 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Hideki Kuwajima
- G11 - INFORMATION STORAGE
Information Patent Application
Module and Mounted Structure Using the Same
- Publication number 20080048307
- Publication date Feb 28, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part, and electronic part mounting element and an proces...
- Publication number 20050098338
- Publication date May 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device including a wiring board with a three-dimensio...
- Publication number 20040212075
- Publication date Oct 28, 2004
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive agent, packaging structure, and method for manu...
- Publication number 20040005459
- Publication date Jan 8, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
- Hiroaki Takezawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mounting structure for an electronic component and method for produ...
- Publication number 20030207073
- Publication date Nov 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Conductive adhesive and connection structure using the same
- Publication number 20030127632
- Publication date Jul 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive and packaging structure using the same
- Publication number 20030116756
- Publication date Jun 26, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and module of the same
- Publication number 20030094685
- Publication date May 22, 2003
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive resin, electronic module using conductive resin, and met...
- Publication number 20020185306
- Publication date Dec 12, 2002
- Tsutomu Mitani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive, apparatus for mounting electronic component, a...
- Publication number 20020158232
- Publication date Oct 31, 2002
- Tsutomu Mitani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Electronic component mounted member and repair method thereof
- Publication number 20020062988
- Publication date May 30, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Tsutomu Mitani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Conductive adhesive agent, packaging structrue, and method for manu...
- Publication number 20020050643
- Publication date May 2, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive and packaging structure using the same
- Publication number 20020043652
- Publication date Apr 18, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Mounting structure for an electronic component and method for produ...
- Publication number 20020034620
- Publication date Mar 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Conductive adhesive and connection structure using the same
- Publication number 20010015424
- Publication date Aug 23, 2001
- Matsushita Electric Industrial Co. Ltd.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Electronic part, an electronic part mounting element and an process...
- Publication number 20010005053
- Publication date Jun 28, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takashi Kitae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and module of the same
- Publication number 20010002727
- Publication date Jun 7, 2001
- Tsukasa Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS

Tsutomu Mitani

Person

Patents Grantslast 30 patents

Module and mounted structure using the same

Module and mounted structure using the same

Electronic part, and electronic part mounting element and an proces...

Electronic part, an electronic part mounting element and a process...

Conductive adhesive agent, packaging structure, and method for manu...

Semiconductor device including wiring board with three dimensional...

Conductive adhesive and connection structure using the same

Method for producing mounting structure for an electronic component

Electronic component mounted member and repair method thereof

Conductive adhesive and packaging structure using the same

Conductive adhesive agent, packaging structure, and method for manu...

Mounting structure for an electronic component and method for produ...

Conductive adhesive and packaging structure using the same

Semiconductor device including a wiring board and semiconductor ele...

Conductive adhesive and connection structure using the same

Electronic component mounted member and repair method thereof

Conductive resin, electronic module using conductive resin, and met...

Mounting structure for an electronic component and method for produ...

Substrate on which bumps are formed and method of forming the same

Substrate on which bumps are formed and method of forming the same

Method of synthesizing diamond-like carbon thin films

Apparatus for forming a diamond-like thin film

Magnetic tape driving mechanism having a capstan with a surface mad...

Plasma CVD apparatus and method therefor

Method of and apparatus for synthesizing diamondlike thin film

Photosensitive element used in electrophotography

Magnetic recording medium and method of producing the same

Magnetic recording medium

Magnetic recording media

Plasma CVD apparatus and method for forming a diamond like carbon film

Patents Applicationslast 30 patents

MODULE AND MOUNTED STRUCTURE USING THE SAME

SHOCK ELIMINATING SHEET AND ELECTRONIC APPLIANCE MAKING USE OF THE...

Module and Mounted Structure Using the Same

Electronic part, and electronic part mounting element and an proces...

Semiconductor device including a wiring board with a three-dimensio...

Conductive adhesive agent, packaging structure, and method for manu...

Mounting structure for an electronic component and method for produ...

Conductive adhesive and connection structure using the same

Conductive adhesive and packaging structure using the same

Semiconductor device and module of the same

Conductive resin, electronic module using conductive resin, and met...

Conductive adhesive, apparatus for mounting electronic component, a...

Electronic component mounted member and repair method thereof

Conductive adhesive agent, packaging structrue, and method for manu...

Conductive adhesive and packaging structure using the same

Mounting structure for an electronic component and method for produ...

Conductive adhesive and connection structure using the same

Electronic part, an electronic part mounting element and an process...

Semiconductor device and module of the same