Tzyy-Jang Tseng

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,991,824
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package structure
- Patent number 11,923,350
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of light emitting diode package structure
- Patent number 11,837,591
- Issue date Dec 5, 2023
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card testing device
- Patent number 11,808,787
- Issue date Nov 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,764,344
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 11,690,173
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of carrier structure
- Patent number 11,690,180
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,612
- Issue date Jun 20, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,600,936
- Issue date Mar 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus for bare circuit board
- Patent number 11,579,178
- Issue date Feb 14, 2023
- Unimicron Technology Corp.
- Hsin-Hung Lee
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of the chip package structure having at least...
- Patent number 11,562,972
- Issue date Jan 24, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,540,396
- Issue date Dec 27, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,516,910
- Issue date Nov 29, 2022
- Unimicron Technology Corp.
- Chia-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,445,617
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,410,971
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,410,933
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 11,410,940
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package structure and manufacturing method the...
- Patent number 11,335,670
- Issue date May 17, 2022
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having at least one chip and at least one th...
- Patent number 11,145,610
- Issue date Oct 12, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,127,664
- Issue date Sep 21, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board structure
- Patent number 11,114,782
- Issue date Sep 7, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 10,957,658
- Issue date Mar 23, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and manufacturing method thereof
- Patent number 10,925,172
- Issue date Feb 16, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, package structure and method of manufacturing the same
- Patent number 10,897,823
- Issue date Jan 19, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234371
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402441
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER
- Publication number 20230400649
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240023
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230163074
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20230137841
- Publication date May 4, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE PACKAGE STRUCTURE
- Publication number 20230116522
- Publication date Apr 13, 2023
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER STRUCTURE
- Publication number 20230067112
- Publication date Mar 2, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20220408554
- Publication date Dec 22, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20220375919
- Publication date Nov 24, 2022
- Unimicron Technology Corp.
- Kai-Ming YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220344248
- Publication date Oct 27, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336333
- Publication date Oct 20, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220328387
- Publication date Oct 13, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220287182
- Publication date Sep 8, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220256717
- Publication date Aug 11, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220246810
- Publication date Aug 4, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT EMITTING DIODE PACKAGE STRUCTURE
- Publication number 20220231004
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220130781
- Publication date Apr 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAR-VIEW MIRROR WITH DISPLAY FUNCTION
- Publication number 20220126752
- Publication date Apr 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220108953
- Publication date Apr 7, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220069489
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071000
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071010
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071015
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD TESTING DEVICE
- Publication number 20220065897
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220059498
- Publication date Feb 24, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE
- Publication number 20210398925
- Publication date Dec 23, 2021
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20210327861
- Publication date Oct 21, 2021
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS

Tzyy-Jang Tseng

Person

Patents Grantslast 30 patents

Circuit board structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Light emitting diode package structure

Package structure and optical signal transmitter

Manufacturing method of light emitting diode package structure

Probe card testing device

Package structure and manufacturing method thereof

Metal bump structure and manufacturing method thereof and driving s...

Package structure and manufacturing method thereof

Circuit board structure

Manufacturing method of carrier structure

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Circuit board structure

Inspection apparatus for bare circuit board

Manufacturing method of the chip package structure having at least...

Circuit board structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Chip package structure

Package structure and manufacturing method thereof

Package structure with structure reinforcing element and manufactur...

Chip package structure and manufacturing method thereof

Light emitting diode package structure and manufacturing method the...

Chip package structure having at least one chip and at least one th...

Circuit board and manufacturing method thereof

Method of manufacturing circuit board structure

Package structure with structure reinforcing element and manufactur...

Carrier structure and manufacturing method thereof

Circuit board, package structure and method of manufacturing the same

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE

LIGHT EMITTING DIODE PACKAGE STRUCTURE

VAPOR CHAMBER STRUCTURE

CIRCUIT BOARD STRUCTURE

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

MANUFACTURING METHOD OF LIGHT EMITTING DIODE PACKAGE STRUCTURE

CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

REAR-VIEW MIRROR WITH DISPLAY FUNCTION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PROBE CARD TESTING DEVICE

CHIP PACKAGE STRUCTURE

MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...