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Vincent DiCaprio
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Mesa, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor memory card
Patent number
8,258,613
Issue date
Sep 4, 2012
Amkor Technology, Inc.
Vincent DiCaprio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
RE40112
Issue date
Feb 26, 2008
Amkor Technology, Inc.
Won Sun Shin
438 - Semiconductor device manufacturing: process
Information
Patent Grant
Thin semiconductor package including stacked dies
Patent number
7,211,900
Issue date
May 1, 2007
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
7,190,071
Issue date
Mar 13, 2007
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded heat spreader ball grid array
Patent number
7,126,218
Issue date
Oct 24, 2006
Amkor Technology, Inc.
Robert F. Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package having semiconductor chip within ce...
Patent number
7,061,120
Issue date
Jun 13, 2006
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
6,982,488
Issue date
Jan 3, 2006
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
6,830,955
Issue date
Dec 14, 2004
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
6,798,049
Issue date
Sep 28, 2004
Amkor Technology Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin integrated circuit package having an optically transparent window
Patent number
6,784,534
Issue date
Aug 31, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having semiconductor chip within central aper...
Patent number
6,762,078
Issue date
Jul 13, 2004
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
6,717,248
Issue date
Apr 6, 2004
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-stacked memory package
Patent number
6,683,377
Issue date
Jan 27, 2004
Amkor Technology, Inc.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabricating very thin chip size semiconductor packages
Patent number
6,656,765
Issue date
Dec 2, 2003
Amkor Technology, Inc.
Vincent DiCaprio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor package including stacked semicond...
Patent number
6,650,019
Issue date
Nov 18, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory cards and method of making same
Patent number
6,624,005
Issue date
Sep 23, 2003
Amkor Technology, Inc.
Vincent DiCaprio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-scale production of chip-scale semiconductor packages using w...
Patent number
6,589,801
Issue date
Jul 8, 2003
Amkor Technology, Inc.
Ju-Hoon Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip size semiconductor packages with stacked dies
Patent number
6,577,013
Issue date
Jun 10, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with spacer strips
Patent number
6,531,784
Issue date
Mar 11, 2003
Amkor Technology, Inc.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making an integrated circuit package using a batch step f...
Patent number
6,517,656
Issue date
Feb 11, 2003
Amkor Technology, Inc.
Vincent DiCaprio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
6,515,356
Issue date
Feb 4, 2003
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board semiconductor package
Patent number
6,512,288
Issue date
Jan 28, 2003
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
6,501,184
Issue date
Dec 31, 2002
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing such device
Patent number
6,489,667
Issue date
Dec 3, 2002
Amkor Technology, Inc.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including stacked semiconductor dies and bond...
Patent number
6,472,758
Issue date
Oct 29, 2002
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-scale semiconductor package of the fan-out type and method of...
Patent number
6,462,274
Issue date
Oct 8, 2002
Amkor Technology, Inc.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile package for plural semiconductor dies
Patent number
6,452,278
Issue date
Sep 17, 2002
Amkor Technology, Inc.
Vincent DiCaprio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package for stacked integrated circuits
Patent number
6,414,396
Issue date
Jul 2, 2002
Amkor Technology, Inc.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level production of chip size semiconductor packages
Patent number
6,406,934
Issue date
Jun 18, 2002
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
6,395,578
Issue date
May 28, 2002
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor package and method for fabricating the same
Publication number
20050205979
Publication date
Sep 22, 2005
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable semiconductor package having semiconductor chip within ce...
Publication number
20040175916
Publication date
Sep 9, 2004
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and method for fabricating the same
Publication number
20040164411
Publication date
Aug 26, 2004
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and method for fabricating the smae
Publication number
20040007771
Publication date
Jan 15, 2004
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and method for fabricating the same
Publication number
20030100142
Publication date
May 29, 2003
Amkor Technology, Inc.
Won Sun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE FOR MULTIPLE INTEGRATED CIRCUITS AND METHOD OF MAKING
Publication number
20030082845
Publication date
May 1, 2003
Amkor Technology, Inc.
PAUL HOFFMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and method for manufacturing the same
Publication number
20030001285
Publication date
Jan 2, 2003
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making a semiconductor package including stacked semicond...
Publication number
20020195624
Publication date
Dec 26, 2002
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In...
Publication number
20020096253
Publication date
Jul 25, 2002
AMKOR Technology, Inc.,
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Having Semiconductor Chip Within Central Aper...
Publication number
20010005601
Publication date
Jun 28, 2001
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS