Virgil Ararao

Person

Rutland, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method for use thereof
- Patent number 10,693,020
- Issue date Jun 23, 2020
- TT ELECTRONICS PLC
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 9,890,036
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically-sealed MEMS device and its fabrication
- Patent number 9,567,213
- Issue date Feb 14, 2017
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic plastic molded MEMS device package and method of fabrication
- Patent number 9,227,836
- Issue date Jan 5, 2016
- Texas Instruments Incorporated
- Virgil C. Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and method of providing a sensor
- Patent number 9,228,860
- Issue date Jan 5, 2016
- Allegro Microsystems, LLC
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 9,140,898
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic plastic molded MEMS device package and method of fabrication
- Patent number 9,102,511
- Issue date Aug 11, 2015
- Texas Instruments Incorporated
- Virgil C. Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for flip-chip-on-lead semiconductor package
- Patent number 8,785,250
- Issue date Jul 22, 2014
- Allegro Microsystems, LLC
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and method of fabrication
- Patent number 8,691,607
- Issue date Apr 8, 2014
- Texas Instruments Incorporated
- Virgil C. Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetic field sensors and methods for fabricating the magnetic fie...
- Patent number 8,486,755
- Issue date Jul 16, 2013
- Allegro Microsystems, LLC
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Grant
Magnetic field sensors and methods for fabricating the magnetic fie...
- Patent number 8,461,677
- Issue date Jun 11, 2013
- Allegro Microsystems, LLC
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
- Patent number 7,361,531
- Issue date Apr 22, 2008
- Allegro Microsystems, Inc.
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20200355525
- Publication date Nov 12, 2020
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL ENCODER SYSTEM WITH SHAPED LIGHT SOURCE
- Publication number 20200166382
- Publication date May 28, 2020
- TT Electronics Plc
- Brent Hans Larson
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device Package and Method for Use Thereof
- Publication number 20190371944
- Publication date Dec 5, 2019
- TT Electronics Plc
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20180186629
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20180148319
- Publication date May 31, 2018
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20170152136
- Publication date Jun 1, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY-SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20170050844
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC PLASTIC MOLDED MEMS DEVICE PACKAGE AND METHOD OF FABRICATION
- Publication number 20150303121
- Publication date Oct 22, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Passive Attachment of Components for Inte...
- Publication number 20150285874
- Publication date Oct 8, 2015
- Allegro Microsystems, LLC
- William P. Taylor
- G01 - MEASURING TESTING
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20140268295
- Publication date Sep 18, 2014
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND METHOD OF FABRICATION
- Publication number 20130330878
- Publication date Dec 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Virgil C. Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC PLASTIC MOLDED MEMS DEVICE PACKAGE AND METHOD OF FABRICATION
- Publication number 20130328141
- Publication date Dec 12, 2013
- Virgil C. Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20130264667
- Publication date Oct 10, 2013
- ALLEGRO MICROSYSTEMS, INC.
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20130267043
- Publication date Oct 10, 2013
- ALLEGRO MICROSYSTEMS, INC.
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20120086090
- Publication date Apr 12, 2012
- ALLEGRO MICROSYSTEMS, INC.
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20120013333
- Publication date Jan 19, 2012
- ALLEGRO MICROSYSTEMS, INC.
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...
- Publication number 20100141249
- Publication date Jun 10, 2010
- Virgil Ararao
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20080230879
- Publication date Sep 25, 2008
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...
- Publication number 20080013298
- Publication date Jan 17, 2008
- Nirmal Sharma
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
- Publication number 20070099348
- Publication date May 3, 2007
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Virgil Ararao

Person

Patents Grantslast 30 patents

Semiconductor device package and method for use thereof

Hermetically sealed MEMS device and its fabrication

Hermetically sealed MEMS device and its fabrication

Hermetically-sealed MEMS device and its fabrication

Hermetic plastic molded MEMS device package and method of fabrication

Sensor and method of providing a sensor

Hermetically sealed MEMS device and its fabrication

Hermetic plastic molded MEMS device package and method of fabrication

Methods and apparatus for flip-chip-on-lead semiconductor package

Hermetically sealed MEMS device and method of fabrication

Magnetic field sensors and methods for fabricating the magnetic fie...

Magnetic field sensors and methods for fabricating the magnetic fie...

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

OPTICAL ENCODER SYSTEM WITH SHAPED LIGHT SOURCE

Semiconductor Device Package and Method for Use Thereof

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION

HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION

HERMETICALLY-SEALED MEMS DEVICE AND ITS FABRICATION

HERMETIC PLASTIC MOLDED MEMS DEVICE PACKAGE AND METHOD OF FABRICATION

Methods and Apparatus for Passive Attachment of Components for Inte...

HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION

HERMETICALLY SEALED MEMS DEVICE AND METHOD OF FABRICATION

HERMETIC PLASTIC MOLDED MEMS DEVICE PACKAGE AND METHOD OF FABRICATION

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

Magnetic Field Sensors and Methods for Fabricating the Magnetic Fie...

METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTE...

Methods and apparatus for Flip-Chip-On-Lead semiconductor package