Wei Shi

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical device including a substrate with a conductor-filled trench...
- Patent number 12,166,331
- Issue date Dec 10, 2024
- Lumentum Operations LLC
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a time of flight device
- Patent number 12,055,633
- Issue date Aug 6, 2024
- Lumentum Operations LLC
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate with low thermal resistance and low parasitic i...
- Patent number 12,040,592
- Issue date Jul 16, 2024
- Lumentum Operations LLC
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module including embedded ceramic substrate package
- Patent number 12,010,416
- Issue date Jun 11, 2024
- Apple Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable thermometer patch for correct measurement of human skin te...
- Patent number 10,420,473
- Issue date Sep 24, 2019
- VivaLnk, Inc.
- Wei Shi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Three-dimensional image sensing module with a low z-height
- Patent number 10,425,562
- Issue date Sep 24, 2019
- Intel Corporation
- Wei Shi
- G02 - OPTICS
Information Patent Grant
Rigid-flexible circuit interconnects
- Patent number 10,299,389
- Issue date May 21, 2019
- Finisar Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked wafer lens and camera
- Patent number 9,933,601
- Issue date Apr 3, 2018
- Intel Corporation
- Wei Shi
- G02 - OPTICS
Information Patent Grant
Rigid-flexible circuit interconnects
- Patent number 9,723,725
- Issue date Aug 1, 2017
- Finisar Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated package structures with low Z height...
- Patent number 9,602,804
- Issue date Mar 21, 2017
- Intel Corporation
- Wei Shi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optoelectronic assembly for signal conversion
- Patent number 9,413,464
- Issue date Aug 9, 2016
- Finisar Corporation
- Wei Shi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-cup LED assembly
- Patent number 9,252,336
- Issue date Feb 2, 2016
- Bridgelux, Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphor layer arrangement for use with light emitting diodes
- Patent number 8,314,552
- Issue date Nov 20, 2012
- Bridgelux, Inc.
- Wei Shi
- F21 - LIGHTING
Information Patent Grant
Multi-chip assembly with optically coupled die
- Patent number 8,189,361
- Issue date May 29, 2012
- Intel Corporation
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming compliant contact pads for semiconductor packages
- Patent number 8,148,805
- Issue date Apr 3, 2012
- Intel Corporation
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phosphor layer arrangement for use with light emitting diodes
- Patent number 8,098,011
- Issue date Jan 17, 2012
- Bridgelux, Inc.
- Wei Shi
- F21 - LIGHTING
Information Patent Grant
Heat sink base for LEDS
- Patent number 8,089,085
- Issue date Jan 3, 2012
- Bridgelux, Inc.
- Wei Shi
- F21 - LIGHTING
Information Patent Grant
Top contact LED thermal management
- Patent number 8,084,283
- Issue date Dec 27, 2011
- Bridgelux, Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top contact LED thermal management
- Patent number 8,080,827
- Issue date Dec 20, 2011
- Bridgelux, Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent heat spreader for LEDs
- Patent number 8,076,693
- Issue date Dec 13, 2011
- Bridgelux, Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent solder mask LED assembly
- Patent number 8,058,664
- Issue date Nov 15, 2011
- Bridgelux, Inc.
- Wei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-global solder mask LED assembly
- Patent number 8,049,236
- Issue date Nov 1, 2011
- Bridgelux, Inc.
- Wei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated micro-channels for 3D through silicon architectures
- Patent number 8,012,808
- Issue date Sep 6, 2011
- Intel Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with raised edge pads
- Patent number 7,980,865
- Issue date Jul 19, 2011
- Intel Corporation
- Wei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cooling light-emitting diode
- Patent number 7,972,881
- Issue date Jul 5, 2011
- Bridgelux, Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming compliant contact pads for semiconductor packages
- Patent number 7,939,922
- Issue date May 10, 2011
- Intel Corporation
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management for LED
- Patent number 7,892,870
- Issue date Feb 22, 2011
- Bridgelux, Inc.
- Wei Shi
- F21 - LIGHTING
Information Patent Grant
Thermal management for LED
- Patent number 7,888,688
- Issue date Feb 15, 2011
- Bridgelux, Inc.
- Wei Shi
- F21 - LIGHTING
Information Patent Grant
Phosphor layer arrangement for use with light emitting diodes
- Patent number 7,859,190
- Issue date Dec 28, 2010
- Bridgelux, Inc.
- Wei Shi
- F21 - LIGHTING
Information Patent Grant
Transparent heat spreader for LEDs
- Patent number 7,851,819
- Issue date Dec 14, 2010
- Bridgelux, Inc.
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMITTER ASSEMBLY WITH A REDISTRIBUTION LAYER FOR A VERTICAL CAVITY...
- Publication number 20240195145
- Publication date Jun 13, 2024
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTER ASSEMBLY WITH LOCKING PILLARS
- Publication number 20240195151
- Publication date Jun 13, 2024
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTER ASSEMBLY WITH LOCKING PINS
- Publication number 20240195152
- Publication date Jun 13, 2024
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTER ASSEMBLY WITH VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL...
- Publication number 20240195153
- Publication date Jun 13, 2024
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE AND SYSTEM-IN-PACKAGE PACKAGING ARCHITECTURES
- Publication number 20230361096
- Publication date Nov 9, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...
- Publication number 20230352384
- Publication date Nov 2, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ASSEMBLY THAT INCLUDES AN OPTICAL ELEMENT CONNECTED TO A VE...
- Publication number 20230115690
- Publication date Apr 13, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CAVITY SURFACE EMITTING LASER ILLUMINATOR PACKAGE WITH EMB...
- Publication number 20230047740
- Publication date Feb 16, 2023
- Lumentum Operations LLC
- Siu Kwan CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ASSEMBLY WITH A MICROLENS COMPONENT AND CONTACTS ON A SAME...
- Publication number 20230027279
- Publication date Jan 26, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ASSEMBLY WITH A VERTICAL CAVITY SURFACE EMITTING LASER DEVI...
- Publication number 20220407289
- Publication date Dec 22, 2022
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE WITH LOW THERMAL RESISTANCE AND LOW PARASITIC I...
- Publication number 20220385033
- Publication date Dec 1, 2022
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DESIGNS FOR TIME-OF-FLIGHT CAMERA PROJECTORS WITH LOW THE...
- Publication number 20220385039
- Publication date Dec 1, 2022
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE INCLUDING A SUBSTRATE WITH A CONDUCTOR-FILLED TRENCH...
- Publication number 20220166187
- Publication date May 26, 2022
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A TIME OF FLIGHT DEVICE
- Publication number 20220066036
- Publication date Mar 3, 2022
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROJECTOR WITH ANGLED REFLECTOR
- Publication number 20180366902
- Publication date Dec 20, 2018
- Intel Corporation
- Wei Shi
- G02 - OPTICS
Information Patent Application
RIGID-FLEXIBLE CIRCUIT INTERCONNECTS
- Publication number 20180054898
- Publication date Feb 22, 2018
- Finisar Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wearable thermometer patch for correct measurement of human skin te...
- Publication number 20180028070
- Publication date Feb 1, 2018
- VivaLnk Inc.
- Wei Shi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Wearable thermometer patch for accurate measurement of human skin t...
- Publication number 20180028069
- Publication date Feb 1, 2018
- VivaLnk Inc.
- Wei Shi
- G01 - MEASURING TESTING
Information Patent Application
Wearable patch for measuring temperature and electrical signals
- Publication number 20180028071
- Publication date Feb 1, 2018
- VivaLnk Inc.
- Wei Shi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Wearable thermometer patch capable of measuring human skin temperat...
- Publication number 20180028072
- Publication date Feb 1, 2018
- VivaLnk, Inc.
- Wei Shi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Wearable patch having reliable conductive contacts for measuring el...
- Publication number 20180014783
- Publication date Jan 18, 2018
- VivaLnk, Inc.
- Wei Shi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STACKED WAFER LENS AND CAMERA
- Publication number 20170176724
- Publication date Jun 22, 2017
- Intel Corporation
- Wei Shi
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL IMAGE SENSING MODULE WITH A LOW Z-HEIGHT
- Publication number 20160381262
- Publication date Dec 29, 2016
- Intel Corporation
- Wei Shi
- G02 - OPTICS
Information Patent Application
METHODS OF FORMING INTEGRATED PACKAGE STRUCTURES WITH LOW Z HEIGHT...
- Publication number 20160284752
- Publication date Sep 29, 2016
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ASSEMBLY FOR SIGNAL CONVERSION
- Publication number 20150071643
- Publication date Mar 12, 2015
- Finisar Corporation
- Wei Shi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RIGID-FLEXIBLE CIRCUIT INTERCONNECTS
- Publication number 20140355228
- Publication date Dec 4, 2014
- Finisar Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phosphor Layer Arrangement for Use With Light Emitting Diodes
- Publication number 20120319573
- Publication date Dec 20, 2012
- BRIDGELUX, INC.
- Wei Shi
- F21 - LIGHTING
Information Patent Application
Substrate With Raised Edge Pads
- Publication number 20110239454
- Publication date Oct 6, 2011
- Wei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming Compliant Contact Pads for Semiconductor Packages
- Publication number 20110175230
- Publication date Jul 21, 2011
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES
- Publication number 20110092003
- Publication date Apr 21, 2011
- BRIDGELUX, INC.
- Wei Shi
- F21 - LIGHTING

Person

Patents Grantslast 30 patents

Optical device including a substrate with a conductor-filled trench...

Package for a time of flight device

Packaging substrate with low thermal resistance and low parasitic i...

Camera module including embedded ceramic substrate package

Wearable thermometer patch for correct measurement of human skin te...

Three-dimensional image sensing module with a low z-height

Rigid-flexible circuit interconnects

Stacked wafer lens and camera

Rigid-flexible circuit interconnects

Methods of forming integrated package structures with low Z height...

Optoelectronic assembly for signal conversion

Multi-cup LED assembly

Phosphor layer arrangement for use with light emitting diodes

Multi-chip assembly with optically coupled die

Forming compliant contact pads for semiconductor packages

Phosphor layer arrangement for use with light emitting diodes

Heat sink base for LEDS

Top contact LED thermal management

Top contact LED thermal management

Transparent heat spreader for LEDs

Transparent solder mask LED assembly

Non-global solder mask LED assembly

Integrated micro-channels for 3D through silicon architectures

Substrate with raised edge pads

Method for cooling light-emitting diode

Forming compliant contact pads for semiconductor packages

Thermal management for LED

Thermal management for LED

Phosphor layer arrangement for use with light emitting diodes

Transparent heat spreader for LEDs

Patents Applicationslast 30 patents

EMITTER ASSEMBLY WITH A REDISTRIBUTION LAYER FOR A VERTICAL CAVITY...

EMITTER ASSEMBLY WITH LOCKING PILLARS

EMITTER ASSEMBLY WITH LOCKING PINS

EMITTER ASSEMBLY WITH VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL...

PACKAGE-ON-PACKAGE AND SYSTEM-IN-PACKAGE PACKAGING ARCHITECTURES

THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...

OPTICAL ASSEMBLY THAT INCLUDES AN OPTICAL ELEMENT CONNECTED TO A VE...

VERTICAL CAVITY SURFACE EMITTING LASER ILLUMINATOR PACKAGE WITH EMB...

OPTICAL ASSEMBLY WITH A MICROLENS COMPONENT AND CONTACTS ON A SAME...

OPTICAL ASSEMBLY WITH A VERTICAL CAVITY SURFACE EMITTING LASER DEVI...

PACKAGING SUBSTRATE WITH LOW THERMAL RESISTANCE AND LOW PARASITIC I...

SUBSTRATE DESIGNS FOR TIME-OF-FLIGHT CAMERA PROJECTORS WITH LOW THE...

OPTICAL DEVICE INCLUDING A SUBSTRATE WITH A CONDUCTOR-FILLED TRENCH...

PACKAGE FOR A TIME OF FLIGHT DEVICE

LASER PROJECTOR WITH ANGLED REFLECTOR

RIGID-FLEXIBLE CIRCUIT INTERCONNECTS

Wearable thermometer patch for correct measurement of human skin te...

Wearable thermometer patch for accurate measurement of human skin t...

Wearable patch for measuring temperature and electrical signals

Wearable thermometer patch capable of measuring human skin temperat...

Wearable patch having reliable conductive contacts for measuring el...

STACKED WAFER LENS AND CAMERA

THREE-DIMENSIONAL IMAGE SENSING MODULE WITH A LOW Z-HEIGHT

METHODS OF FORMING INTEGRATED PACKAGE STRUCTURES WITH LOW Z HEIGHT...

OPTOELECTRONIC ASSEMBLY FOR SIGNAL CONVERSION

RIGID-FLEXIBLE CIRCUIT INTERCONNECTS

Phosphor Layer Arrangement for Use With Light Emitting Diodes

Substrate With Raised Edge Pads

Forming Compliant Contact Pads for Semiconductor Packages

PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES