Wei-Tsu Tseng

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cobalt plated via integration scheme
- Patent number 10,340,183
- Issue date Jul 2, 2019
- GLOBALFOUNDRIES Inc.
- Qiang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual medium filter for ion and particle filtering during semiconduc...
- Patent number 10,109,505
- Issue date Oct 23, 2018
- International Business Machines Corporation
- John H. Zhang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Seamless metallization contacts
- Patent number 9,633,946
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual medium filter for ion and particle filtering during semiconduc...
- Patent number 9,607,864
- Issue date Mar 28, 2017
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardmask removal for copper interconnects with tungsten contacts by...
- Patent number 9,293,365
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping of copper wiring structures in back end of line processing
- Patent number 9,059,177
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post metal chemical-mechanical planarization cleaning process
- Patent number 8,920,567
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Vamsi Devarapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing probe pads
- Patent number 8,822,994
- Issue date Sep 2, 2014
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping of copper wiring structures in back end of line processing
- Patent number 8,765,602
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing probe pads
- Patent number 8,324,622
- Issue date Dec 4, 2012
- STMicroelectronics Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures comprising capping layers with low dielectr...
- Patent number 8,026,166
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection and characterization of SiCOH-based dielectric materials...
- Patent number 7,556,972
- Issue date Jul 7, 2009
- International Business Machines Corporation
- Manoj Balachandran
- B24 - GRINDING POLISHING
Information Patent Grant
Extended life conditioning disk
- Patent number 7,510,463
- Issue date Mar 31, 2009
- International Business Machines Corporation
- Ben Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical planarization performance for copper/low-k interconnect st...
- Patent number 7,407,879
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Lee M Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining uniform CMP hard mask thickness
- Patent number 7,253,098
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Shyng-Tsong T. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping of copper wiring
- Patent number 7,190,079
- Issue date Mar 13, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical planarization performance for copper/low-k interconnect st...
- Patent number 7,071,539
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Lee M Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping of copper wiring
- Patent number 7,008,871
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric constant polymer and monomers used in their formation
- Patent number 6,660,820
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Arthur Martin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- Publication number 20240431025
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Takeshi Nogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT PLATED VIA INTEGRATION SCHEME
- Publication number 20190206729
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES INC.
- Qiang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MEDIUM FILTER FOR ION AND PARTICLE FILTERING DURING SEMICONDUC...
- Publication number 20170148647
- Publication date May 25, 2017
- International Business Machines Corporation
- John H. Zhang
- B08 - CLEANING
Information Patent Application
MULTIMETAL INTERLAYER INTERCONNECTS
- Publication number 20160071791
- Publication date Mar 10, 2016
- GLOBALFOUNDRIES INC.
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK REMOVAL FOR COPPER INTERCONNECTS WITH TUNGSTEN CONTACTS BY...
- Publication number 20150279733
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20150255397
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST METAL CHEMICAL-MECHANICAL PLANARIZATION CLEANING PROCESS
- Publication number 20140256133
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Vamsi Devarapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20140246776
- Publication date Sep 4, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR UNIFORM CMP
- Publication number 20140097539
- Publication date Apr 10, 2014
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20140061914
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MEDIUM FILTER FOR ION AND PARTICLE FILTERING DURING SEMICONDUC...
- Publication number 20130312791
- Publication date Nov 28, 2013
- International Business Machines Corporation
- John H. Zhang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF REPAIRING PROBE PADS
- Publication number 20130072011
- Publication date Mar 21, 2013
- IBM Semiconductor Research and Development Center (SRDC)
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING PROBE PADS
- Publication number 20130063173
- Publication date Mar 14, 2013
- IBM Semiconductor Research and Development Center (SRDC)
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING PROBE PADS
- Publication number 20110156032
- Publication date Jun 30, 2011
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...
- Publication number 20100038793
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION AND CHARACTERIZATION OF SiCOH-BASED DIELECTRIC MATERIALS...
- Publication number 20080182335
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Manoj Balachandran
- B24 - GRINDING POLISHING
Information Patent Application
EXTENDED LIFE CONDITIONING DISK
- Publication number 20070287367
- Publication date Dec 13, 2007
- International Business Machines Corporation
- Ben Kim
- B24 - GRINDING POLISHING
Information Patent Application
WAFER REMOVING FORCE REDUCTION ON CMP TOOL
- Publication number 20070190788
- Publication date Aug 16, 2007
- Manoj Balachandran
- B24 - GRINDING POLISHING
Information Patent Application
Chemical planarization performance for copper/low-k interconnect st...
- Publication number 20060166012
- Publication date Jul 27, 2006
- INTERNATIONAL BUSINESS MACHINES CORP.
- Lee M. Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust Signal Processing Algorithm For End-Pointing Chemical-Mechan...
- Publication number 20060105676
- Publication date May 18, 2006
- International Business Machines Corporation
- Eugene J. O'Sullivan
- B24 - GRINDING POLISHING
Information Patent Application
Selective capping of copper wiring
- Publication number 20060076685
- Publication date Apr 13, 2006
- International Business Machines
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAINTAINING UNIFORM CMP HARD MASK THICKNESS
- Publication number 20060043590
- Publication date Mar 2, 2006
- International Business Machines Corporation
- Steven Shyng-Tsong T. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20050158985
- Publication date Jul 21, 2005
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical planarization performance for copper/low-k interconnect st...
- Publication number 20050023689
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Lee M. Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective capping of copper wiring
- Publication number 20050001325
- Publication date Jan 6, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20040113279
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming planar Cu interconnects without chemical mechanic...
- Publication number 20040094511
- Publication date May 20, 2004
- International Business Machines Corporation
- Soon-Cheon Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Wei-Tsu Tseng

Person

Patents Grantslast 30 patents

Cobalt plated via integration scheme

Dual medium filter for ion and particle filtering during semiconduc...

Seamless metallization contacts

Dual medium filter for ion and particle filtering during semiconduc...

Hardmask removal for copper interconnects with tungsten contacts by...

Doping of copper wiring structures in back end of line processing

Post metal chemical-mechanical planarization cleaning process

Method of repairing probe pads

Doping of copper wiring structures in back end of line processing

Method of repairing probe pads

Interconnect structures comprising capping layers with low dielectr...

Detection and characterization of SiCOH-based dielectric materials...

Extended life conditioning disk

Chemical planarization performance for copper/low-k interconnect st...

Maintaining uniform CMP hard mask thickness

Selective capping of copper wiring

Chemical planarization performance for copper/low-k interconnect st...

Copper recess process with application to selective capping and ele...

Selective capping of copper wiring

Copper recess process with application to selective capping and ele...

Low dielectric constant polymer and monomers used in their formation

Patents Applicationslast 30 patents

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

COBALT PLATED VIA INTEGRATION SCHEME

DUAL MEDIUM FILTER FOR ION AND PARTICLE FILTERING DURING SEMICONDUC...

MULTIMETAL INTERLAYER INTERCONNECTS

HARDMASK REMOVAL FOR COPPER INTERCONNECTS WITH TUNGSTEN CONTACTS BY...

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

POST METAL CHEMICAL-MECHANICAL PLANARIZATION CLEANING PROCESS

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

TECHNIQUE FOR UNIFORM CMP

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

DUAL MEDIUM FILTER FOR ION AND PARTICLE FILTERING DURING SEMICONDUC...

METHOD OF REPAIRING PROBE PADS

METHOD OF REPAIRING PROBE PADS

METHOD OF REPAIRING PROBE PADS

INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...

DETECTION AND CHARACTERIZATION OF SiCOH-BASED DIELECTRIC MATERIALS...

EXTENDED LIFE CONDITIONING DISK

WAFER REMOVING FORCE REDUCTION ON CMP TOOL

Chemical planarization performance for copper/low-k interconnect st...

Robust Signal Processing Algorithm For End-Pointing Chemical-Mechan...

Selective capping of copper wiring

MAINTAINING UNIFORM CMP HARD MASK THICKNESS

Copper recess process with application to selective capping and ele...

Chemical planarization performance for copper/low-k interconnect st...

Selective capping of copper wiring

Copper recess process with application to selective capping and ele...

Method of forming planar Cu interconnects without chemical mechanic...