Wen-Chih Chiou

Person

Zhunan Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 12,159,860
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 12,087,732
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structure and method forming same
- Patent number 12,074,064
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,062,640
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,672
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 12,015,008
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chiplet interposer
- Patent number 11,996,371
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, and sem...
- Patent number 11,948,920
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous dielectric bonding scheme
- Patent number 11,869,869
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with system on chip devices
- Patent number 11,856,800
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,855,042
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with through substrate vias and manufacturi...
- Patent number 11,855,021
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,830,861
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kuang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having backside interconnect...
- Patent number 11,823,979
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 11,817,361
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,817,410
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,774,675
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kuang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure and method
- Patent number 11,756,883
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through chip-on-wafer-on-substrate
- Patent number 11,728,254
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit packages
- Patent number 11,728,314
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
- Publication number 20240395775
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS DIELECTRIC BONDING SCHEME
- Publication number 20240387449
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379602
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363593
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV STRUCTURE AND METHOD FORMING SAME
- Publication number 20240363411
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240347506
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...
- Publication number 20240274461
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET INTERPOSER
- Publication number 20240266303
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD
- Publication number 20240250061
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Forming the Same
- Publication number 20240145431
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240136293
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF
- Publication number 20240136199
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20240136324
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
- Publication number 20240107780
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105701
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Dielectric Bonding Scheme
- Publication number 20240096847
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240096848
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071855
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055315
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240055324
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038616
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411326
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Wen-Chih Chiou

Person

Patents Grantslast 30 patents

Passivation structure with planar top surfaces

Singulation and bonding methods and structures formed thereby

Semiconductor structure and manufacturing method thereof

Via for component electrode connection

Bonding structures of integrated circuit devices and method forming...

Isolation bonding film for semiconductor packages and methods of fo...

TSV structure and method forming same

Semiconductor device and manufacturing method thereof

Package structure and method of forming the same

Wafer bonding method

Chiplet interposer

Bonding structures of integrated circuit devices and method forming...

Wafer bonding method

Giga interposer integration through Chip-On-Wafer-On-Substrate

Via for semiconductor device connection and methods of forming the...

Semiconductor device and method for manufacturing the same, and sem...

Heterogeneous dielectric bonding scheme

Semiconductor devices with system on chip devices

Method of manufacturing semiconductor structure

Semiconductor structure with through substrate vias and manufacturi...

Integrated circuit package and method

Semiconductor package

Method of forming semiconductor device having backside interconnect...

Passivation structure with planar top surfaces

Integrated circuit package and method

Semiconductor device and manufacturing method thereof

Through via structure and method

Interconnect structure and method of forming same

Giga interposer integration through chip-on-wafer-on-substrate

Methods of forming integrated circuit packages

Patents Applicationslast 30 patents

SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

Via for Component Electrode Connection

HETEROGENEOUS DIELECTRIC BONDING SCHEME

METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TSV STRUCTURE AND METHOD FORMING SAME

METHOD OF FORMING PACKAGE STRUCTURE

BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...

CHIPLET INTERPOSER

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

WAFER BONDING METHOD

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

Packaged Semiconductor Devices and Methods of Forming the Same

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING METHOD

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Heterogeneous Dielectric Bonding Scheme

INTEGRATED CIRCUIT PACKAGE AND METHOD

Integrated Circuit Package and Method

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF