Whitney M. Bryks

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dry film lamination with dynamic feedback control
- Patent number 12,214,579
- Issue date Feb 4, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 10,546,916
- Issue date Jan 28, 2020
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate having an interfacial layer
- Patent number 9,799,593
- Issue date Oct 24, 2017
- Intel Corporation
- Whitney Michael Bryks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit surface layer with adhesion-functional group
- Patent number 9,728,500
- Issue date Aug 8, 2017
- Intel Corporation
- Siddharth K. Alur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Publication number 20250022786
- Publication date Jan 16, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...
- Publication number 20250006623
- Publication date Jan 2, 2025
- Intel Corporation
- Shuqi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
- Publication number 20240217216
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- B32 - LAYERED PRODUCTS
Information Patent Application
IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS
- Publication number 20240222211
- Publication date Jul 4, 2024
- Intel Corporation
- Peumie Abeyratne Kuragama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
- Publication number 20240213328
- Publication date Jun 27, 2024
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN CORE LARGE AREA CAPACITORS
- Publication number 20240203664
- Publication date Jun 20, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
- Publication number 20240186263
- Publication date Jun 6, 2024
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186229
- Publication date Jun 6, 2024
- Intel Corporation
- Whitney M. Bryks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING
- Publication number 20240186197
- Publication date Jun 6, 2024
- Intel Corporation
- Aaditya Anand CANDADAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...
- Publication number 20240186136
- Publication date Jun 6, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240177907
- Publication date May 30, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...
- Publication number 20240178146
- Publication date May 30, 2024
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
- Publication number 20240178157
- Publication date May 30, 2024
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...
- Publication number 20240153857
- Publication date May 9, 2024
- Intel Corporation
- Bainye Francoise ANGOUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
- Publication number 20240123561
- Publication date Apr 18, 2024
- Intel Corporation
- Yosef KORNBLUTH
- B24 - GRINDING POLISHING
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240113072
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...
- Publication number 20240112999
- Publication date Apr 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR COATING METHOD
- Publication number 20240105476
- Publication date Mar 28, 2024
- Intel Corporation
- Whitney BRYKS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FILM LAMINATION WITH DYNAMIC FEEDBACK CONTROL
- Publication number 20240092074
- Publication date Mar 21, 2024
- Intel Corporation
- Joshua STACEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUB...
- Publication number 20230420348
- Publication date Dec 28, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE
- Publication number 20230294204
- Publication date Sep 21, 2023
- Intel Corporation
- Jeremy ECTON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER
- Publication number 20230207503
- Publication date Jun 29, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLA...
- Publication number 20230187331
- Publication date Jun 15, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION CONTROLLED WAVEGUIDES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230104330
- Publication date Apr 6, 2023
- Intel Corporation
- Jeremy Ecton
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE
- Publication number 20230090863
- Publication date Mar 23, 2023
- Intel Corporation
- Dilan SENEVIRATNE
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER
- Publication number 20230091834
- Publication date Mar 23, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- G02 - OPTICS
Information Patent Application
MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...
- Publication number 20230090188
- Publication date Mar 23, 2023
- Intel Corporation
- Junxin WANG
- H01 - BASIC ELECTRIC ELEMENTS

Whitney M. Bryks

Person

Patents Grantslast 30 patents

Dry film lamination with dynamic feedback control

Core-shell particles for magnetic packaging

Dual side de-bonding in component carriers using photoablation

Package-integrated vertical capacitors and methods of assembling same

Package-integrated vertical capacitors and methods of assembling same

Semiconductor package substrate having an interfacial layer

Integrated circuit surface layer with adhesion-functional group

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...

MEMS DIES EMBEDDED IN GLASS CORES

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS

DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES

IN CORE LARGE AREA CAPACITORS

STRUCTURE AND PROCESS FOR WARPAGE REDUCTION

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING

POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...

SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE

HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...

MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

POROUS POLYMER DIELECTRIC LAYER ON CORE

LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...

SYSTEM FOR COATING METHOD

THIN FILM CAPACITORS

DRY FILM LAMINATION WITH DYNAMIC FEEDBACK CONTROL

SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUB...

METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE

STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER

INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLA...

POSITION CONTROLLED WAVEGUIDES AND METHODS OF MANUFACTURING THE SAME

OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE

OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER

MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...