Whitney M. Bryks

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic substrates having heterogeneous dielectric layers
- Patent number 12,266,581
- Issue date Apr 1, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry film lamination with dynamic feedback control
- Patent number 12,214,579
- Issue date Feb 4, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 10,546,916
- Issue date Jan 28, 2020
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate having an interfacial layer
- Patent number 9,799,593
- Issue date Oct 24, 2017
- Intel Corporation
- Whitney Michael Bryks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit surface layer with adhesion-functional group
- Patent number 9,728,500
- Issue date Aug 8, 2017
- Intel Corporation
- Siddharth K. Alur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
- Publication number 20250218881
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi MOHAMMADIGHALENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...
- Publication number 20250218929
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250219041
- Publication date Jul 3, 2025
- Intel Corporation
- Whitney M. Bryks
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND SYSTEM FOR COATING OF GLASS SUBSTRATE HAVING A PLURAL...
- Publication number 20250206659
- Publication date Jun 26, 2025
- Intel Corporation
- Joshua STACEY
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION
- Publication number 20250210586
- Publication date Jun 26, 2025
- Intel Corporation
- Praveen SREERAMAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250126814
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125201
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125202
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250120102
- Publication date Apr 10, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Publication number 20250022786
- Publication date Jan 16, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...
- Publication number 20250006623
- Publication date Jan 2, 2025
- Intel Corporation
- Shuqi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
- Publication number 20240217216
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- B32 - LAYERED PRODUCTS
Information Patent Application
IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS
- Publication number 20240222211
- Publication date Jul 4, 2024
- Intel Corporation
- Peumie Abeyratne Kuragama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
- Publication number 20240213328
- Publication date Jun 27, 2024
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN CORE LARGE AREA CAPACITORS
- Publication number 20240203664
- Publication date Jun 20, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
- Publication number 20240186263
- Publication date Jun 6, 2024
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186229
- Publication date Jun 6, 2024
- Intel Corporation
- Whitney M. Bryks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...
- Publication number 20240186136
- Publication date Jun 6, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING
- Publication number 20240186197
- Publication date Jun 6, 2024
- Intel Corporation
- Aaditya Anand CANDADAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240177907
- Publication date May 30, 2024
- Intel Corporation
- Yosef KORNBLUTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...
- Publication number 20240178146
- Publication date May 30, 2024
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS

Whitney M. Bryks

Person

Patents Grantslast 30 patents

Electronic substrates having heterogeneous dielectric layers

Dry film lamination with dynamic feedback control

Core-shell particles for magnetic packaging

Dual side de-bonding in component carriers using photoablation

Package-integrated vertical capacitors and methods of assembling same

Package-integrated vertical capacitors and methods of assembling same

Semiconductor package substrate having an interfacial layer

Integrated circuit surface layer with adhesion-functional group

Patents Applicationslast 30 patents

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...

TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRAT...

APPARATUS AND SYSTEM FOR COATING OF GLASS SUBSTRATE HAVING A PLURAL...

SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...

MEMS DIES EMBEDDED IN GLASS CORES

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS

DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES

IN CORE LARGE AREA CAPACITORS

STRUCTURE AND PROCESS FOR WARPAGE REDUCTION

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...

SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...