Wolfgang Sauter

Person

Eagle-Vail, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Partitioned substrates with interconnect bridge
- Patent number 11,282,806
- Issue date Mar 22, 2022
- Marvell Asia Pte, Ltd.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,790,253
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module (MCM) with chip-to-chip connection redundancy and...
- Patent number 10,748,852
- Issue date Aug 18, 2020
- Marvell International Ltd.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected integrated circuit (IC) chip structure and packaging...
- Patent number 10,714,411
- Issue date Jul 14, 2020
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,615,137
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,600,751
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 10,483,233
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics chip
- Patent number 10,409,006
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- G02 - OPTICS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,290,599
- Issue date May 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,204,877
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,192,839
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowires for pillar interconnects
- Patent number 10,068,864
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 9,953,940
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Photonics chip
- Patent number 9,933,577
- Issue date Apr 3, 2018
- GLOBALFOUNDRIES Inc.
- Jeffery P. Gambino
- G02 - OPTICS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 9,911,708
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 9,911,711
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interface structure
- Patent number 9,875,956
- Issue date Jan 23, 2018
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures for underfill blockout regions
- Patent number 9,798,088
- Issue date Oct 24, 2017
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- G02 - OPTICS
Information Patent Grant
Structures to enable a full intermetallic interconnect
- Patent number 9,741,682
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowires for pillar interconnects
- Patent number 9,679,806
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 9,633,914
- Issue date Apr 25, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug via formation with grid features in the passivation layer
- Patent number 9,633,962
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to prevent solder extrusion
- Patent number 9,613,921
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 9,607,862
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 9,583,451
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer topography
- Patent number 9,466,547
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an interconnect level having a conduct...
- Patent number 9,397,054
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing misshaped solder balls
- Patent number 9,331,037
- Issue date May 3, 2016
- GLOBALFOUNDRIES, INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of electrolytic plating to control solder wetting
- Patent number 9,324,669
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Customized heat dissipation from different types of integrated circ...
- Publication number 20250029888
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Carl E. Benes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH STACKED INTERFACE CHIPLETS
- Publication number 20240258272
- Publication date Aug 1, 2024
- Marvell Asia Pte Ltd.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTITIONED SUBSTRATES WITH INTERCONNECT BRIDGE
- Publication number 20210111141
- Publication date Apr 15, 2021
- GLOBALFOUNDRIES INC.
- Wolfgang SAUTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20200083188
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY
- Publication number 20190363047
- Publication date Nov 28, 2019
- GLOBALFOUNDRIES INC.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING...
- Publication number 20190287879
- Publication date Sep 19, 2019
- GLOBALFOUNDRIES INC.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20190164921
- Publication date May 30, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20190139919
- Publication date May 9, 2019
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20180174988
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PHOTONICS CHIP
- Publication number 20180164508
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- Jeffrey P. GAMBINO
- G02 - OPTICS
Information Patent Application
STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT
- Publication number 20180158797
- Publication date Jun 7, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HEATER FOR HIGH BANDWIDTH MEMORY APPLICATIONS
- Publication number 20180108642
- Publication date Apr 19, 2018
- GLOBALFOUNDRIES INC.
- Wolfgang SAUTER
- G11 - INFORMATION STORAGE
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20180102337
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20180082968
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIP
- Publication number 20170261693
- Publication date Sep 14, 2017
- GLOBALFOUNDRIES INC.
- Jeffery P. GAMBINO
- G02 - OPTICS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170179061
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT
- Publication number 20170179071
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES TO ENABLE A FULL INTERMETALLIC INTERCONNECT
- Publication number 20170179068
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170162536
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170162436
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20170148754
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170141078
- Publication date May 18, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURES FOR UNDERFILL BLOCKOUT REGIONS
- Publication number 20170131476
- Publication date May 11, 2017
- GLOBALFOUNDRIES INC.
- Jeffrey P. Gambino
- G02 - OPTICS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20170125368
- Publication date May 4, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170077000
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20160379948
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20160372430
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING
- Publication number 20160079193
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING MISSHAPED SOLDER BALLS
- Publication number 20160043048
- Publication date Feb 11, 2016
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CRACKSTOP
- Publication number 20160027744
- Publication date Jan 28, 2016
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Wolfgang Sauter

Person

Patents Grantslast 30 patents

Partitioned substrates with interconnect bridge

Conductive pillar shaped for solder confinement

Multi-chip module (MCM) with chip-to-chip connection redundancy and...

Interconnected integrated circuit (IC) chip structure and packaging...

Corrosion resistant aluminum bond pad structure

Conductive pillar shaped for solder confinement

Split ball grid array pad for multi-chip modules

Photonics chip

Conductive pillar shaped for solder confinement

Corrosion resistant aluminum bond pad structure

Conductive pillar shaped for solder confinement

Nanowires for pillar interconnects

Extrusion-resistant solder interconnect structures and methods of f...

Corrosion resistant aluminum bond pad structure

Photonics chip

Conductive pillar shaped for solder confinement

Structures and methods to enable a full intermetallic interconnect

Integrated interface structure

Barrier structures for underfill blockout regions

Structures to enable a full intermetallic interconnect

Nanowires for pillar interconnects

Split ball grid array pad for multi-chip modules

Plug via formation with grid features in the passivation layer

Structure to prevent solder extrusion

Extrusion-resistant solder interconnect structures and methods of f...

Conductive pillar shaped for solder confinement

Passivation layer topography

Semiconductor structure with an interconnect level having a conduct...

Preventing misshaped solder balls

Use of electrolytic plating to control solder wetting

Patents Applicationslast 30 patents

Customized heat dissipation from different types of integrated circ...

INTEGRATED CIRCUIT DEVICE WITH STACKED INTERFACE CHIPLETS

PARTITIONED SUBSTRATES WITH INTERCONNECT BRIDGE

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY

INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING...

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

PHOTONICS CHIP

STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT

INTERPOSER HEATER FOR HIGH BANDWIDTH MEMORY APPLICATIONS

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

PHOTONICS CHIP

NANOWIRES FOR PILLAR INTERCONNECTS

STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT

STRUCTURES TO ENABLE A FULL INTERMETALLIC INTERCONNECT

NANOWIRES FOR PILLAR INTERCONNECTS

NANOWIRES FOR PILLAR INTERCONNECTS

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

BARRIER STRUCTURES FOR UNDERFILL BLOCKOUT REGIONS

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING

PREVENTING MISSHAPED SOLDER BALLS

METHOD OF FORMING AN INTEGRATED CRACKSTOP