Xianming CHEN

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-device graded embedding package substrate and manufacturing m...
- Patent number 12,230,581
- Issue date Feb 18, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for transmitting a signal
- Patent number 12,166,700
- Issue date Dec 10, 2024
- ZTE Corporation
- Kun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation-electromagnetic shielding embedded packaging struc...
- Patent number 12,074,115
- Issue date Aug 27, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for implementing multi-faceted interconnection
- Patent number 12,040,272
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing embedded package structure having air reso...
- Patent number 12,040,526
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit prearranged heat dissipation embedded packaging structure a...
- Patent number 12,002,734
- Issue date Jun 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with antenna and manufacturing method thereof
- Patent number 11,984,414
- Issue date May 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate manufacturing method for realizing three-dimensional pack...
- Patent number 11,961,743
- Issue date Apr 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structure, manufacturing method thereof and substrate
- Patent number 11,942,465
- Issue date Mar 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmitting method, device, and storage medium
- Patent number 11,924,012
- Issue date Mar 5, 2024
- ZTE Corporation
- Kun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for transmitting a signal
- Patent number 11,882,536
- Issue date Jan 23, 2024
- ZTE Corporation
- Xianming Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity substrate having directional optoelectronic transmission cha...
- Patent number 11,822,121
- Issue date Nov 21, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- G02 - OPTICS
Information Patent Grant
Information transmission method, and base station, terminal and com...
- Patent number 11,770,859
- Issue date Sep 26, 2023
- ZTE Corporation
- Kun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package substrate
- Patent number 11,769,733
- Issue date Sep 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information transmission method and apparatus
- Patent number 11,743,902
- Issue date Aug 29, 2023
- ZTE Corporation
- Weiwei Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multicast transmission method and apparatus, and computer storage m...
- Patent number 11,722,854
- Issue date Aug 8, 2023
- ZTE Corporation
- Xianming Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Signal transmission method and system
- Patent number 11,689,333
- Issue date Jun 27, 2023
- ZTE Corporation
- Kun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connector for implementing multi-faceted interconnection
- Patent number 11,682,621
- Issue date Jun 20, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for configuring a scheduling request
- Patent number 11,653,364
- Issue date May 16, 2023
- ZTE Corporation
- Bo Dai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Data transmission method and apparatus
- Patent number 11,595,166
- Issue date Feb 28, 2023
- ZTE Corporation
- Xianming Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Joint resource assigning method and device for allocating resources...
- Patent number 11,595,183
- Issue date Feb 28, 2023
- ZTE Corporation
- Huiying Fang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cavity substrate having directional optoelectronic transmission cha...
- Patent number 11,579,362
- Issue date Feb 14, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- G02 - OPTICS
Information Patent Grant
Support frame structure and manufacturing method thereof
- Patent number 11,569,177
- Issue date Jan 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 11,515,258
- Issue date Nov 29, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device packaging structure embedded in glass medium and met...
- Patent number 11,503,712
- Issue date Nov 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded packaging structure having shielding cavity and manufactur...
- Patent number 11,450,619
- Issue date Sep 20, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing coreless substrate
- Patent number 11,399,440
- Issue date Jul 26, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMMUNICATION METHOD, NETWORK DEVICE AND STORAGE MEDIUM
- Publication number 20250063587
- Publication date Feb 20, 2025
- ZTE Corporation
- Xudong CHENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING MET...
- Publication number 20240332224
- Publication date Oct 3, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240321594
- Publication date Sep 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRU...
- Publication number 20240312796
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240312879
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...
- Publication number 20240274491
- Publication date Aug 15, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240266244
- Publication date Aug 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING EMBEDDED DEVICE PACKAGING SUBSTRATE, PACKA...
- Publication number 20240222245
- Publication date Jul 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240222143
- Publication date Jul 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEVICE PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240194578
- Publication date Jun 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186230
- Publication date Jun 6, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240178088
- Publication date May 30, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR
- Publication number 20240153819
- Publication date May 9, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240113031
- Publication date Apr 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20240096836
- Publication date Mar 21, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND...
- Publication number 20240079287
- Publication date Mar 7, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED FLIP CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071852
- Publication date Feb 29, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...
- Publication number 20240047227
- Publication date Feb 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...
- Publication number 20240030146
- Publication date Jan 25, 2024
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING PHOTOSENSITIVE SENSOR STRUCTURE AND MANUFACTURING ME...
- Publication number 20240021740
- Publication date Jan 18, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR REALIZING CHIP INTERCONNECTION AND MANUFACT...
- Publication number 20240021525
- Publication date Jan 18, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...
- Publication number 20230369167
- Publication date Nov 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED WITH INTEGRATED INDUCTOR AND MANUFACTURING METHO...
- Publication number 20230361058
- Publication date Nov 9, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282565
- Publication date Sep 7, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Xianming CHEN

Person

Patents Grantslast 30 patents

Multi-device graded embedding package substrate and manufacturing m...

System and method for transmitting a signal

Embedded chip package and manufacturing method thereof

Heat dissipation-electromagnetic shielding embedded packaging struc...

Connector for implementing multi-faceted interconnection

Method for manufacturing embedded package structure having air reso...

Circuit prearranged heat dissipation embedded packaging structure a...

Packaging structure with antenna and manufacturing method thereof

Substrate manufacturing method for realizing three-dimensional pack...

Embedded structure, manufacturing method thereof and substrate

Signal transmitting method, device, and storage medium

Structure for embedding and packaging multiple devices by layer and...

System and method for transmitting a signal

Embedded chip package and manufacturing method thereof

Cavity substrate having directional optoelectronic transmission cha...

Information transmission method, and base station, terminal and com...

Package substrate

Information transmission method and apparatus

Multicast transmission method and apparatus, and computer storage m...

Signal transmission method and system

Connector for implementing multi-faceted interconnection

Methods and apparatus for configuring a scheduling request

Data transmission method and apparatus

Joint resource assigning method and device for allocating resources...

Cavity substrate having directional optoelectronic transmission cha...

Support frame structure and manufacturing method thereof

Package substrate and manufacturing method thereof

Passive device packaging structure embedded in glass medium and met...

Embedded packaging structure having shielding cavity and manufactur...

Method for manufacturing coreless substrate

Patents Applicationslast 30 patents

COMMUNICATION METHOD, NETWORK DEVICE AND STORAGE MEDIUM

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING MET...

EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD

ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRU...

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...

PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

METHOD FOR MANUFACTURING EMBEDDED DEVICE PACKAGING SUBSTRATE, PACKA...

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

EMBEDDED DEVICE PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND...

EMBEDDED FLIP CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...

MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...

LIGHT-EMITTING PHOTOSENSITIVE SENSOR STRUCTURE AND MANUFACTURING ME...

PACKAGING STRUCTURE FOR REALIZING CHIP INTERCONNECTION AND MANUFACT...

LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...

SUBSTRATE EMBEDDED WITH INTEGRATED INDUCTOR AND MANUFACTURING METHO...

PACKAGE SUBSTRATE MANUFACTURING METHOD

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF