Xiaoqian LI

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photonic integrated circuit packaging architecture
- Patent number 12,181,710
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Grant
Package expanded beam connector for on-package optics
- Patent number 12,174,436
- Issue date Dec 24, 2024
- Intel Corporation
- Wesley Morgan
- G02 - OPTICS
Information Patent Grant
Bidirectional optical grating coupler with multiple light paths for...
- Patent number 12,158,625
- Issue date Dec 3, 2024
- Intel Corporation
- Kaveh Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
In-package 3D antenna
- Patent number 12,003,023
- Issue date Jun 4, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5G mmWave antenna architecture with thermal management
- Patent number 11,616,283
- Issue date Mar 28, 2023
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 11,522,291
- Issue date Dec 6, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
- Publication number 20250060531
- Publication date Feb 20, 2025
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20250038163
- Publication date Jan 30, 2025
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER
- Publication number 20250004223
- Publication date Jan 2, 2025
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...
- Publication number 20240402442
- Publication date Dec 5, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING A...
- Publication number 20240329313
- Publication date Oct 3, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...
- Publication number 20240272388
- Publication date Aug 15, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...
- Publication number 20240176068
- Publication date May 30, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...
- Publication number 20240176069
- Publication date May 30, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE
- Publication number 20240027710
- Publication date Jan 25, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORT...
- Publication number 20230204878
- Publication date Jun 29, 2023
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A GRIN LENS
- Publication number 20230194791
- Publication date Jun 22, 2023
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LENS ASSEMBLY
- Publication number 20230194783
- Publication date Jun 22, 2023
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Application
OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD
- Publication number 20230185034
- Publication date Jun 15, 2023
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
KEEP-OUT ZONE (KOZ) BARRIERS TO PREVENT EPOXY FLOW INTO V-GROOVE ZO...
- Publication number 20230168448
- Publication date Jun 1, 2023
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230087809
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230088009
- Publication date Mar 23, 2023
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230089494
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230089877
- Publication date Mar 23, 2023
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230089433
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230092821
- Publication date Mar 23, 2023
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
NESTED GLASS PACKAGING ARCHITECTURE FOR HYBRID ELECTRICAL AND OPTIC...
- Publication number 20230080454
- Publication date Mar 16, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220390694
- Publication date Dec 8, 2022
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
- Publication number 20220342150
- Publication date Oct 27, 2022
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
ENABLING PASSIVE ALIGNMENT FOR LENS ATTACH
- Publication number 20220308293
- Publication date Sep 29, 2022
- Intel Corporation
- Xiaoqian LI
- G02 - OPTICS
Information Patent Application
PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS
- Publication number 20220308294
- Publication date Sep 29, 2022
- Intel Corporation
- Wesley MORGAN
- G02 - OPTICS
Information Patent Application
BARRIERS FOR GROOVES IN PHOTONICS DIES
- Publication number 20220310566
- Publication date Sep 29, 2022
- Intel Corporation
- Xiaoqian LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO COUPLE LIGHT USING INTEGRATED HEAT SPREADER
- Publication number 20220291462
- Publication date Sep 15, 2022
- Intel Corporation
- Divya PRATAP
- G02 - OPTICS
Information Patent Application
NOVEL CONNECTOR DESIGNS FOR PHOTONICS PACKAGING INTEGRATION
- Publication number 20220196935
- Publication date Jun 23, 2022
- Intel Corporation
- Xiaoqian LI
- G02 - OPTICS
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20220199600
- Publication date Jun 23, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

Xiaoqian LI

Person

Patents Grantslast 30 patents

Photonic integrated circuit packaging architecture

Package expanded beam connector for on-package optics

Bidirectional optical grating coupler with multiple light paths for...

Optical multichip package with multiple system-on-chip dies

Completely encapsulated optical multi chip package

Patch on interposer architecture for low cost optical co-packaging

Silicon groove architectures and manufacturing processes for passiv...

In-package 3D antenna

5G mmWave antenna architecture with thermal management

Antenna boards and communication devices

Patents Applicationslast 30 patents

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER

PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...

TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING A...

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...

EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE

PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORT...

ELECTRONIC DEVICE INCLUDING A GRIN LENS

ELECTRONIC DEVICE INCLUDING A LENS ASSEMBLY

OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD

KEEP-OUT ZONE (KOZ) BARRIERS TO PREVENT EPOXY FLOW INTO V-GROOVE ZO...

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

NESTED GLASS PACKAGING ARCHITECTURE FOR HYBRID ELECTRICAL AND OPTIC...

THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE

ENABLING PASSIVE ALIGNMENT FOR LENS ATTACH

PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS

BARRIERS FOR GROOVES IN PHOTONICS DIES

METHOD TO COUPLE LIGHT USING INTEGRATED HEAT SPREADER

NOVEL CONNECTOR DESIGNS FOR PHOTONICS PACKAGING INTEGRATION

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES