Xunyuan ZHANG

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a self-forming barrier layer at via bottom
- Patent number RE49820
- Issue date Jan 30, 2024
- GLOBALFOUNDRIES U.S. INC.
- Larry Zhao
Information Patent Grant
Fully aligned via in ground rule region
- Patent number 11,114,338
- Issue date Sep 7, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas V. Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of forming low resistivity noble metal intercon...
- Patent number 10,679,937
- Issue date Jun 9, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repaired mask structures and resultant underlying patterned structures
- Patent number 10,643,845
- Issue date May 5, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via structures
- Patent number 10,636,698
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of protecting structure of integrated circuit from rework
- Patent number 10,636,656
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Lei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay mark structures
- Patent number 10,627,720
- Issue date Apr 21, 2020
- GLOBALFOUNDRIES Inc.
- Lei Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal insulator metal capacitor devices
- Patent number 10,629,428
- Issue date Apr 21, 2020
- GLOBALFOUNDRIES Inc.
- Shariq Siddiqui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal interconnects for super (skip) via integration
- Patent number 10,573,593
- Issue date Feb 25, 2020
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with interface liner and methods of forming same
- Patent number 10,553,478
- Issue date Feb 4, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming V0 structures for semiconductor devices by formi...
- Patent number 10,546,854
- Issue date Jan 28, 2020
- GLOBALFOUNDRIES Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,485,111
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a self-forming barrier layer at via bottom
- Patent number RE47630
- Issue date Oct 1, 2019
- GLOBALFOUNDRIES Inc.
- Larry Zhao
Information Patent Grant
Fully aligned via in ground rule region
- Patent number 10,366,919
- Issue date Jul 30, 2019
- GLOBALFOUNDRIES Inc.
- Nicholas V. Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts to source or drain region of transistor
- Patent number 10,283,608
- Issue date May 7, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects formed by a metal replacement process
- Patent number 10,283,372
- Issue date May 7, 2019
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a vertical field effect transistor (VFET) and a V...
- Patent number 10,276,689
- Issue date Apr 30, 2019
- GLOBALFOUNDRIES Inc.
- Yi Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via structures
- Patent number 10,262,892
- Issue date Apr 16, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-spacer self-aligned cut formation
- Patent number 10,236,256
- Issue date Mar 19, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors with dielectric inner spacers
- Patent number 10,211,147
- Issue date Feb 19, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned interconnect structures
- Patent number 10,199,264
- Issue date Feb 5, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal wire on contact structure and method for forming...
- Patent number 10,199,271
- Issue date Feb 5, 2019
- GLOBALFOUNDRIES Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,199,261
- Issue date Feb 5, 2019
- GLOBALFOUNDRIES Inc.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form air-gap spacers and air-gap spacer-containing struct...
- Patent number 10,164,104
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-mandrel cut formation
- Patent number 10,163,633
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,157,833
- Issue date Dec 18, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control during skip via formation
- Patent number 10,109,526
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt interconnects formed by selective bottom-up fill
- Patent number 10,109,490
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Sean X. Lin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
IC structure with interface liner and methods of forming same
- Patent number 10,079,208
- Issue date Sep 18, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lithographic patterning
- Patent number 10,056,292
- Issue date Aug 21, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF PROTECTING STRUCTURE OF INTEGRATED CIRCUIT FROM REWORK
- Publication number 20190318927
- Publication date Oct 17, 2019
- GLOBALFOUNDRIES INC.
- Lei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA IN GROUND RULE REGION
- Publication number 20190311948
- Publication date Oct 10, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LICAUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR DEVICES
- Publication number 20190279860
- Publication date Sep 12, 2019
- GLOBALFOUNDRIES INC.
- Shariq SIDDIQUI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SKIP VIA STRUCTURES
- Publication number 20190221473
- Publication date Jul 18, 2019
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRED MASK STRUCTURES AND RESULTANT UNDERLYING PATTERNED STRUCTURES
- Publication number 20190206682
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE STRUCTURES WITH AIR GAPS
- Publication number 20190206718
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FORMED BY A METAL REPLACEMENT PROCESS
- Publication number 20190088500
- Publication date Mar 21, 2019
- GLOBALFOUNDRIES INC.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA IN GROUND RULE REGION
- Publication number 20190088541
- Publication date Mar 21, 2019
- GLOBALFOUNDRIES Inc.
- Nicholas V. LICAUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY MARK STRUCTURES
- Publication number 20190056671
- Publication date Feb 21, 2019
- GLOBALFOUNDRIES INC.
- Lei Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190027401
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTS FORMED WITH STRUCTURALLY-MODIFIED CAPS
- Publication number 20190013240
- Publication date Jan 10, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH DIELECTRIC INNER SPACERS
- Publication number 20190013269
- Publication date Jan 10, 2019
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A VERTICAL FIELD EFFECT TRANSISTOR (VFET) AND A V...
- Publication number 20180358452
- Publication date Dec 13, 2018
- GLOBALFOUNDRIES INC.
- YI QI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20180342454
- Publication date Nov 29, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME
- Publication number 20180337126
- Publication date Nov 22, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-OF-LINE LOCAL INTERCONNECT STRUCTURES WITH HYBRID FEATURES
- Publication number 20180308752
- Publication date Oct 25, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-SPACER SELF-ALIGNED CUT FORMATION
- Publication number 20180301413
- Publication date Oct 18, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE STRUCTURES
- Publication number 20180277426
- Publication date Sep 27, 2018
- GLOBALFOUNDRIES INC.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE RUTHENIUM-CONTAINING CONTACTS
- Publication number 20180269297
- Publication date Sep 20, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECTS FOR SUPER (SKIP) VIA INTEGRATION
- Publication number 20180269150
- Publication date Sep 20, 2018
- GLOBALFOUNDRIES INC.
- Sean Xuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-MANDREL CUT FORMATION
- Publication number 20180261457
- Publication date Sep 13, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED INTERCONNECT STRUCTURES
- Publication number 20180151504
- Publication date May 31, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST SPACER SELF-ALIGNED CUTS
- Publication number 20180144976
- Publication date May 24, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LITHOGRAPHIC PATTERNING
- Publication number 20180144979
- Publication date May 24, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM AIR-GAP SPACERS AND AIR-GAP SPACER-CONTAINING STRUCT...
- Publication number 20180130899
- Publication date May 10, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA STRUCTURES
- Publication number 20180130699
- Publication date May 10, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...
- Publication number 20180040555
- Publication date Feb 8, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME
- Publication number 20180033728
- Publication date Feb 1, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLACING A GATE CONTACT INSIDE A SEMICONDUC...
- Publication number 20180012798
- Publication date Jan 11, 2018
- GLOBALFOUDRIES INC.
- Andre LABONTE
- H01 - BASIC ELECTRIC ELEMENTS

Xunyuan ZHANG

Person

Patents Grantslast 30 patents

Semiconductor device having a self-forming barrier layer at via bottom

Fully aligned via in ground rule region

Devices and methods of forming low resistivity noble metal intercon...

Repaired mask structures and resultant underlying patterned structures

Skip via structures

Methods of protecting structure of integrated circuit from rework

Overlay mark structures

Metal insulator metal capacitor devices

Metal interconnects for super (skip) via integration

IC structure with interface liner and methods of forming same

Methods of forming V0 structures for semiconductor devices by formi...

Via and skip via structures

Semiconductor device having a self-forming barrier layer at via bottom

Fully aligned via in ground rule region

Low resistance contacts to source or drain region of transistor

Interconnects formed by a metal replacement process

Method of forming a vertical field effect transistor (VFET) and a V...

Skip via structures

Pre-spacer self-aligned cut formation

Metal-insulator-metal capacitors with dielectric inner spacers

Self aligned interconnect structures

Self-aligned metal wire on contact structure and method for forming...

Via and skip via structures

Method to form air-gap spacers and air-gap spacer-containing struct...

Non-mandrel cut formation

Via and skip via structures

Etch profile control during skip via formation

Cobalt interconnects formed by selective bottom-up fill

IC structure with interface liner and methods of forming same

Self-aligned lithographic patterning

Patents Applicationslast 30 patents

METHODS OF PROTECTING STRUCTURE OF INTEGRATED CIRCUIT FROM REWORK

FULLY ALIGNED VIA IN GROUND RULE REGION

METAL INSULATOR METAL CAPACITOR DEVICES

SKIP VIA STRUCTURES

REPAIRED MASK STRUCTURES AND RESULTANT UNDERLYING PATTERNED STRUCTURES

BACK-END-OF-LINE STRUCTURES WITH AIR GAPS

INTERCONNECTS FORMED BY A METAL REPLACEMENT PROCESS

FULLY ALIGNED VIA IN GROUND RULE REGION

OVERLAY MARK STRUCTURES

VIA AND SKIP VIA STRUCTURES

VIA AND SKIP VIA STRUCTURES

INTERCONNECTS FORMED WITH STRUCTURALLY-MODIFIED CAPS

METAL-INSULATOR-METAL CAPACITORS WITH DIELECTRIC INNER SPACERS

METHOD OF FORMING A VERTICAL FIELD EFFECT TRANSISTOR (VFET) AND A V...

VIA AND SKIP VIA STRUCTURES

IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME

MIDDLE-OF-LINE LOCAL INTERCONNECT STRUCTURES WITH HYBRID FEATURES

PRE-SPACER SELF-ALIGNED CUT FORMATION

METHODS OF FORMING CONDUCTIVE STRUCTURES

LOW RESISTANCE RUTHENIUM-CONTAINING CONTACTS

METAL INTERCONNECTS FOR SUPER (SKIP) VIA INTEGRATION

NON-MANDREL CUT FORMATION

SELF ALIGNED INTERCONNECT STRUCTURES

POST SPACER SELF-ALIGNED CUTS

SELF-ALIGNED LITHOGRAPHIC PATTERNING

METHOD TO FORM AIR-GAP SPACERS AND AIR-GAP SPACER-CONTAINING STRUCT...

SKIP VIA STRUCTURES

DEVICES AND METHODS OF FORMING LOW RESISTIVITY NOBLE METAL INTERCON...

IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME

METHOD AND APPARATUS FOR PLACING A GATE CONTACT INSIDE A SEMICONDUC...