Y. Mohammed Kasem

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 9,136,060
- Issue date Sep 15, 2015
- Vishay Siliconix
- Haim Goldberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 8,324,711
- Issue date Dec 4, 2012
- Vishay Intertechnology, Inc.
- Haim Goldberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 8,004,063
- Issue date Aug 23, 2011
- Vishay Intertechnology, Inc.
- Haim Goldberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die package including cup-shaped leadframe
- Patent number 7,595,547
- Issue date Sep 29, 2009
- Vishay Siliconix
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mount package for semiconductor device and proce...
- Patent number 7,589,396
- Issue date Sep 15, 2009
- Vishay Siliconix
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mount package for semiconductor device and proce...
- Patent number 7,211,877
- Issue date May 1, 2007
- Vishay Siliconix
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 7,151,036
- Issue date Dec 19, 2006
- Vishay-Siliconix
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with package using cup-shaped lead-frame
- Patent number 6,909,170
- Issue date Jun 21, 2005
- Siliconix Incorporated
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mount package for semiconductor device and proce...
- Patent number 6,876,061
- Issue date Apr 5, 2005
- Vishay Intertechnology, Inc.
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including cup-shaped leadframe
- Patent number 6,744,124
- Issue date Jun 1, 2004
- Siliconix Incorporated
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 6,621,142
- Issue date Sep 16, 2003
- Vishay Intertechnology, Inc.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision high-frequency capacitor on semiconductor substrate
- Patent number 6,621,143
- Issue date Sep 16, 2003
- Vishay Intertechnology, Inc.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mount package for semiconductor device and proce...
- Patent number 6,562,647
- Issue date May 13, 2003
- Vishay Intertechnology, Inc.
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 6,538,300
- Issue date Mar 25, 2003
- Vishay Intertechnology, Inc.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mount package for semiconductor device and proce...
- Patent number 6,441,475
- Issue date Aug 27, 2002
- Vishay Intertechnology, Inc.
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical structure for semiconductor wafer-level chip scale packages
- Patent number 6,392,290
- Issue date May 21, 2002
- Siliconix Incorporated
- Y. Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mount packages for semiconductor device and proc...
- Patent number 6,316,287
- Issue date Nov 13, 2001
- Vishay Intertechnology, Inc.
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating a chip scale surface mount package for semic...
- Patent number 6,271,060
- Issue date Aug 7, 2001
- Vishay Intertechnology, Inc.
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with directly connected leads
- Patent number 6,249,041
- Issue date Jun 19, 2001
- Siliconix Incorporated
- Y. Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate circuit devices in an intra-package configuration and asse...
- Patent number 6,066,890
- Issue date May 23, 2000
- Siliconix Incorporated
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRECISION HIGH-FREQUENCY CAPACITOR FORMED ON SEMICONDUCTOR SUBSTRATE
- Publication number 20110176247
- Publication date Jul 21, 2011
- VISHAY INTERTECHNOLOGY, INC.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precision high-frequency capacitor formed on semiconductor substrate
- Publication number 20100295152
- Publication date Nov 25, 2010
- Vishay Intertechnology, Inc.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCE...
- Publication number 20090278179
- Publication date Nov 12, 2009
- VISHAY-SILICONIX
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING TECHNIQUES
- Publication number 20090256246
- Publication date Oct 15, 2009
- VISHAY-SILICONIX
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION HIGH-FREQUENCY CAPACITOR FORMED ON SEMICONDUCTOR SUBSTRATE
- Publication number 20080108202
- Publication date May 8, 2008
- VISHAY-SILICONIX
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mount package for semiconductor device and proce...
- Publication number 20070235774
- Publication date Oct 11, 2007
- VISHAY-SILICONIX
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precision high-frequency capacitor formed on semiconductor substrate
- Publication number 20030057517
- Publication date Mar 27, 2003
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor assembly with package using cup-shaped lead frame
- Publication number 20030057532
- Publication date Mar 27, 2003
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precision high-frequency capacitor on semiconductor substrate
- Publication number 20030030125
- Publication date Feb 13, 2003
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mount package for semiconductor device and proce...
- Publication number 20020185710
- Publication date Dec 12, 2002
- Vishay Intertechnology, Inc.
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mount package for semiconductor device and proce...
- Publication number 20010016369
- Publication date Aug 23, 2001
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mount packages for semiconductor device
- Publication number 20010009298
- Publication date Jul 26, 2001
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mount package for semiconductor device and proce...
- Publication number 20010000631
- Publication date May 3, 2001
- Felix Zandman
- H01 - BASIC ELECTRIC ELEMENTS

Y. Mohammed Kasem

Person

Patents Grantslast 30 patents

Precision high-frequency capacitor formed on semiconductor substrate

Precision high-frequency capacitor formed on semiconductor substrate

Precision high-frequency capacitor formed on semiconductor substrate

Semiconductor die package including cup-shaped leadframe

Chip scale surface mount package for semiconductor device and proce...

Chip scale surface mount package for semiconductor device and proce...

Precision high-frequency capacitor formed on semiconductor substrate

Semiconductor assembly with package using cup-shaped lead-frame

Chip scale surface mount package for semiconductor device and proce...

Semiconductor die package including cup-shaped leadframe

Precision high-frequency capacitor formed on semiconductor substrate

Precision high-frequency capacitor on semiconductor substrate

Chip scale surface mount package for semiconductor device and proce...

Precision high-frequency capacitor formed on semiconductor substrate

Chip scale surface mount package for semiconductor device and proce...

Vertical structure for semiconductor wafer-level chip scale packages

Chip scale surface mount packages for semiconductor device and proc...

Process of fabricating a chip scale surface mount package for semic...

IC chip package with directly connected leads

Separate circuit devices in an intra-package configuration and asse...

Patents Applicationslast 30 patents

PRECISION HIGH-FREQUENCY CAPACITOR FORMED ON SEMICONDUCTOR SUBSTRATE

Precision high-frequency capacitor formed on semiconductor substrate

CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCE...

SEMICONDUCTOR PACKAGING TECHNIQUES

PRECISION HIGH-FREQUENCY CAPACITOR FORMED ON SEMICONDUCTOR SUBSTRATE

Chip scale surface mount package for semiconductor device and proce...

Precision high-frequency capacitor formed on semiconductor substrate

Semiconductor assembly with package using cup-shaped lead frame

Precision high-frequency capacitor on semiconductor substrate

Chip scale surface mount package for semiconductor device and proce...

Chip scale surface mount package for semiconductor device and proce...

Chip scale surface mount packages for semiconductor device

Chip scale surface mount package for semiconductor device and proce...