Yamazaki Toshio

Person

Ogo-ri, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 7,704,799
- Issue date Apr 27, 2010
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 7,205,645
- Issue date Apr 17, 2007
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 7,187,072
- Issue date Mar 6, 2007
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,746,897
- Issue date Jun 8, 2004
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor device substrate, and methods o...
- Patent number 6,617,193
- Issue date Sep 9, 2003
- Hitachi Chemical Company, Ltd.
- Yamazaki Toshio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabrication thereof
- Patent number 6,492,203
- Issue date Dec 10, 2002
- Hitachi Chemical Company, Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,365,432
- Issue date Apr 2, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 5,976,912
- Issue date Nov 2, 1999
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,504,992
- Issue date Apr 9, 1996
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...
- Publication number 20070161228
- Publication date Jul 12, 2007
- HITACHI CHEMICAL CO., Ltd.
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20040110319
- Publication date Jun 10, 2004
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and method of manufacturing wir...
- Publication number 20030141596
- Publication date Jul 31, 2003
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020094606
- Publication date Jul 18, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020039808
- Publication date Apr 4, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS

Yamazaki Toshio

Person

Patents Grantslast 30 patents

Method of manufacturing wiring substrate

Wiring board, semiconductor device, and method of manufacturing wir...

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Semiconductor device, semiconductor device substrate, and methods o...

Semiconductor device and method of fabrication thereof

Fabrication process of semiconductor package and semiconductor package

Substrate for holding a chip of semi-conductor package, semi-conduc...

Method of production of semiconductor device

Substrate for holding a chip of semi-conductor package, semi-conduc...

Fabrication process of semiconductor package and semiconductor package

Fabrication process of wiring board

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...

Fabrication process of semiconductor package and semiconductor package

Wiring board, semiconductor device, and method of manufacturing wir...

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package