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Yasuhiko Horio
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Non-reciprocal circuit device, method of manufacturing, and mobile...
Patent number
6,850,751
Issue date
Feb 1, 2005
Matsushita Electric Industrial Co., Ltd.
Kengo Shiiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-reciprocal circuit element, lumped element type isolator, and m...
Patent number
6,535,074
Issue date
Mar 18, 2003
Matsushita Electric Industrial Co., Ltd.
Yasuhiko Horio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-reciprocal circuit element having a grounding land between inpu...
Patent number
6,531,930
Issue date
Mar 11, 2003
Matsushita Electric Industrial Co., Ltd.
Yasuhiko Horio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-reciprocal circuit element with ground terminals on one side fr...
Patent number
6,396,361
Issue date
May 28, 2002
Matsushita Electric Industrial Co., Ltd.
Yasuhiko Horio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface wave filter element
Patent number
5,521,454
Issue date
May 28, 1996
Matsushita Electric Industrial Co., Ltd.
Masumi Hattori
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Method of manufacturing organic substrate used for printed circuits
Patent number
5,481,795
Issue date
Jan 9, 1996
Matsushita Electric Industrial Co., Ltd.
Akihito Hatakeyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Two-sided printed circuit board a multi-layered printed circuit board
Patent number
5,440,075
Issue date
Aug 8, 1995
Matsushita Electric Industrial Co., Ltd.
Kouji Kawakita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Porous substrate and conductive ink filled vias for printed circuits
Patent number
5,346,750
Issue date
Sep 13, 1994
Matsushita Electric Industrial Co., Ltd.
Akihito Hatakeyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming an electrical contact bump
Patent number
5,090,119
Issue date
Feb 25, 1992
Matsushita Electric Industrial Co., Ltd.
Toshio Tsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical contact bump and a package provided with the same
Patent number
5,014,111
Issue date
May 7, 1991
Matsushita Electric Industrial Co., Ltd.
Toshio Tsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer ceramic substrate and method of making the same
Patent number
4,732,798
Issue date
Mar 22, 1988
Matsushita Electric Industrial Co., Ltd.
Toru Ishida
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Structure of non-reciprocal circuit element
Publication number
20030231076
Publication date
Dec 18, 2003
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Takayuki Takeuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Non-reciprocal circuit element, lumped element type isolator, and m...
Publication number
20020097102
Publication date
Jul 25, 2002
Yasuhiko Horio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Non-reciprocal circuit element, lumped element type isolator, and m...
Publication number
20020089390
Publication date
Jul 11, 2002
Yasuhiko Horio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Non-reciprocal circuit element, lumped element type isolator, and m...
Publication number
20020089392
Publication date
Jul 11, 2002
Yasuhiko Horio
H01 - BASIC ELECTRIC ELEMENTS