Yi Yang

Person

Gilbert, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR INTEGRATED GRADED INDEX LENSES IN PHOTONIC CIRCUITS
- Publication number 20240219632
- Publication date Jul 4, 2024
- Intel Corporation
- Umesh Prasad
- G02 - OPTICS
Information Patent Application
DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING
- Publication number 20240213131
- Publication date Jun 27, 2024
- Intel Corporation
- Yi YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLAS...
- Publication number 20240186264
- Publication date Jun 6, 2024
- Intel Corporation
- Yi Yang
- B32 - LAYERED PRODUCTS
Information Patent Application
NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS
- Publication number 20240111089
- Publication date Apr 4, 2024
- Intel Corporation
- Yi YANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
- Publication number 20240113048
- Publication date Apr 4, 2024
- Intel Corporation
- Srinivasan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
- Publication number 20240113046
- Publication date Apr 4, 2024
- Intel Corporation
- Jason Scott Steill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINX BASED SURFACE FINISH ARCHITECTURE
- Publication number 20240006299
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD
- Publication number 20240006291
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...
- Publication number 20240006283
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattawa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006300
- Publication date Jan 4, 2024
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006285
- Publication date Jan 4, 2024
- The Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER
- Publication number 20240006297
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
- Publication number 20230420322
- Publication date Dec 28, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECT...
- Publication number 20230420389
- Publication date Dec 28, 2023
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES
- Publication number 20230420346
- Publication date Dec 28, 2023
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...
- Publication number 20230420353
- Publication date Dec 28, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS
- Publication number 20230402368
- Publication date Dec 14, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395445
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395467
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELE...
- Publication number 20230317583
- Publication date Oct 5, 2023
- Intel Corporation
- Rahul N. MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...
- Publication number 20230317614
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPR...
- Publication number 20230317584
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...
- Publication number 20230085997
- Publication date Mar 23, 2023
- Intel Corporation
- Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Applicationslast 30 patents

TECHNOLOGIES FOR INTEGRATED GRADED INDEX LENSES IN PHOTONIC CIRCUITS

DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING

POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLAS...

NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

SINX BASED SURFACE FINISH ARCHITECTURE

POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD

EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER

ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE

STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECT...

SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES

ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...

TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELE...

SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...

PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPR...

METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...