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YING-CHENG WU

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    IMAGE SENSOR PACKAGE, CAMERA MODULE HAVING SAME AND MANUFACTURING M...
    • Publication number 20090283662
    • Publication date Nov 19, 2009
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR PACKAGE AND CAMERA MODULE UTILIZING THE SAME
    • Publication number 20090284628
    • Publication date Nov 19, 2009
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED SEMICONDUCTOR PACKAGE
    • Publication number 20090267206
    • Publication date Oct 29, 2009
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IMAGE SENSOR PACKAGE AND CAMERA MODULE HAVING SAME
    • Publication number 20090262226
    • Publication date Oct 22, 2009
    • HON HAI Precision Industry CO., LTD.
    • CHI-KUEI LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED...
    • Publication number 20090166833
    • Publication date Jul 2, 2009
    • HON HAI Precision Industry CO., LTD.
    • STEVEN WEBSTER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMBINATION OF CHIP PACKAGE UNITS
    • Publication number 20090166837
    • Publication date Jul 2, 2009
    • HON HAI Precision Industry CO., LTD.
    • STEVEN WEBSTER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGING MODULE PACKAGE
    • Publication number 20090153706
    • Publication date Jun 18, 2009
    • HON HAI Precision Industry CO., LTD.
    • STEVEN WEBSTER
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    IMAGING MODULE PACKAGE
    • Publication number 20090135296
    • Publication date May 28, 2009
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20090135297
    • Publication date May 28, 2009
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    IMAGING MODULE PACKAGE
    • Publication number 20090122176
    • Publication date May 14, 2009
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    IMAGE CAPTURING DEVICE
    • Publication number 20080265350
    • Publication date Oct 30, 2008
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF
    • Publication number 20080266822
    • Publication date Oct 30, 2008
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHO...
    • Publication number 20080252771
    • Publication date Oct 16, 2008
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    COMPACT IMAGE SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20080252760
    • Publication date Oct 16, 2008
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20080251875
    • Publication date Oct 16, 2008
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor chip package
    • Publication number 20080203512
    • Publication date Aug 28, 2008
    • Hon Hai Precision Industry CO., LTD.
    • Steven Webster
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    IMAGE SENSOR PACKAGE AND IMAGE SENSING MODULE USING THE PACKAGE
    • Publication number 20080105819
    • Publication date May 8, 2008
    • ALTUS TECHNOLOGY INC.
    • YING-CHENG WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE, METHOD OF MAKING SAME AND DIGITAL CAMERA MODULE USING...
    • Publication number 20080099864
    • Publication date May 1, 2008
    • HON HAI Precision Industry CO., LTD.
    • YING-CHENG WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LENS MODULE AND DIGITAL CAMERA MODULE USING SAME
    • Publication number 20080100934
    • Publication date May 1, 2008
    • HON HAI Precision Industry CO., LTD.
    • STEVEN WEBSTER
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Digital camera module using stacked chip package
    • Publication number 20070165136
    • Publication date Jul 19, 2007
    • ALTUS TECHNOLOGY INC.
    • Ying-Cheng Wu
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Stacked chip packaging structure
    • Publication number 20070152345
    • Publication date Jul 5, 2007
    • ALTUS TECHNOLOGY INC.
    • Ying-Cheng Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Testing system for digital camera modules
    • Publication number 20070146486
    • Publication date Jun 28, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Digital camera module packaging method
    • Publication number 20070126915
    • Publication date Jun 7, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Digital Camera Module
    • Publication number 20070126081
    • Publication date Jun 7, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Image sensor chip packaging method
    • Publication number 20070126916
    • Publication date Jun 7, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Image sensor chip package
    • Publication number 20070108561
    • Publication date May 17, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor chip package fabrication method
    • Publication number 20070057149
    • Publication date Mar 15, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Digital camera module package fabrication method
    • Publication number 20070057148
    • Publication date Mar 15, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor chip package
    • Publication number 20070034772
    • Publication date Feb 15, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Image sensor chip package
    • Publication number 20070023608
    • Publication date Feb 1, 2007
    • ALTUS TECHNOLOGY INC.
    • Steven Webster
    • H01 - BASIC ELECTRIC ELEMENTS