Yoji Mori

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 10,966,326
- Issue date Mar 30, 2021
- Ibiden Co., Ltd.
- Kotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with crossing wiring pattern
- Patent number 8,629,550
- Issue date Jan 14, 2014
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for mounting electronic parts
- Patent number RE44251
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Motoo Asai
- 174 - Electricity: conductors and insulators
Information Patent Grant
Printed wiring board with notched conductive traces
- Patent number 8,018,046
- Issue date Sep 13, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number RE41242
- Issue date Apr 20, 2010
- Ibiden Co., Ltd.
- Motoo Asai
- 361 - Electricity: electrical systems and devices
Information Patent Grant
Package substrate
- Patent number RE41051
- Issue date Dec 22, 2009
- Ibiden Co., Ltd.
- Motoo Asai
- 361 - Electricity: electrical systems and devices
Information Patent Grant
Printed wiring board with wiring pattern having narrow width portion
- Patent number 7,525,190
- Issue date Apr 28, 2009
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating crossing wiring pattern on a printed circuit...
- Patent number 7,332,816
- Issue date Feb 19, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number 6,490,170
- Issue date Dec 3, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number 6,487,088
- Issue date Nov 26, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number 6,411,519
- Issue date Jun 25, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of production thereof
- Patent number 6,407,345
- Issue date Jun 18, 2002
- Ibiden Co., Ltd.
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 6,392,898
- Issue date May 21, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board for mounting electronic parts
- Patent number 6,384,344
- Issue date May 7, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 6,342,682
- Issue date Jan 29, 2002
- Ibiden Co., Ltd.
- Yoji Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 6,316,738
- Issue date Nov 13, 2001
- Ibiden Co., Ltd.
- Yoji Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20220248530
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Yoji MORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20200329568
- Publication date Oct 15, 2020
- IBIDEN CO., LTD.
- Kotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190200465
- Publication date Jun 27, 2019
- IBIDEN CO., LTD.
- Yoji Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20110290544
- Publication date Dec 1, 2011
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20090159327
- Publication date Jun 25, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method of printed wiring board
- Publication number 20050158553
- Publication date Jul 21, 2005
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method of printed wiring board
- Publication number 20020189849
- Publication date Dec 19, 2002
- IBIDEN CO., LTD.
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate
- Publication number 20010055203
- Publication date Dec 27, 2001
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate
- Publication number 20010054513
- Publication date Dec 27, 2001
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate
- Publication number 20010037896
- Publication date Nov 8, 2001
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate
- Publication number 20010038531
- Publication date Nov 8, 2001
- Motoo Asai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wiring substrate and method for manufacturing wiring substrate

Printed wiring board with crossing wiring pattern

Circuit board for mounting electronic parts

Printed wiring board with notched conductive traces

Package substrate

Package substrate

Printed wiring board with wiring pattern having narrow width portion

Method of fabricating crossing wiring pattern on a printed circuit...

Package substrate

Package substrate

Package substrate

Printed circuit board and method of production thereof

Package substrate

Circuit board for mounting electronic parts

Printed wiring board and manufacturing method thereof

Printed wiring board and manufacturing method thereof

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

MULTILAYER WIRING BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

Printed wiring board and manufacturing method of printed wiring board

Printed wiring board and manufacturing method of printed wiring board

Package substrate

Package substrate

Package substrate

Package substrate