Yoshiaki Tsubomatsu

Person

Tsuchiura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for mounting semiconductor chip and method for producing...
- Patent number 8,997,341
- Issue date Apr 7, 2015
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 7,187,072
- Issue date Mar 6, 2007
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,746,897
- Issue date Jun 8, 2004
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the fabrication of wiring board for electrical tests
- Patent number 6,568,073
- Issue date May 27, 2003
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,365,432
- Issue date Apr 2, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board for electrical tests with bumps having polymeric coating
- Patent number 6,133,534
- Issue date Oct 17, 2000
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 5,976,912
- Issue date Nov 2, 1999
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,664,325
- Issue date Sep 9, 1997
- Hitachi Chemical Co. Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,504,992
- Issue date Apr 9, 1996
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,426,850
- Issue date Jun 27, 1995
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing high-density wiring board
- Patent number 4,830,691
- Issue date May 16, 1989
- Hitachi Chemical Company, Ltd.
- Akinari Kida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING...
- Publication number 20120234584
- Publication date Sep 20, 2012
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20040110319
- Publication date Jun 10, 2004
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020094606
- Publication date Jul 18, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020039808
- Publication date Apr 4, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiaki Tsubomatsu

Person

Patents Grantslast 30 patents

Substrate for mounting semiconductor chip and method for producing...

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Process for the fabrication of wiring board for electrical tests

Fabrication process of semiconductor package and semiconductor package

Substrate for holding a chip of semi-conductor package, semi-conduc...

Method of production of semiconductor device

Wiring board for electrical tests with bumps having polymeric coating

Substrate for holding a chip of semi-conductor package, semi-conduc...

Fabrication process of semiconductor package and semiconductor package

Fabrication process of wiring board

Fabrication process of wiring board

Fabrication process of wiring board

Process for producing high-density wiring board

Patents Applicationslast 30 patents

SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING...

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package