Yuchun Wang

Person

Naperville, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Feedback of layer thickness timing and clearance timing for polishi...
- Patent number 9,496,190
- Issue date Nov 15, 2016
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback control of polishing using optical detection of clearance
- Patent number 9,073,169
- Issue date Jul 7, 2015
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
GST film thickness monitoring
- Patent number 8,989,890
- Issue date Mar 24, 2015
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Metrology for GST film thickness and phase
- Patent number 8,639,377
- Issue date Jan 28, 2014
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical planarization of copper wafer polishing
- Patent number 8,586,481
- Issue date Nov 19, 2013
- Applied Materials, Inc.
- You Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Closed loop control of pad profile based on metrology feedback
- Patent number 8,221,193
- Issue date Jul 17, 2012
- Applied Materials, Inc.
- Shou-Sung Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Dishing and defect control of chemical mechanical polishing using r...
- Patent number 8,210,900
- Issue date Jul 3, 2012
- Applied Materials, Inc.
- Wen-Chiang Tu
- B24 - GRINDING POLISHING
Information Patent Grant
Extended pad life for ECMP and barrier removal
- Patent number 8,012,000
- Issue date Sep 6, 2011
- Applied Materials, Inc.
- Yuchun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pad with ion exchange membrane for electrochemical mecha...
- Patent number 7,344,432
- Issue date Mar 18, 2008
- Applied Materials, Inc.
- Liang-Yun Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,311,592
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,137,879
- Issue date Nov 21, 2006
- Applied Materials, Inc.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,066,800
- Issue date Jun 27, 2006
- Applied Materials Inc.
- Liang-Yuh Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 6,988,942
- Issue date Jan 24, 2006
- Applied Materials Inc.
- Liang-Yuh Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Endpoint detection for non-transparent polishing member
- Patent number 6,942,546
- Issue date Sep 13, 2005
- ASM NuTool, Inc.
- Mukesh Desai
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and methods using a flexibl...
- Patent number 6,926,589
- Issue date Aug 9, 2005
- ASM NuTool, Inc.
- Douglas W. Young
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing endpoint detection
- Patent number 6,908,374
- Issue date Jun 21, 2005
- Nutool, Inc.
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Electrolyte composition and treatment for electrolytic chemical mec...
- Patent number 6,899,804
- Issue date May 31, 2005
- Applied Materials, Inc.
- Alain Duboust
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical mechanical polishing composition and process
- Patent number 6,872,329
- Issue date Mar 29, 2005
- Applied Materials, Inc.
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Advanced chemical mechanical polishing system with smart endpoint d...
- Patent number 6,857,947
- Issue date Feb 22, 2005
- ASM-Nutool, Inc.
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Additives for pressure sensitive polishing compositions
- Patent number 6,783,432
- Issue date Aug 31, 2004
- Applied Materials Inc.
- Jui-Lung Li
- B24 - GRINDING POLISHING
Information Patent Grant
In situ measurement of slurry distribution
- Patent number 6,657,726
- Issue date Dec 2, 2003
- Applied Materials, Inc.
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Ion exchange materials for chemical mechanical polishing
- Patent number 6,638,143
- Issue date Oct 28, 2003
- Applied Materials, Inc.
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-fluid polishing process
- Patent number 6,572,453
- Issue date Jun 3, 2003
- Applied Materials, Inc.
- Kapila Wijekoon
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Additives to CMP slurry to polish dielectric films
- Patent number 6,569,349
- Issue date May 27, 2003
- Applied Materials Inc.
- Yuchun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for enhanced CMP using metals having reductive...
- Patent number 6,561,873
- Issue date May 13, 2003
- Applied Materials, Inc.
- Stan D. Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for enhanced CMP using metals having reductive...
- Patent number 6,537,144
- Issue date Mar 25, 2003
- Applied Materials, Inc.
- Stan D. Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
CMP slurry for planarizing metals
- Patent number 6,520,840
- Issue date Feb 18, 2003
- Applied Materials, Inc.
- Yuchun Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
CMP slurry for planarizing metals
- Patent number 6,435,944
- Issue date Aug 20, 2002
- Applied Materials, Inc.
- Yuchun Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
FEEDBACK OF LAYER THICKNESS TIMING AND CLEARANCE TIMING FOR POLISHI...
- Publication number 20150194356
- Publication date Jul 9, 2015
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY FOR COBALT APPLICATIONS
- Publication number 20130186850
- Publication date Jul 25, 2013
- APPLIED MATERIALS, INC.
- You Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Feedback Control of Polishing Using Optical Detection of Clearance
- Publication number 20120064801
- Publication date Mar 15, 2012
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL PLANARIZATION OF COPPER WAFER POLISHING
- Publication number 20110294293
- Publication date Dec 1, 2011
- Applied Materials, Inc.
- You Wang
- B24 - GRINDING POLISHING
Information Patent Application
High Sensitivity Real Time Profile Control Eddy Current Monitoring...
- Publication number 20110189856
- Publication date Aug 4, 2011
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
High Sensitivity Real Time Profile Control Eddy Current Monitoring...
- Publication number 20110189925
- Publication date Aug 4, 2011
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Application
GST Film Thickness Monitoring
- Publication number 20100185314
- Publication date Jul 22, 2010
- APPLIED MATERIALS, INC.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION FOR GST PHASE CHANGE MEMORY MATERIALS POLISHING
- Publication number 20100130013
- Publication date May 27, 2010
- Applied Materials, Inc.
- Feng Q. Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TWO-LINE MIXING OF CHEMICAL AND ABRASIVE PARTICLES WITH ENDPOINT CO...
- Publication number 20100130101
- Publication date May 27, 2010
- APPLIED MATERIALS, INC.
- YUCHUN WANG
- B24 - GRINDING POLISHING
Information Patent Application
METROLOGY FOR GST FILM THICKNESS AND PHASE
- Publication number 20100116990
- Publication date May 13, 2010
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
DISHING AND DEFECT CONTROL OF CHEMICAL MECHANICAL POLISHING USING R...
- Publication number 20100112903
- Publication date May 6, 2010
- WEN-CHIANG TU
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING
- Publication number 20100096360
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- You Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CLOSED LOOP CONTROL OF PAD PROFILE BASED ON METROLOGY FEEDBACK
- Publication number 20100035518
- Publication date Feb 11, 2010
- Shou-Sung Chang
- B24 - GRINDING POLISHING
Information Patent Application
PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING
- Publication number 20080293343
- Publication date Nov 27, 2008
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Application
EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL
- Publication number 20080242202
- Publication date Oct 2, 2008
- Yuchun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING T...
- Publication number 20070218587
- Publication date Sep 20, 2007
- APPLIED MATERIALS, INC.
- Yuchun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHA...
- Publication number 20070099552
- Publication date May 3, 2007
- APPLIED MATERIALS, INC.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Application
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20070066201
- Publication date Mar 22, 2007
- APPLIED MATERIALS, INC.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Application
Conductive polishing article for electrochemical mechanical polishing
- Publication number 20060172671
- Publication date Aug 3, 2006
- APPLIED MATERIALS, INC.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Application
Conductive polishing article for electrochemical mechanical polishing
- Publication number 20040266327
- Publication date Dec 30, 2004
- Liang-Yuh Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced chemical mechanical polishing system with smart endpoint d...
- Publication number 20040023606
- Publication date Feb 5, 2004
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for integrated chemical mechanical polishing o...
- Publication number 20040023607
- Publication date Feb 5, 2004
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Application
Selective barrier removal slurry
- Publication number 20040014399
- Publication date Jan 22, 2004
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus and methods using a flexibl...
- Publication number 20030181143
- Publication date Sep 25, 2003
- Douglas W. Young
- B24 - GRINDING POLISHING
Information Patent Application
In-situ endpoint detect for non-transparent polishing member
- Publication number 20030153246
- Publication date Aug 14, 2003
- Mukesh Desai
- B24 - GRINDING POLISHING
Information Patent Application
Electrolyte composition and treatment for electrolytic chemical mec...
- Publication number 20030116446
- Publication date Jun 26, 2003
- Alain Duboust
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Additives for pressure sensitive polishing compositions
- Publication number 20020182982
- Publication date Dec 5, 2002
- APPLIED MATERIALS, INC.
- Jui-Lung Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical mechanical polishing endpoint detection
- Publication number 20020173225
- Publication date Nov 21, 2002
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Application
Conductive polishing article for electrochemical mechanical polishing
- Publication number 20020119286
- Publication date Aug 29, 2002
- Liang-Yuh Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method and apparatus for enhanced CMP using metals having reductive...
- Publication number 20020098779
- Publication date Jul 25, 2002
- APPLIED MATERIALS, INC.
- Stan D. Tsai
- B24 - GRINDING POLISHING

Yuchun Wang

Person

Patents Grantslast 30 patents

Feedback of layer thickness timing and clearance timing for polishi...

Feedback control of polishing using optical detection of clearance

GST film thickness monitoring

Metrology for GST film thickness and phase

Chemical planarization of copper wafer polishing

Closed loop control of pad profile based on metrology feedback

Dishing and defect control of chemical mechanical polishing using r...

Extended pad life for ECMP and barrier removal

Conductive pad with ion exchange membrane for electrochemical mecha...

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Endpoint detection for non-transparent polishing member

Chemical mechanical polishing apparatus and methods using a flexibl...

Chemical mechanical polishing endpoint detection

Electrolyte composition and treatment for electrolytic chemical mec...

Chemical mechanical polishing composition and process

Advanced chemical mechanical polishing system with smart endpoint d...

Additives for pressure sensitive polishing compositions

In situ measurement of slurry distribution

Ion exchange materials for chemical mechanical polishing

Multi-fluid polishing process

Additives to CMP slurry to polish dielectric films

Method and apparatus for enhanced CMP using metals having reductive...

Method and apparatus for enhanced CMP using metals having reductive...

CMP slurry for planarizing metals

CMP slurry for planarizing metals

Patents Applicationslast 30 patents

FEEDBACK OF LAYER THICKNESS TIMING AND CLEARANCE TIMING FOR POLISHI...

SLURRY FOR COBALT APPLICATIONS

Feedback Control of Polishing Using Optical Detection of Clearance

CHEMICAL PLANARIZATION OF COPPER WAFER POLISHING

High Sensitivity Real Time Profile Control Eddy Current Monitoring...

High Sensitivity Real Time Profile Control Eddy Current Monitoring...

GST Film Thickness Monitoring

SLURRY COMPOSITION FOR GST PHASE CHANGE MEMORY MATERIALS POLISHING

TWO-LINE MIXING OF CHEMICAL AND ABRASIVE PARTICLES WITH ENDPOINT CO...

METROLOGY FOR GST FILM THICKNESS AND PHASE

DISHING AND DEFECT CONTROL OF CHEMICAL MECHANICAL POLISHING USING R...

COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING

CLOSED LOOP CONTROL OF PAD PROFILE BASED ON METROLOGY FEEDBACK

PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING

EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL

SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING T...

CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHA...

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Advanced chemical mechanical polishing system with smart endpoint d...

Method and apparatus for integrated chemical mechanical polishing o...

Selective barrier removal slurry

Chemical mechanical polishing apparatus and methods using a flexibl...

In-situ endpoint detect for non-transparent polishing member

Electrolyte composition and treatment for electrolytic chemical mec...

Additives for pressure sensitive polishing compositions

Chemical mechanical polishing endpoint detection

Conductive polishing article for electrochemical mechanical polishing

Method and apparatus for enhanced CMP using metals having reductive...