Yukinobu Mikado

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,277,923
- Issue date Mar 15, 2022
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 10,143,092
- Issue date Nov 27, 2018
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,883,592
- Issue date Jan 30, 2018
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,831,163
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,439,289
- Issue date Sep 6, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,332,657
- Issue date May 3, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,320,148
- Issue date Apr 19, 2016
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,232,656
- Issue date Jan 5, 2016
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,215,805
- Issue date Dec 15, 2015
- Ibiden Co., Ltd.
- Masahiro Zanma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,204,552
- Issue date Dec 1, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,119,322
- Issue date Aug 25, 2015
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming cavity, apparatus for forming cavity, method for...
- Patent number 9,044,830
- Issue date Jun 2, 2015
- Ibiden Co., Ltd.
- Yukinobu Mikado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 9,027,238
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayered circuit board
- Patent number 8,973,259
- Issue date Mar 10, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,957,320
- Issue date Feb 17, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,912,451
- Issue date Dec 16, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,908,387
- Issue date Dec 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,891,245
- Issue date Nov 18, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,829,357
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 8,785,788
- Issue date Jul 22, 2014
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,705,248
- Issue date Apr 22, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,693,209
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,692,132
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for a printed wiring board
- Patent number 8,621,748
- Issue date Jan 7, 2014
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,481,424
- Issue date Jul 9, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,320,135
- Issue date Nov 27, 2012
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,212,363
- Issue date Jul 3, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a multilayer printed wiring board having a bulged...
- Patent number 8,181,341
- Issue date May 22, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board with concave portion for accomodating elect...
- Patent number 8,168,893
- Issue date May 1, 2012
- Ibiden, Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,101,868
- Issue date Jan 24, 2012
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210176870
- Publication date Jun 10, 2021
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190104615
- Publication date Apr 4, 2019
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160268189
- Publication date Sep 15, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160242293
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150382471
- Publication date Dec 31, 2015
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150022982
- Publication date Jan 22, 2015
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CAVITY, APPARATUS FOR FORMING CAVITY, METHOD FOR...
- Publication number 20140182917
- Publication date Jul 3, 2014
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140153205
- Publication date Jun 5, 2014
- IBIDEN CO., LTD.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20130284506
- Publication date Oct 31, 2013
- IBIDEN CO., LTD.
- Masahiro ZANMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20130256007
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130192884
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130194764
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130192883
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130182401
- Publication date Jul 18, 2013
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130081866
- Publication date Apr 4, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20130081870
- Publication date Apr 4, 2013
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20130033837
- Publication date Feb 7, 2013
- Sotaro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120287586
- Publication date Nov 15, 2012
- IBIDEN CO., LTD.
- Yukinobu Mikado
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20120250277
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20120186861
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120186866
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120188734
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120106108
- Publication date May 3, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120077317
- Publication date Mar 29, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120006587
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120005889
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20110314668
- Publication date Dec 29, 2011
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20110240354
- Publication date Oct 6, 2011
- IBIDEN CO., LTD.
- Naoki FURUHATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20110176284
- Publication date Jul 21, 2011
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20100252318
- Publication date Oct 7, 2010
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yukinobu Mikado

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing printed wiring board

Circuit substrate and method for manufacturing the same

Wiring board and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Wiring board and method for manufacturing the same

Multilayer printed wiring board and method for manufacturing multil...

Printed wiring board

Wiring board and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Printed wiring board

Wiring board and method for manufacturing the same

Method for forming cavity, apparatus for forming cavity, method for...

Multilayered printed circuit board and method for manufacturing the...

Method for manufacturing a multilayered circuit board

Printed wiring board

Multilayered printed circuit board and method for manufacturing the...

Wiring board and method for manufacturing the same

Printed wiring board

Wiring board and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Multilayer printed circuit board

Wiring board and method for manufacturing the same

Multilayered printed circuit board and method for manufacturing the...

Manufacturing method for a printed wiring board

Multilayer printed wiring board

Multilayer printed circuit board

Multilayer printed wiring board

Method of forming a multilayer printed wiring board having a bulged...

Multilayer wiring board with concave portion for accomodating elect...

Multilayered printed circuit board and method for manufacturing the...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING CAVITY, APPARATUS FOR FORMING CAVITY, METHOD FOR...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYER PRINTED WIRING BOARD

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

MULTILAYER PRINTED WIRING BOARD