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Yun Li
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Boca Raton, FL, US
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Patents Grants
last 30 patents
Information
Patent Grant
Open-cavity semiconductor die package
Patent number
6,709,891
Issue date
Mar 23, 2004
Silicon Bandwidth Inc.
Sanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Open-cavity semiconductor die package
Patent number
6,475,832
Issue date
Nov 5, 2002
Silicon Bandwidth, Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module having interconnect dies
Patent number
6,421,254
Issue date
Jul 16, 2002
Silicon Bandwidth Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Open-cavity semiconductor die package
Patent number
6,307,258
Issue date
Oct 23, 2001
Silicon Bandwidth, Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module having interconnect dies
Patent number
6,266,246
Issue date
Jul 24, 2001
Silicon Bandwidth, Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module having interconnect dies
Patent number
6,016,256
Issue date
Jan 18, 2000
The Panda Project
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Open-cavity semiconductor die package
Publication number
20030003626
Publication date
Jan 2, 2003
Silicon Bandwidth, Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip module having interconnect dies
Publication number
20020176238
Publication date
Nov 28, 2002
The Panda Project, Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Open-cavity semiconductor die package
Publication number
20020008308
Publication date
Jan 24, 2002
Silicon Bandwidth, Inc.
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip module having interconnect dies
Publication number
20010040792
Publication date
Nov 15, 2001
The Panda Project
Stanford W. Crane
H01 - BASIC ELECTRIC ELEMENTS