Yun Ling

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device, system and method to promote the integrity of signal commun...
- Patent number 11,153,968
- Issue date Oct 19, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder resist layer structures for terminating de-featured componen...
- Patent number 10,658,198
- Issue date May 19, 2020
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder resist layer structures for terminating de-featured componen...
- Patent number 10,244,632
- Issue date Mar 26, 2019
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pogo-pins for high speed signaling
- Patent number 9,812,804
- Issue date Nov 7, 2017
- Intel Corporation
- Hao-Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention mechanism for shielded flex cable to improve EMI/RFI for...
- Patent number 9,755,334
- Issue date Sep 5, 2017
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having a signal layer with signal traces and a refere...
- Patent number 9,596,749
- Issue date Mar 14, 2017
- Intel Corporation
- Kuan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing crosstalk in a data transfer device
- Patent number 9,462,677
- Issue date Oct 4, 2016
- Intel Corporation
- Yun Ling
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High bandwidth connector for internal and external IO interfaces
- Patent number 9,391,378
- Issue date Jul 12, 2016
- Intel Corporation
- Michael Leddige
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Shielding a connector to reduce interference
- Patent number 9,318,850
- Issue date Apr 19, 2016
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Innovative cable termination scheme
- Patent number 8,292,655
- Issue date Oct 23, 2012
- Intel Corporation
- Yun Ling
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-axis retention mechanism
- Patent number 7,909,627
- Issue date Mar 22, 2011
- Intel Corporation
- Brent A. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance edge connector
- Patent number 7,316,570
- Issue date Jan 8, 2008
- Intel Corporation
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Add-in card to backplane connecting apparatus
- Patent number 7,040,934
- Issue date May 9, 2006
- Intel Corporation
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated add-in card retention mechanism
- Patent number 7,033,197
- Issue date Apr 25, 2006
- Intel Corporation
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an improved card-edge connector
- Patent number 7,029,307
- Issue date Apr 18, 2006
- Intel Corporation
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic card with edge connector to minimize wear
- Patent number 6,914,189
- Issue date Jul 5, 2005
- Intel Corporation
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Add-in card edge-finger design/stackup to optimize connector perfor...
- Patent number 6,710,266
- Issue date Mar 23, 2004
- Intel Corporation
- Jason A. Mix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost high speed board-to-board coaxial connector design with co...
- Patent number 6,700,464
- Issue date Mar 2, 2004
- Intel Corporation
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power connector for high current, low inductance applications
- Patent number 6,575,774
- Issue date Jun 10, 2003
- Intel Corporation
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...
- Publication number 20190181017
- Publication date Jun 13, 2019
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE, SYSTEM AND METHOD TO PROMOTE THE INTEGRITY OF SIGNAL COMMUN...
- Publication number 20190045625
- Publication date Feb 7, 2019
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SODIMM CONNECTOR SHIELD TO REDUCE RADIO FREQUENCY INTERFERENCE (RFI)
- Publication number 20190044289
- Publication date Feb 7, 2019
- Intel Corporation
- XIANG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...
- Publication number 20180255640
- Publication date Sep 6, 2018
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETENTION MECHANISM FOR SHIELDED FLEX CABLE TO IMPROVE EMI/RFI FOR...
- Publication number 20160380370
- Publication date Dec 29, 2016
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING
- Publication number 20160174361
- Publication date Jun 16, 2016
- Intel Corporation
- Kuan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNALING LINK GROUNDING
- Publication number 20160087376
- Publication date Mar 24, 2016
- Intel Corporation
- CHUNG-HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding A Connector To Reduce Interference
- Publication number 20150340817
- Publication date Nov 26, 2015
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pogo-Pins for High Speed Signaling
- Publication number 20150280343
- Publication date Oct 1, 2015
- Hao-Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZING CROSSTALK IN A DATA TRANSFER DEVICE
- Publication number 20150223321
- Publication date Aug 6, 2015
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY CONNECTOR FOR TWO SODIMM PER CHANNEL CONFIGURATION
- Publication number 20150171535
- Publication date Jun 18, 2015
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH CONNECTOR FOR INTERNAL AND EXTERNAL IO INTERFACES
- Publication number 20140377968
- Publication date Dec 25, 2014
- Michael Leddige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNOVATIVE CABLE TERMINATION SCHEME
- Publication number 20120252266
- Publication date Oct 4, 2012
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED CONNECTOR AND RECEPTACLE WITH BACKWARD COMPATIBILITY TO...
- Publication number 20090088024
- Publication date Apr 2, 2009
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked connectors for high density external cable connections
- Publication number 20070232132
- Publication date Oct 4, 2007
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance edge connector
- Publication number 20070128891
- Publication date Jun 7, 2007
- Intel Corporation
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High speed shielded internal cable/connector
- Publication number 20050142944
- Publication date Jun 30, 2005
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-axis retention mechanism
- Publication number 20050085113
- Publication date Apr 21, 2005
- Brent A. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retention mechanism for high mass add-in cards
- Publication number 20040190268
- Publication date Sep 30, 2004
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Add-in card to backplane connecting apparatus
- Publication number 20040121655
- Publication date Jun 24, 2004
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated add-in card retention mechanism
- Publication number 20040121644
- Publication date Jun 24, 2004
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADD-IN CARD EDGE-FINGER DESIGN/STACKUP TO OPTIMIZE CONNECTOR PERFOR...
- Publication number 20040016569
- Publication date Jan 29, 2004
- Jason A. Mix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low cost high speed board-to-board coaxial connector design with co...
- Publication number 20030155989
- Publication date Aug 21, 2003
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel lever design that combines module insertion, retention, eject...
- Publication number 20030137811
- Publication date Jul 24, 2003
- Yun Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power connector for high current, low inductance applications
- Publication number 20020192989
- Publication date Dec 19, 2002
- Yun Ling
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Device, system and method to promote the integrity of signal commun...

Solder resist layer structures for terminating de-featured componen...

Solder resist layer structures for terminating de-featured componen...

Pogo-pins for high speed signaling

Retention mechanism for shielded flex cable to improve EMI/RFI for...

Circuit board having a signal layer with signal traces and a refere...

Minimizing crosstalk in a data transfer device

High bandwidth connector for internal and external IO interfaces

Shielding a connector to reduce interference

Innovative cable termination scheme

Multi-axis retention mechanism

High performance edge connector

Add-in card to backplane connecting apparatus

Integrated add-in card retention mechanism

Systems and methods for an improved card-edge connector

Electronic card with edge connector to minimize wear

Add-in card edge-finger design/stackup to optimize connector perfor...

Low cost high speed board-to-board coaxial connector design with co...

Power connector for high current, low inductance applications

Patents Applicationslast 30 patents

SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...

DEVICE, SYSTEM AND METHOD TO PROMOTE THE INTEGRITY OF SIGNAL COMMUN...

SODIMM CONNECTOR SHIELD TO REDUCE RADIO FREQUENCY INTERFERENCE (RFI)

SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...

RETENTION MECHANISM FOR SHIELDED FLEX CABLE TO IMPROVE EMI/RFI FOR...

SIGNAL ROUTING

SIGNALING LINK GROUNDING

Shielding A Connector To Reduce Interference

Pogo-Pins for High Speed Signaling

MINIMIZING CROSSTALK IN A DATA TRANSFER DEVICE

MEMORY CONNECTOR FOR TWO SODIMM PER CHANNEL CONFIGURATION

HIGH BANDWIDTH CONNECTOR FOR INTERNAL AND EXTERNAL IO INTERFACES

INNOVATIVE CABLE TERMINATION SCHEME

HIGH SPEED CONNECTOR AND RECEPTACLE WITH BACKWARD COMPATIBILITY TO...

Stacked connectors for high density external cable connections

High performance edge connector

High speed shielded internal cable/connector

Multi-axis retention mechanism

Retention mechanism for high mass add-in cards

Add-in card to backplane connecting apparatus

Integrated add-in card retention mechanism

ADD-IN CARD EDGE-FINGER DESIGN/STACKUP TO OPTIMIZE CONNECTOR PERFOR...

Low cost high speed board-to-board coaxial connector design with co...

Novel lever design that combines module insertion, retention, eject...

Power connector for high current, low inductance applications