Zhaowei Jia

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 11,967,497
- Issue date Apr 23, 2024
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,911,808
- Issue date Feb 27, 2024
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Plating apparatus
- Patent number 11,859,303
- Issue date Jan 2, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,848,217
- Issue date Dec 19, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafers
- Patent number 11,752,529
- Issue date Sep 12, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,638,937
- Issue date May 2, 2023
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,633,765
- Issue date Apr 25, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Methods and system for cleaning semiconductor wafers
- Patent number 11,581,205
- Issue date Feb 14, 2023
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Plating chuck
- Patent number 11,469,134
- Issue date Oct 11, 2022
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 11,257,667
- Issue date Feb 22, 2022
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,141,762
- Issue date Oct 12, 2021
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,103,898
- Issue date Aug 31, 2021
- ACM Research, Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,037,804
- Issue date Jun 15, 2021
- ACM Research, Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for holding a substrate
- Patent number 11,008,669
- Issue date May 18, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and system for cleaning semiconductor wafers
- Patent number 10,910,244
- Issue date Feb 2, 2021
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Method for removing barrier layer for minimizing sidewall recess
- Patent number 10,615,073
- Issue date Apr 7, 2020
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer removal method and semiconductor structure forming me...
- Patent number 10,453,743
- Issue date Oct 22, 2019
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing interconnection structure for minimizing barr...
- Patent number 10,217,662
- Issue date Feb 26, 2019
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 10,020,208
- Issue date Jul 10, 2018
- ACM Research (Shanghai) Inc.
- Jian Wang
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 9,633,833
- Issue date Apr 25, 2017
- ACM Research (Shanghai) Inc.
- Jian Wang
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 9,595,457
- Issue date Mar 14, 2017
- ACM Research (Shanghai) Inc.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnection structures
- Patent number 9,496,172
- Issue date Nov 15, 2016
- ACM Research (Shanghai) Inc.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 9,492,852
- Issue date Nov 15, 2016
- ACM Research (Shanghai) Inc.
- Jian Wang
- B08 - CLEANING
Information Patent Grant
Barrier layer removal method and apparatus
- Patent number 8,598,039
- Issue date Dec 3, 2013
- ACM Research (Shanghai) Inc.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240376625
- Publication date Nov 14, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Meng Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS
- Publication number 20240376627
- Publication date Nov 14, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR...
- Publication number 20240218551
- Publication date Jul 4, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240044038
- Publication date Feb 8, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...
- Publication number 20240035189
- Publication date Feb 1, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240026561
- Publication date Jan 25, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20230256480
- Publication date Aug 17, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20220139697
- Publication date May 5, 2022
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20220032344
- Publication date Feb 3, 2022
- Hui WANG
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20220037172
- Publication date Feb 3, 2022
- ACM Research (Shanghai) Inc.
- Hui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20210402444
- Publication date Dec 30, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20210301416
- Publication date Sep 30, 2021
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20210125848
- Publication date Apr 29, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Application
PLATING CHUCK
- Publication number 20210066106
- Publication date Mar 4, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20200354851
- Publication date Nov 12, 2020
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20200335325
- Publication date Oct 22, 2020
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Application
BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...
- Publication number 20190393074
- Publication date Dec 26, 2019
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20190283090
- Publication date Sep 19, 2019
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20190287824
- Publication date Sep 19, 2019
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HOLDING A SUBSTRATE
- Publication number 20180320285
- Publication date Nov 8, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PROCESSING INTERCONNECTION STRUCTURE FOR MINIMIZING BARR...
- Publication number 20180240701
- Publication date Aug 23, 2018
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180151398
- Publication date May 31, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180071794
- Publication date Mar 15, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHOD FOR REMOVING BARRIER LAYER FOR MINIMIZING SIDEWALL RECESS
- Publication number 20180025940
- Publication date Jan 25, 2018
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...
- Publication number 20170221753
- Publication date Aug 3, 2017
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20170140952
- Publication date May 18, 2017
- ACM Research (Shanghai) Inc.
- Jian Wang
- B08 - CLEANING
Information Patent Application
Methods and Apparatus for Cleaning Semiconductor Wafers
- Publication number 20170032959
- Publication date Feb 2, 2017
- ACM Research (Shanghai) Inc.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECTION STRUCTURES
- Publication number 20150318205
- Publication date Nov 5, 2015
- ACM Research (Shanghai) Inc.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Layer Removal Method and Apparatus
- Publication number 20140053978
- Publication date Feb 27, 2014
- ACM Research (Shanghai) Inc.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS

Zhaowei Jia

Person

Patents Grantslast 30 patents

Methods and apparatus for cleaning semiconductor wafers

Electroplating apparatus and electroplating method

System for cleaning semiconductor wafers

Plating apparatus

Methods and apparatus for cleaning substrates

Method for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

System for cleaning semiconductor wafers

Methods and system for cleaning semiconductor wafers

Plating chuck

Methods and apparatus for cleaning semiconductor wafers

System for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

Methods and apparatus for cleaning substrates

Apparatus for holding a substrate

Methods and system for cleaning semiconductor wafers

Method for removing barrier layer for minimizing sidewall recess

Barrier layer removal method and semiconductor structure forming me...

Method for processing interconnection structure for minimizing barr...

Methods and apparatus for cleaning semiconductor wafers

Methods and apparatus for cleaning semiconductor wafers

Methods and apparatus for cleaning semiconductor wafers

Method for forming interconnection structures

Methods and apparatus for cleaning semiconductor wafers

Barrier layer removal method and apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD

ELECTROPLATING APPARATUS

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...

PLATING APPARATUS AND PLATING METHOD

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHODS AND SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

PLATING CHUCK

PLATING APPARATUS

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

APPARATUS FOR HOLDING A SUBSTRATE

METHOD FOR PROCESSING INTERCONNECTION STRUCTURE FOR MINIMIZING BARR...

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHOD FOR REMOVING BARRIER LAYER FOR MINIMIZING SIDEWALL RECESS

BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

Methods and Apparatus for Cleaning Semiconductor Wafers

METHOD FOR FORMING INTERCONNECTION STRUCTURES

Barrier Layer Removal Method and Apparatus