Zhineng Fan

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low inductance electrical contacts and LGA connector system
- Patent number 6,846,184
- Issue date Jan 25, 2005
- High Connection Density Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-reliability interposer for low cost and high reliability appli...
- Patent number 6,723,927
- Issue date Apr 20, 2004
- High Connection Density, Inc.
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test and burn-in connector
- Patent number 6,722,893
- Issue date Apr 20, 2004
- High Connection Density, Inc.
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Thermally enhanced interposer and method
- Patent number 6,712,621
- Issue date Mar 30, 2004
- High Connection Density, Inc.
- Che-Yu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial elastomeric connector system
- Patent number 6,712,620
- Issue date Mar 30, 2004
- High Connection Density, Inc.
- Che-Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable memory module with variable bandwidth
- Patent number 6,705,877
- Issue date Mar 16, 2004
- High Connection Density, Inc.
- Che-yu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount attachable land grid array connector and method of fo...
- Patent number 6,663,399
- Issue date Dec 16, 2003
- High Connection Density, Inc.
- Hassan O. Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded carrier with components for land grid array connectors
- Patent number 6,638,077
- Issue date Oct 28, 2003
- High Connection Density, Inc.
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact stacked electronic package
- Patent number 6,590,159
- Issue date Jul 8, 2003
- High Connection Density, Inc.
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test and burn-in connector
- Patent number 6,551,112
- Issue date Apr 22, 2003
- High Connection Density, Inc.
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a contact member cable
- Patent number 6,546,625
- Issue date Apr 15, 2003
- High Connection Density, Inc.
- Ai D. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded carrier for land grid array connectors and a process for f...
- Patent number 6,471,525
- Issue date Oct 29, 2002
- High Connection Density, Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, high density memory system
- Patent number 6,381,164
- Issue date Apr 30, 2002
- High Connection Density, Inc.
- Zhineng Fan
- G11 - INFORMATION STORAGE
Information Patent Grant
Carrier for land grid array connectors
- Patent number 6,370,770
- Issue date Apr 16, 2002
- High Connection Density, Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for land grid array connectors
- Patent number 6,312,266
- Issue date Nov 6, 2001
- High Connection Density, Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW INDUCTANCE ELECTRICAL CONTACTS AND LGA CONNECTOR SYSTEM
- Publication number 20040147140
- Publication date Jul 29, 2004
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a coaxial electrical contact
- Publication number 20040049914
- Publication date Mar 18, 2004
- Shengjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL ELASTOMERIC CONNECTOR SYSTEM
- Publication number 20040053519
- Publication date Mar 18, 2004
- Che-Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test and burn-in connector
- Publication number 20030176083
- Publication date Sep 18, 2003
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Application
HIGH CAPACITY MEMORY MODULE WITH BUILT-IN PERFORMANCE ENHANCING FEA...
- Publication number 20030156443
- Publication date Aug 21, 2003
- Sharon L. Moriarty
- G11 - INFORMATION STORAGE
Information Patent Application
A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH...
- Publication number 20030146017
- Publication date Aug 7, 2003
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally enhanced interposer and method
- Publication number 20030139071
- Publication date Jul 24, 2003
- Che-Yu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compact stacked electronic package
- Publication number 20020112871
- Publication date Aug 22, 2002
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount atttachable land grid array connector and method of f...
- Publication number 20020102869
- Publication date Aug 1, 2002
- Hassan O. Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded carrier for land grid array connectors and a process for f...
- Publication number 20020098721
- Publication date Jul 25, 2002
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS

Zhineng Fan

Person

Patents Grantslast 30 patents

Low inductance electrical contacts and LGA connector system

High-reliability interposer for low cost and high reliability appli...

Test and burn-in connector

Thermally enhanced interposer and method

Coaxial elastomeric connector system

Stackable memory module with variable bandwidth

Surface mount attachable land grid array connector and method of fo...

Shielded carrier with components for land grid array connectors

Compact stacked electronic package

Test and burn-in connector

Method of forming a contact member cable

Shielded carrier for land grid array connectors and a process for f...

Low profile, high density memory system

Carrier for land grid array connectors

Carrier for land grid array connectors

Patents Applicationslast 30 patents

LOW INDUCTANCE ELECTRICAL CONTACTS AND LGA CONNECTOR SYSTEM

Method for making a coaxial electrical contact

COAXIAL ELASTOMERIC CONNECTOR SYSTEM

Test and burn-in connector

HIGH CAPACITY MEMORY MODULE WITH BUILT-IN PERFORMANCE ENHANCING FEA...

A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH...

Thermally enhanced interposer and method

Compact stacked electronic package

Surface mount atttachable land grid array connector and method of f...

Shielded carrier for land grid array connectors and a process for f...