Claims
- 1. A surface mount attachable land grid array connector, comprising:
a) a substrate comprising at least one layer of dielectric material having a top surface and a bottom surface; b) a plurality of openings in said substrate, each of said openings positioned to accept a contact member; and c) a plurality of resilient contact members disposed in said plurality of openings, each having a first and second end, at least one of said first and second ends being semi-permanently attached to a contact pad on a first circuit member.
- 2. The surface mount attachable land grid array connector as recited in claim 1, wherein said substrate comprises at least one insulative material.
- 3. The surface mount attachable land grid array connector as recited in claim 2, wherein said at least one insulative material is epoxy-glass-based.
- 4. The surface mount attachable land grid array connector as recited in claim 3, wherein said at least one insulative material comprises FR4.
- 5. The surface mount attachable land grid array connector as recited in claim 2, wherein said at least one insulative material comprises polyimide.
- 6. The surface mount attachable land grid array connector as recited in claim 1, wherein said substrate further comprises a plurality of spacers located above said upper surface.
- 7. The surface mount attachable land grid array connector as recited in claim 6, wherein said spacers comprise at least one insulative material.
- 8. The surface mount attachable land grid array connector as recited in claim 1, wherein said substrate further comprises a plurality of spacers located below said bottom surface.
- 9. The surface mount attachable land grid array connector as recited in claim 8, wherein said spacers comprise at least one insulative material.
- 10. The surface mount attachable land grid array connector as recited in claim 1, wherein each of said plurality of openings is substantially cylindrical.
- 11. The surface mount attachable land grid array connector as recited in claim 1, wherein said substrate further comprises clamping means for field separable applications.
- 12. The surface mount attachable land grid array connector as recited in claim 11, wherein said substrate further comprises alignment means to align said substrate to said first circuit member.
- 13. The surface mount attachable land grid array connector as recited in claim 1, wherein said substrate further comprises retentive means in at least one of said plurality of openings to compress and retain at least a portion of a resilient contact member.
- 14. The surface mount attachable land grid array connector as recited in claim 1, further comprising reworkable conductive material attached to said at least one of said first and second ends.
- 15. The surface mount attachable land grid array connector as recited in claim 14, wherein said reworkable conductive material comprises s older.
- 16. The surface mount attachable land grid array connector as recited in claim 14, wherein said reworkable conductive material comprises conductive adhesive.
- 17. The surface mount attachable land grid array connector as recited in claim 14, wherein said at least one of said top and bottom surfaces of said substrate comprises a thin conductive ring around at least one of said openings in said substrate.
- 18. The surface mount attachable land grid array connector as recited in claim 17, wherein said at least one of said thin conductive rings is operatively connected to said at least one of said first and second ends by reworkable conductive material.
- 19. The surface mount attachable land grid array connector as recited in claim 1, wherein said at least one of said top and bottom surfaces of said substrate comprises a thin conductive pad covering one end of at least one of said openings in said substrate.
- 20. The surface mount attachable land grid array connector as recited in claim 19, wherein said thin conductive pad comprises a first and a second surface.
- 21. The surface mount attachable land grid array connector as recited in claim 20, further comprising reworkable conductive material for attaching said first surface of said at least one of said thin conductive pads to said at least one of said first and second ends of at least one of said plurality of resilient contact members.
- 22. The surface mount attachable land grid array connector as recited in claim 21, further comprising reworkable conductive material attached to said second surface of said at least one of said thin conductive pads.
- 23. The surface mount attachable land grid array connector as recited in claim 22, wherein said reworkable conductive material comprises solder.
- 24. The surface mount attachable land grid array connector as recited in claim 22, wherein said reworkable conductive material comprises conductive adhesive.
- 25. The surface mount attachable land grid array connector as recited in claim 1, further comprising an interposer and adhesive means located intermediate said interposer and said substrate.
- 26. The surface mount attachable land grid array connector as recited in claim 25, said interposer comprising:
i) at least one second dielectric layer having one major surface and at least one edge; ii) a plurality of conductive pads, each having a first and second surface, spaced apart on said major surface of said at least one second dielectric layer, said first surface of said conductive pads being plated with at least one layer of metal, and at least a portion of said second surface of said conductive pads being readily adaptable for connection to a conductive member; iii) a plurality of second openings with a non-uniform cross section, each one corresponding to and aligned with one of said conductive pads; and iv) reworkable conductive material located within each one of said second openings and in electrical contact with said portion of said second surface of said conductive pads.
- 27. The surface mount attachable land grid array connector as recited in claim 26, wherein said reworkable conductive material is solder.
- 28. The surface mount attachable land grid array connector as recited in claim 26, wherein said reworkable conductive material is conductive adhesive.
- 29. The surface mount attachable land grid array connector as recited in claim 1, wherein said at least one of said first and second ends is semi-permanently attached to a contact pad on a second circuit member.
- 30. The surface mount attachable land grid array connector as recited in claim 29, further comprising reworkable conductive material attached to said at least one of said first and second ends.
- 31. The surface mount attachable land grid array connector as recited in claim 30, wherein said reworkable conductive material comprises solder.
- 32. The surface mount attachable land grid array connector as recited in claim 31, wherein the composition of said solder on at least one of said first ends is different from that of said solder on at least one of said second ends.
- 33. The surface mount attachable land grid array connector as recited in claim 30, wherein said reworkable conductive material comprises conductive adhesive.
- 34. The surface mount attachable land grid array connector as recited in claim 29, wherein the coefficient of thermal expansion of said first circuit member is different from the coefficient of thermal expansion of said second circuit member.
- 35. A method of forming a surface mount attachable land grid array connector, said method comprising:
a) providing a land grid array connector, said connector comprising a plurality of contact members each with a first and second end; b) forming reworkable conductive material at one of said first or second ends of said plurality of said contact members; and c) forming reworkable conductive material at the other of said first or second ends of said plurality of said contact members.
- 36. The method according to claim 35, wherein said step (a) providing a land grid array connector comprises the substeps of:
i) providing a substrate comprising at least one dielectric layer and opening; and ii) providing one of said contact members in said at least one opening.
RELATED PATENT APPLICATIONS
[0001] This application is related to U.S. Pat. No. 6,264,476, issued to Li et al. for WIRE SEGMENT BASED INTERPOSER FOR HIGH FREQUENCY ELECTRICAL CONNECTION, which is based on application Ser. No. 09/457,776, filed Dec. 9, 1999; U.S. Pat. No. 6,312,266, issued to Fan et al. for CARRIER FOR LAND GRID ARRAY CONNECTORS, which is based on application Ser. No. 09/645,860, filed August 24, 2000; copending U.S. patent application Ser. No. 09/774,857, filed Jan. 31, 2001; and copending U.S. patent application Ser. No. 09/866,434, filed May 29, 2001, which is a non-provisional application based on provisional application Serial No. 60/227,689, filed Aug. 24, 2000; all of which are hereby incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60265468 |
Jan 2001 |
US |