12th Group

Industry

CPC
H01L2924/0542

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/054212th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,072,588
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Yoo Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display device
- Patent number 11,990,458
- Issue date May 21, 2024
- LG Display Co., Ltd.
- Jae Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material including crosslinker and multiple fillers
- Patent number 10,781,349
- Issue date Sep 22, 2020
- Honeywell International Inc.
- Liqiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-chip package with multiple thermal interface materials
- Patent number 10,580,717
- Issue date Mar 3, 2020
- Intel Corporation
- Boxi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,428,257
- Issue date Oct 1, 2019
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,155,894
- Issue date Dec 18, 2018
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including a reflective layer
- Patent number 10,062,660
- Issue date Aug 28, 2018
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-semiconductor contact structure with doped interlayer
- Patent number 10,049,925
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-semiconductor contact structure with doped interlayer
- Patent number 9,466,488
- Issue date Oct 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240369888
- Publication date Nov 7, 2024
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230209926
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Shinhyuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230122457
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Eui Kang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY DEVICE
- Publication number 20220320055
- Publication date Oct 6, 2022
- LG Display Co., Ltd.
- Jae Yong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL
- Publication number 20190085225
- Publication date Mar 21, 2019
- Honeywell International Inc.
- Bright Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL INTERFACE MATERIAL WITH ION SCAVENGER
- Publication number 20190048245
- Publication date Feb 14, 2019
- HONEYWELL INTERNATIONAL INC.
- Ya Qun Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
- Publication number 20180374776
- Publication date Dec 27, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME
- Publication number 20180158904
- Publication date Jun 7, 2018
- TSINGHUA UNIVERSITY
- YU-DAN ZHAO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME
- Publication number 20180158905
- Publication date Jun 7, 2018
- TSINGHUA UNIVERSITY
- YU-DAN ZHAO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING A REFLECTIVE LAYER
- Publication number 20170287867
- Publication date Oct 5, 2017
- Trillion Science, Inc.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...
- Publication number 20170158807
- Publication date Jun 8, 2017
- DIC CORPORATION
- Yasuyo YOSHIMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
- Publication number 20160141275
- Publication date May 19, 2016
- LITTELFUSE, INC.
- Richard J. Bono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-SEMICONDUCTOR CONTACT STRUCTURE WITH DOPED INTERLAYER
- Publication number 20150325484
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Light emitting diode display device

Semiconductor packaging structure and process

Thermal interface material including crosslinker and multiple fillers

Multiple-chip package with multiple thermal interface materials

Thermal interface material with ion scavenger

Composition for anisotropic conductive film, anisotropic conductive...

Thermal interface material with ion scavenger

Semiconductor packaging structure and process

Anisotropic conductive film including a reflective layer

Metal-semiconductor contact structure with doped interlayer

Metal-semiconductor contact structure with doped interlayer

Patents Applicationslast 30 patents

DISPLAY DEVICE

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

LIGHT EMITTING DIODE DISPLAY DEVICE

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

PHASE CHANGE MATERIAL

THERMAL INTERFACE MATERIAL WITH ION SCAVENGER

MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME

THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME

Semiconductor Packaging Structure and Process

ANISOTROPIC CONDUCTIVE FILM INCLUDING A REFLECTIVE LAYER

EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS

METAL-SEMICONDUCTOR CONTACT STRUCTURE WITH DOPED INTERLAYER