3D packaging

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CPC
B81B7/0074

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/00743D packaging

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems (MEMS) rectifier and storage element...
- Patent number 12,325,626
- Issue date Jun 10, 2025
- CHORUSVIEW, INC.
- Amit Lal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 12,322,667
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 12,266,610
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Yencheng Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and sensor
- Patent number 12,140,430
- Issue date Nov 12, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Ueda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional micro-electro-mechanical, microfluidic, and micro...
- Patent number 12,080,651
- Issue date Sep 3, 2024
- NIELSON SCIENTIFIC, LLC
- Gregory Nolan Nielson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Microelectromechanical systems (MEMS) rectifier and storage element...
- Patent number 11,858,807
- Issue date Jan 2, 2024
- X Development LLC
- Amit Lal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 11,746,003
- Issue date Sep 5, 2023
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated micro-electromechanical device of semiconductor material...
- Patent number 11,724,932
- Issue date Aug 15, 2023
- STMicroelectronics S.r.l.
- Alberto Pagani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attachment of stress sensitive integrated circuit dies
- Patent number 11,548,781
- Issue date Jan 10, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,444,032
- Issue date Sep 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yencheng Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,430,728
- Issue date Aug 30, 2022
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,319,208
- Issue date May 3, 2022
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 11,274,036
- Issue date Mar 15, 2022
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone with hybrid packaging structure
- Patent number 11,197,079
- Issue date Dec 7, 2021
- Jinghua Ye
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS cavity seal
- Patent number 11,174,151
- Issue date Nov 16, 2021
- Invensense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial measurement units
- Patent number 11,143,669
- Issue date Oct 12, 2021
- ATLANTIC INERTIAL SYSTEMS, LIMITED
- Kevin Townsend
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for supporting a MEMS component
- Patent number 10,988,374
- Issue date Apr 27, 2021
- MEAS Switzerland S.a.r.l.
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component and method for producing same
- Patent number 10,974,958
- Issue date Apr 13, 2021
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Felix Schiebel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with multiple compartments
- Patent number 10,843,918
- Issue date Nov 24, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal ring bonding structures
- Patent number 10,811,361
- Issue date Oct 20, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Lieneng Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress integrated device packages
- Patent number 10,800,651
- Issue date Oct 13, 2020
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 10,773,949
- Issue date Sep 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 10,611,629
- Issue date Apr 7, 2020
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MULTISENSOR MEMS INERTIAL SENSOR GUIDANCE FOR AUTOMATIC VEHICLES
- Publication number 20250224729
- Publication date Jul 10, 2025
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL MICRO-ELECTRO-MECHANICAL, MICROFLUIDIC, AND MICRO...
- Publication number 20250174566
- Publication date May 29, 2025
- Nielson Scientific, LLC
- Gregory Nolan Nielson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED SENSOR DEVICE
- Publication number 20250109011
- Publication date Apr 3, 2025
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND SENSING MODULE THEREOF
- Publication number 20250109972
- Publication date Apr 3, 2025
- LITE-ON SINGAPORE PTE. LTD.
- GUANG-LI SONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH RELIABILITY SENSOR
- Publication number 20250074765
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT...
- Publication number 20240166497
- Publication date May 23, 2024
- Amit Lal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP ASSEMBLY AND METHOD OF MAKING A CHIP ASSEMBLY
- Publication number 20230400788
- Publication date Dec 14, 2023
- NPL Management Limited
- Alastair SINCLAIR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE
- Publication number 20230345184
- Publication date Oct 26, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND SENSOR MODULE
- Publication number 20230257258
- Publication date Aug 17, 2023
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
- Publication number 20230235664
- Publication date Jul 27, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Remi Robutel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT...
- Publication number 20230138355
- Publication date May 4, 2023
- X Development LLC
- Amit Lal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment of Stress Sensitive Integrated Circuit Dies
- Publication number 20230126598
- Publication date Apr 27, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230005841
- Publication date Jan 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Yencheng KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE AND SENSOR
- Publication number 20220364864
- Publication date Nov 17, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Hideki UEDA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES
- Publication number 20220367339
- Publication date Nov 17, 2022
- GENERAL ELECTRIC COMPANY
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220219970
- Publication date Jul 14, 2022
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210407910
- Publication date Dec 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Yencheng KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE WITH HYBRID PACKAGING STRUCTURE
- Publication number 20210321184
- Publication date Oct 14, 2021
- Zilltek Technology (Shanghai) Corp.
- Jinghua YE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210047173
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210032096
- Publication date Feb 4, 2021
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL MICRO-ELECTRO-MECHANICAL, MICROFLUIDIC, AND MICRO...
- Publication number 20210020576
- Publication date Jan 21, 2021
- Nielson Scientific, LLC
- Gregory Nolan Nielson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20200385260
- Publication date Dec 10, 2020
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment of Stress Sensitive Integrated Circuit Dies
- Publication number 20200361764
- Publication date Nov 19, 2020
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY

3D packaging

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectromechanical systems (MEMS) rectifier and storage element...

Seal for microelectronic assembly

Semiconductor package device and method for manufacturing the same

Sensor device and sensor

Three-dimensional micro-electro-mechanical, microfluidic, and micro...

Sensing device and method for manufacturing sensing device

Multiple plated via arrays of different wire heights on a same subs...

Microelectromechanical systems (MEMS) rectifier and storage element...

Wafer level stacked structures having integrated passive features

Chip package

Integrated micro-electromechanical device of semiconductor material...

Attachment of stress sensitive integrated circuit dies

Semiconductor device

Semiconductor package device and method for manufacturing the same

Wafer level stacked structures having integrated passive features

Seal for microelectronic assembly

Chip package and manufacturing method thereof

Microelectromechanical device with signal routing through a protect...

Seal for microelectronic assembly

MEMS microphone with hybrid packaging structure

Integrated MEMS cavity seal

Inertial measurement units

Device for supporting a MEMS component

Micromechanical component and method for producing same

Semiconductor package with multiple compartments

Seal ring bonding structures

Low stress integrated device packages

Method of manufacturing an electronic device

Multiple plated via arrays of different wire heights on same substrate

Microelectromechanical device with signal routing through a protect...

Patents Applicationslast 30 patents

MULTISENSOR MEMS INERTIAL SENSOR GUIDANCE FOR AUTOMATIC VEHICLES

THREE-DIMENSIONAL MICRO-ELECTRO-MECHANICAL, MICROFLUIDIC, AND MICRO...

INTEGRATED SENSOR DEVICE

SENSOR PACKAGE AND SENSING MODULE THEREOF

HIGH RELIABILITY SENSOR

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT...

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

SEAL FOR MICROELECTRONIC ASSEMBLY

CHIP ASSEMBLY AND METHOD OF MAKING A CHIP ASSEMBLY

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

SEMICONDUCTOR DEVICE AND SENSOR MODULE

ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS

Semiconductor Device and Method of Making a MEMS Semiconductor Package

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT...

Attachment of Stress Sensitive Integrated Circuit Dies

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEAL FOR MICROELECTRONIC ASSEMBLY

SENSOR DEVICE AND SENSOR

WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

MEMS MICROPHONE WITH HYBRID PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL MICRO-ELECTRO-MECHANICAL, MICROFLUIDIC, AND MICRO...

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

Attachment of Stress Sensitive Integrated Circuit Dies