Ablation by means of a laser or focused ion beam [FIB]

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H01L2224/03632

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03632Ablation by means of a laser or focused ion beam [FIB]

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Patents Grantslast 30 patents

Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device architecture
- Patent number 11,387,050
- Issue date Jul 12, 2022
- OXFORD UNIVERSITY INNOVATION LIMITED
- Henry James Snaith
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Light-emitting device
- Patent number 11,114,596
- Issue date Sep 7, 2021
- Nichia Corporation
- Yoshikazu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,096,564
- Issue date Oct 9, 2018
- J-DEVICES CORPORATION
- Toshiyuki Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,508,689
- Issue date Nov 29, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,153,517
- Issue date Oct 6, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UBM etching methods for eliminating undercut
- Patent number 8,501,613
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer via structure
- Patent number 8,405,223
- Issue date Mar 26, 2013
- Princo Middle East FZE
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...
- Publication number 20240363562
- Publication date Oct 31, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240170420
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...
- Publication number 20220157750
- Publication date May 19, 2022
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093544
- Publication date Mar 24, 2022
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180082965
- Publication date Mar 22, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180076160
- Publication date Mar 15, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170317045
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20170117241
- Publication date Apr 27, 2017
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM Etching Methods for Eliminating Undercut
- Publication number 20130012014
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER VIA STRUCTURE
- Publication number 20120007254
- Publication date Jan 12, 2012
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ablation by means of a laser or focused ion beam [FIB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration and bonding of micro-devices into system substrate

Semiconductor structures with via openings and methods of making th...

Semiconductor device including bond pad with fixing parts fixed ont...

Device architecture

Light-emitting device

Integration and bonding of micro-devices into system substrate

Semiconductor method for forming semiconductor structure having bum...

Semiconductor structure having bump on tilting upper corner surface

Manufacturing method of semiconductor package

Electrical connector between die pad and z-interconnect for stacked...

Semiconductor device and method of forming patterned repassivation...

Electrical connector between die pad and z-interconnect for stacked...

Semiconductor device and method of forming patterned repassivation...

UBM etching methods for eliminating undercut

Multi-layer via structure

Patents Applicationslast 30 patents

Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...

SEMICONDUCTOR DEVICE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

Semiconductor Device and Method of Forming Patterned Repassivation...

UBM Etching Methods for Eliminating Undercut

Electrical Connector Between Die Pad and Z-Interconnect for Stacked...

MULTI-LAYER VIA STRUCTURE